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Electromagnetic interference shielding for device cooling 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-009/00
  • H05K-007/20
출원번호 UP-0890613 (2007-08-06)
등록번호 US-7764514 (2010-08-13)
우선권정보 IN-2630/DEL/2006(2006-12-08)
발명자 / 주소
  • Mongia, Rajiv K.
  • Bhattacharya, Anandaroop
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 4  인용 특허 : 39

초록

Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shiel

대표청구항

What is claimed is: 1. An apparatus, comprising: an electronic component capable of generating heat; an external wall; an electromagnetic interference (EMI) shield to be positioned between the external wall and the electronic component; and a louvered vent formed within the EMI shield, the louvered

이 특허에 인용된 특허 (39)

  1. Pokharna, Himanshu, Actuation membrane to reduce an ambient temperature of heat generating device.
  2. Hamadah Talal T. (Littleton MA) Ryder Douglas N. (Amherst NH) Friedman Harvey S. (Sudbury MA), Apparatus for controlled air-impingement module cooling.
  3. Jaggers Christopher Michael ; Mullen Cassius Joseph ; Grunow David William, Apparatus for providing docking station assisted cooling of a portable computer.
  4. Hae-woon Cho KR, Apparatus for shielding a plasma display panel.
  5. Baker,Bruce E.; Henry,Matthew S.; Jensen,David J.; Lewis,Seth D., Blower exhaust backflow damper.
  6. Hoffman, Mark S.; Drahms, David C., Circuit board cover with exhaust apertures for cooling electronic components.
  7. Schmitt Ty, Computer and a system and method for cooling the interior of the computer.
  8. Maehara Kenichi,JPX, Cooling structure of electronic appliance.
  9. Daikoku Takahiro (Ushiku JPX) Takagi Ryuichi (Tokyo JPX), Cooling system and method for electronic circuit devices.
  10. Masayuki Negishi JP, Dustproof structure of communication device, using air filter having distributed dust collecting efficiency and pressure loss.
  11. Lin, Yun Hsu; Yeh, Shang Tsang; Li, Wei; Li, XiaoWei, EMI-attenuating air ventilation panel.
  12. Boone,Earl Wayne; Johnson,William C.; Devenport,Earl J., Efficient airflow management.
  13. Kusamoto,Jyoji; Nakajima,Yuji, Electronic apparatus.
  14. Akira Ueda JP; Masumi Suzuki JP; Minoru Hirano JP; Toyokazu Hamaguchi JP; Shigeru Hidesawa JP, Electronic apparatus having a heat dissipation member.
  15. Ueda Akira,JPX ; Suzuki Masumi,JPX ; Hirano Minoru,JPX ; Hamaguchi Toyokazu,JPX ; Hidesawa Shigeru,JPX, Electronic apparatus having a heat dissipation member.
  16. Gatti John E., Electronic component, method of cooling, and damper therefor.
  17. Chen,Chun Hung, Electronic device with EMI shield.
  18. Bestwick, Graham Spencer, Electronics assembly with cooling arrangement.
  19. Villaume Henry F. (Intervale NH), Heat sink plate for multiple semi-conductors.
  20. Perdue David W. (Anderson SC), Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid.
  21. Batchelder John Samuel, Heat transfer apparatus.
  22. Dodson, Douglas A., Housing with directed-flow cooling for computer.
  23. Chang Jen-Jou,TWX ; Lai Chin-Yi,TWX, I/O shield for electronic assemblies.
  24. Su,Chi Min, Louver heat vent for chassis of computer.
  25. Bash,Cullen Edwin; Sharma,Ratnesh K., Louvered rack.
  26. Ananth Ananthpadmanabhan ; Andrew P. DeJaco, Method and apparatus for using non-symmetric speech coders to produce non-symmetric links in a wireless communication system.
  27. DiStefano, Eric; Seshan, Krishna, Mobile computer having a housing with openings for cooling.
  28. Eric DiStefano ; Krishna Seshan, Mobile computer having a housing with openings for cooling.
  29. Wabiszczewicz,Zbigniew, PCB with forced airflow and device provided with PCB with forced airflow.
  30. Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Ohba Takao (Hadano JPX) Iwai Susumu (Hadano JPX), Packaging structure of small-sized computer.
  31. Ohashi Shigeo (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki-ken JPX) Kondo Yoshihiro (Ibaraki-ken JPX) Honma Mitsuru (Ibaraki-ken JPX) Onishi Kenji (Hadano JPX) Tsuzaki Hiroshi (Owariasahi JPX) Matsush, Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a seco.
  32. Kung Shao-Tsu,TWX ; Sun Ming-Shen,TWX, Portable computer with heat dissipating device.
  33. Hosoi Takashi (Tokyo JPX) Ohgami Keizo (Tokyo JPX) Takeda Fumiaki (Tokyo JPX), Portable electronic apparatus having a removable keyboard unit.
  34. Jones Pearce R. (Austin TX) Lunsford David (Austin TX), Sandwiched insulative/conductive layer EMI shield structure for printed circuit board.
  35. Ralf P. Maroney ; Jeffrey P. Crouch, Storage cabinet for electronic devices.
  36. Glezer, Ari; Mahalingam, Raghavendran; Allen, Mark G., System and method for thermal management by synthetic jet ejector channel cooling techniques.
  37. Liang,Hsing Sheng; Iyengar,Sridevi; Ting,Phillip; Seyed,Saeed; Chiappe,Jim, Techniques for providing ventilation and EMI shielding to electronic circuitry using a panel member with brimmed holes.
  38. Jondrow Timothy J., Thermal dissipation and EMI shielding structure for notebook computers.
  39. Bhattacharya,Anandaroop; Chiu,Chia pin; Machiroutu,Sridhar V., Thermal management arrangement for standardized peripherals.

이 특허를 인용한 특허 (4)

  1. Singleton, Gregory L., Air flow management device for use in an electronics system.
  2. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  3. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  4. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
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