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An RFID device interposer has folded ends that bring conductive lead end portions of conductive leads of the interposer to an underside of the interposer. The central conductive lead portions of the conductive leads remain on an upper surface of a dielectric substrate of the interposer. The folded e

An RFID device interposer has folded ends that bring conductive lead end portions of conductive leads of the interposer to an underside of the interposer. The central conductive lead portions of the conductive leads remain on an upper surface of a dielectric substrate of the interposer. The folded ends of the interposer may be held together with an adhesive, or with thermal compression bonding. The interposer may also have an additional conductive material layer on an underside of the dielectric substrate. The conductive material layer may be capacitively coupled to the conductive leads of the interposer. The interposer may be tuned by varying the pressure used to secure the folded ends. This may be used to provide a better impedance match between a chip of the interposer, and the conductive leads and an antenna to which the interposer is coupled.

대표청구항 ▼

What is claimed is: 1. An interposer for an RFID device, the interposer comprising: a dielectric substrate; and conductive leads on an upper surface of the dielectric substrate; wherein ends of the interposer are folded to put substrate end portions and conductive lead end portions underneath a cen

What is claimed is: 1. An interposer for an RFID device, the interposer comprising: a dielectric substrate; and conductive leads on an upper surface of the dielectric substrate; wherein ends of the interposer are folded to put substrate end portions and conductive lead end portions underneath a central substrate portion and conductive lead central portions, with the conductive lead end portions facing downward. 2. The interposer of claim 1, wherein the substrate is a polymer substrate. 3. The interposer of claim 1, wherein the substrate is a paper substrate. 4. The interposer of claim 1, further comprising a chip attached to the central conductive lead portions on the top side of the substrate. 5. The interposer of claim 1, wherein the substrate end portions are in contact with and attached to a lower surface of the central substrate portion. 6. The interposer of claim 5, wherein the substrate end portions are thermal compression bonded to the central substrate portion. 7. The interposer of claim 5, wherein the substrate end portions are adhesively attached to the central substrate portion. 8. The interposer of claim 1, further comprising a conductive layer; wherein an upper surface of the conductive layer is attached to a lower surface of the substrate. 9. The interposer of claim 8, wherein the conductive layer is capacitively coupled to the conductive leads. 10. The interposer of claim 9, wherein the substrate end portions are thermal compression bonded to the conductive layer. 11. The interposer of claim 10, wherein strength of the capacitive coupling between the conductive layer and the conductive leads varies as a function of pressure used in the thermal compression bonding; and wherein the interposer is a tunable interposer tunable by selecting the pressure used in the thermal compression bonding. 12. The interposer of claim 8, wherein the substrate end portions cover substantially all of a lower surface of the conductive layer. 13. The interposer of claim 1, wherein the conductive lead end portions overlap most of the conductive lead central portions. 14. The interposer of claim 13, further comprising a chip attached to the central conductive lead portions on the top side of the substrate. 15. The interposer of claim 14, wherein the chip is symmetrically located relative to the conductive lead end portions. 16. The interposer of claim 14, wherein the chip is asymmetrically located relative to the conductive lead end portions. 17. The interposer of claim 1, wherein the conductive leads to not extend to a center of a lower surface of the interposer. 18. The interposer of claim 17, as part of an RFID device; wherein the conductive lead end portions are coupled to a coupling structure of the RFID device; and wherein conductive material of the coupling structure is in contact with the center of the lower surface of the interposer. 19. The interposer of claim 1, wherein the conductive leads include at least four conductive leads. 20. An interposer for an RFID device, the interposer comprising: a dielectric substrate; and conductive leads on an upper surface of the dielectric substrate; wherein ends of the interposer transition from a substantially-planar first configuration in a center of the interposer to a second configuration in which conductive lead end portions are offset from conductive lead central portions of the conductive leads. 21. The interposer of claim 20, wherein the conductive lead end portions are offset from the conductive lead central portions in a direction substantially perpendicular to a plane of the substantially-planar first configuration. 22. The interposer of claim 21, wherein the ends are folded ends.