A loop-type heat exchange device (10) includes an evaporator (20), a vapor conduit (30), a condenser (50) and a liquid conduit (70). The evaporator contains therein a working fluid. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component. The condens
A loop-type heat exchange device (10) includes an evaporator (20), a vapor conduit (30), a condenser (50) and a liquid conduit (70). The evaporator contains therein a working fluid. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component. The condenser includes a housing member (52), a plurality of tube members (53) being in fluid communication with the housing member, and a fin member (54) maintained in thermal contact with the tube members. The vapor conduit and the liquid conduit are each connected between the evaporator and the condenser. The vapor conduit conveys the vapor generated in the evaporator to the tube members of the condenser. The vapor turns into condensate in the tube members upon releasing the heat to the fin member. The condensate is conveyed back to the evaporator by the liquid conduit.
대표청구항▼
What is claimed is: 1. A heat exchange device for removing heat from a heat-generating component, comprising: an evaporator comprising a top cover and a bottom cover, the top and bottom covers cooperating with each other to define a chamber inside the evaporator, the chamber having a liquid micro-c
What is claimed is: 1. A heat exchange device for removing heat from a heat-generating component, comprising: an evaporator comprising a top cover and a bottom cover, the top and bottom covers cooperating with each other to define a chamber inside the evaporator, the chamber having a liquid micro-channel region and an adjacent evaporating region, a protrusion being formed on an outer surface of the bottom cover of the evaporator and being located corresponding to a substantially middle portion of the evaporating region of the chamber for contacting said heat-generating component, the liquid micro-channel region being fully filled with a first wick structure, the middle portion of the evaporating region being filled with a second wick structure, the second wick structure being connected to the first wick structure and substantially covering the protrusion of the bottom cover of the evaporator, a remaining part of the evaporating region not filled with the second wick structure being provided as a vapor-gathering sub-region, a working fluid being filled in the chamber, the working fluid turning into vapor in the evaporating region of the evaporator upon receiving heat from said heat-generating component, the generated vapor being accommodated in the vapor-gathering sub-region; a condenser including a first housing member, a plurality of tube members being in fluid communication with the first housing member, and a fin member maintained in thermal contact with the tube members; and a vapor conduit and a liquid conduit each being connected between the evaporator and the condenser, the vapor conduit being connected to and communicating with the vapor-gathering sub-region to convey the vapor generated in the evaporator to the tube members of the condenser, the vapor turning into condensate in the tube members upon releasing the heat to the fin member, the liquid conduit being connected to and communicating with the liquid micro-channel region to convey the condensate back to the evaporator. 2. The heat exchange device of claim 1, wherein the vapor conduit and liquid conduit both are connected to the first housing member of the condenser. 3. The heat exchange device of claim 2, wherein the first housing member is provided with a baffle located adjacent to the liquid conduit and configured for preventing the vapor transferred to the first housing member by the vapor conduit from entering into the liquid conduit. 4. The heat exchange device of claim 2, wherein a vapor dispenser is provided inside the first housing and the vapor dispenser defines therein a plurality of openings oriented towards the tube members of the condenser. 5. The heat exchange device of claim 1, wherein the condenser further includes a second housing member being in fluid communication with the tube members, and the vapor conduit is connected to the second housing member and the liquid conduit is connected to the first housing member. 6. The heat exchange device of claim 5, wherein the tube members and the fin member are located between the first and second housing members of the condenser. 7. The heat exchange device of claim 5, wherein a vapor dispenser is provided inside the second housing member and the vapor dispenser defines therein a plurality of openings oriented towards the tube members of the condenser. 8. The heat exchange device of claim 1, wherein the fin member includes a plurality of metal fins stacked along the tube members. 9. The heat exchange device of claim 1, wherein the first housing member has a slanted inner surface declining along a direction from the vapor conduit towards the liquid conduit. 10. The heat exchange device of claim 1, wherein a third wick structure is arranged inside the liquid conduit. 11. The heat exchange device of claim 1, wherein the evaporator has a plurality of metal fins extending from an outer surface thereof corresponding to the liquid micro-channel region of the chamber. 12. The heat exchange device of claim 1, wherein the bottom cover of the evaporator has a first section and a second section corresponding to the evaporating region and the liquid micro-channel region of the chamber, respectively, the first section being thicker than the second section. 13. A loop type heat exchanger comprising: an evaporator having a protrusion formed on a bottom wall thereof adapted for contacting a heat-generating component, the evaporator defining a chamber therein, the chamber having a liquid micro-channel region and an adjacent evaporating region, the protrusion being located corresponding to a substantially middle portion of the evaporating region of the chamber, the liquid micro-channel region being fully filled with a first wick structure, the middle portion of the evaporating region being filled with a second wick structure, the second wick structure being connected to the first wick structure and substantially covering the protrusion of the bottom cover of the evaporator, a remaining part of the evaporating region not filled with the second wick structure being provided as a vapor-gathering sub-region, a working fluid being saturated in the second wick structure, said working fluid being evaporated into vapor upon receiving heat from the heat-generating component, the generated vapor being accommodated in the vapor-gathering sub-region; a vapor conduit having a first end connected to and communicating with the vapor-gathering sub-region of the evaporator and a second end; a condenser connecting with the second end of the vapor conduit, having a plurality of tubes and a plurality of fins thermally connecting with the tubes, the vapor flowing through the tubes to be condensed into a condensate; and a liquid conduit having a first end connected with the condenser and a second end connected to and communicating with the liquid micro-channel region of the evaporator, the condensate flowing through the liquid conduit to the first wick structure of the evaporator, the liquid conduit being provided with a third wick structure therein, the third wick structure being connected to the first wick structure. 14. The loop type heat exchanger of claim 13, wherein the condenser has a slanted inner surface declining from the vapor conduit toward the liquid conduit, the condensate in the condenser flowing along the slanted inner surface before entering the liquid conduit. 15. The loop type heat exchanger of claim 13, wherein the first end of the vapor conduit and the second end of the liquid conduit are located at the same level, while the second end of the vapor conduit is located at a higher level than the first end of the liquid conduit. 16. The loop type heat exchanger of claim 13, wherein the condenser has a vapor dispenser connecting with the second end of the vapor conduit, and the vapor dispenser has a plurality of holes facing the tubes. 17. The loop type heat exchanger of claim 13, wherein the condenser has a baffle located near the first end of the liquid conduit for preventing the vapor in the condenser from entering the liquid conduit. 18. The loop type heat exchanger of claim 13, wherein the bottom wall of the evaporator has a varied thickness with a portion having a thicker thickness, the protrusion being formed on the portion having the thicker thickness. 19. The heat exchange device of claim 1, wherein the second wick structure has a size substantially equal to that of the protrusion of the bottom cover, and the second wick structure is fittingly located just above the protrusion.
Phillips, Alfred L.; Khrustalev, Dmitry K.; Wert, Kevin L.; Wilson, Michael J.; Wattelet, Jonathan P.; Broadbent, John, Thermal bus for electronics systems.
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