Electroless deposition chemical system limiting strongly adsorbed species
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IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C23C-018/31
C23C-018/34
C23C-018/40
C23C-018/44
출원번호
UP-0563199
(2006-11-25)
등록번호
US-7780772
(2010-09-13)
발명자
/ 주소
Kolics, Artur
Ivanov, Igor
출원인 / 주소
Lam Research Corporation
대리인 / 주소
Martine Penilla & Gencarella, LLP
인용정보
피인용 횟수 :
0인용 특허 :
11
초록
An electroless deposition chemical system includes an electroless solution including a metal component, and a strongly adsorbed species component having a concentration less than a concentration of the metal component.
대표청구항▼
What is claimed is: 1. An electroless deposition chemical system comprising: providing an electroless solution including: a metal component that includes metal ions; and a strongly adsorbed species component, the strongly adsorbed species component having a concentration of less than one percent of
What is claimed is: 1. An electroless deposition chemical system comprising: providing an electroless solution including: a metal component that includes metal ions; and a strongly adsorbed species component, the strongly adsorbed species component having a concentration of less than one percent of a concentration of the metal component, the strongly adsorbed species including one of sulfate anions, chloride anions, or a combination thereof; wherein the metal component includes vanadium, chromium, tungsten, molybdenum, ruthenium, copper, palladium, tin, rhenium, phosphorus, boron, silicon and aluminum or an alloy thereof. 2. The system as claimed in claim 1 wherein providing the electroless solution includes providing the electroless solution having cobalt ions, nickel ions or a combination thereof. 3. The system as claimed in claim 1 further comprising adsorbing a metal film of the metal component over a substrate. 4. The system as claimed in claim 1 further comprising providing an electroless solution tank or an electroless deposition chamber containing the electroless solution. 5. An electroless deposition chemical system comprising: providing an electroless solution including: a metal component including metal ions; and a strongly adsorbed species component, the strongly adsorbed species component having a concentration less than one percent of a concentration of the metal component, the strongly adsorbed species including one of sulfate anions, chloride anions, or a combination thereof; wherein providing the electroless solution includes providing one hundredth to one tenth moles per cubic decimeter cobalt ions, citrate ion concentration two to seven times that of the cobalt ions, hypophosphite ion concentration one to five times that of the cobalt ions and a buffering agent concentration zero to ten times that of the cobalt ions. 6. The system as claimed in claim 5 wherein providing the electroless solution includes providing cobalt ions from Co(OH)2, Co3(C6H5O8)2x2H2O, Co(C2H3O2)2.4H2O, or Co(H2PO2)2. 7. The system as claimed in claim 5 further comprising adsorbing the metal component over a substrate, the metal component being selected from a group consisting of vanadium, chromium, tungsten, molybdenum, ruthenium, palladium, tin, rhenium, phosphorus, boron, silicon and aluminum or an alloy thereof. 8. An electroless deposition chemical system comprising: an electroless solution including, a metal component that includes metal ions; and a strongly adsorbed species component, the strongly adsorbed species component having a concentration of less than one percent of a concentration of the metal component, the strongly adsorbed species including one of sulfonate, halide, phosphate, polyphosphate, unsaturated organic acid, aromatic compound, heterocyclic compound, thiol, or a combination thereof; wherein the metal component includes vanadium, chromium, tungsten, molybdenum, ruthenium, copper, palladium, tin, rhenium, phosphorus, boron, silicon and aluminum or an alloy thereof. 9. The system as claimed in claim 8 wherein the electroless solution includes cobalt ions, nickel ions or a combination thereof. 10. The system as claimed in claim 8 further comprising: a substrate; and a metal film of the metal component over the substrate. 11. The system as claimed in claim 8 further comprising an electroless solution tank or an electroless deposition chamber containing the electroless solution. 12. An electroless deposition chemical system comprising: an electroless solution including, a metal component that includes metal ions; and a strongly adsorbed species component, the strongly adsorbed species component having a concentration of less than one percent of a concentration of the metal component, the strongly adsorbed species including one of sulfonate, halide, phosphate, polyphosphate, unsaturated organic acid, aromatic compound, heterocyclic compound, thiol, or a combination thereof; wherein the electroless solution includes cobalt ions from Co(OH)2, Co3(C6H5O8)2x2H2O, Co(C2H3O2)2.4H2O, or Co(H2PO2)2. 13. An electroless deposition chemical system comprising: an electroless solution including, a metal component that includes metal ions; and a strongly adsorbed species component, the strongly adsorbed species component having a concentration of less than one percent of a concentration of the metal component, the strongly adsorbed species including one of sulfonate, halide, phosphate, polyphosphate, unsaturated organic acid, aromatic compound, heterocyclic compound, thiol, or a combination thereof; wherein the electroless solution includes one hundredth to one tenth moles per cubic decimeter cobalt ions, citrate ion concentration two to seven times that of the cobalt ions, hypophosphite ion concentration one to five times that of the cobalt ions and a buffering agent concentration zero to ten times that of the cobalt ions.
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이 특허에 인용된 특허 (11)
Kolics, Artur; Petrov, Nicolai; Ting, Chiu; Ivanov, Igor, Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper.
Donovan Lawrence P. (Temple City CA) Maguire Eileen (Pasadena CA) Kadison Leon A. (Pasadena CA), Aqueous suspensions for surface activation of nonconductors for electroless plating.
Chen,Qingyun; Valverde,Charles; Paneccasio,Vincent; Petrov,Nicolai; Stritch,Daniel; Witt,Christian; Hurtubise,Richard, Defectivity and process control of electroless deposition in microelectronics applications.
Inoue,Hiroaki; Kimura,Norio; Wang,Xinming; Matsumoto,Moriji; Kanayama,Makoto, Semiconductor device, method for manufacturing the same, and plating solution.
Kolics, Artur; Petrov, Nicolai; Ting, Chiu; Ivanov, Igor C., Solution composition and method for electroless deposition of coatings free of alkali metals.
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