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An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from t

An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from the rim of the pad, a through-hole formed through the thickness thereof at a planar position within the pad, and a small aperture formed at a planar position within the pad and communicating with the through-hole, and a second connecting member comprises a conductive projection formed at least one side thereof and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, where the electrical connection is formed in the manner such that the conductive projection of the second connecting member is inserted in the through-hole of the first connecting member, through the small aperture in the pad, bending the pad and the portion of the insulating film under the pad, along the direction of insertion of the conductive projection, so that the pad is pressed onto the conductive projection due to elastic force of the pad and the insulating film bent.

대표청구항 ▼

The invention claimed is: 1. An electrical connection structure for forming an electrical connection between a first connecting member and a second connecting member, the first connecting member comprising a flexible substrate comprising a flexible insulating film, a conductive pad having elasticit

The invention claimed is: 1. An electrical connection structure for forming an electrical connection between a first connecting member and a second connecting member, the first connecting member comprising a flexible substrate comprising a flexible insulating film, a conductive pad having elasticity and formed on at least one side of the flexible insulating film, a conductive circuit pattern extending from a rim of the conductive pad, and a through-hole formed through a thickness of the flexible insulating film at a planar position within the conductive pad, and a small aperture formed at a planar position within the conductive pad and communicating with the through-hole, said small aperture having a contour located within the contour of the through-hole as viewed in a direction of a thickness of the flexible insulating film, the second connecting member comprising a conductive projection formed on at least one side of the second connecting member and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, wherein the electrical connection is formed in a manner such that the conductive projection of the second connecting member is detachably inserted in the through-hole of the first connecting member, from a side of the flexible insulating film upon which the conductive pad is formed, through the small aperture in the conductive pad, thereby elastically bending the conductive pad and a portion of the flexible insulating film under the conductive pad, along a direction of insertion of the conductive projection, so that the conductive pad is pressed onto the conductive projection due to elastic force of the conductive pad and the flexible insulating film is bent. 2. The electrical connection structure according to claim 1, wherein the conductive pad is formed of a material having both conductivity and elasticity. 3. The electrical connection structure according to claim 2, wherein a material which forms the conductive pad comprises copper, nickel, stainless steel, phosphor bronze, Inconel or a conductive resin composition. 4. The electrical connection structure according to claim 1, wherein the small aperture is smaller in cross section than the conductive projection. 5. The electrical connection structure according to claim 4, wherein the small aperture has a circular, polygonal or slit-like planar shape. 6. The electrical connection structure according to claim 1, wherein the first connecting member includes a plurality of conductive pads arranged in a two-dimensional grid-like array and the second connecting member includes a plurality of conductive projections arranged in a two-dimensional grid-like array corresponding to the two-dimensional grid-like array of said plural conductive pads. 7. The electrical connection structure according to claim 1, wherein the conductive projection rises at an angle of 65° to 160°. 8. The electrical connection structure according to claim 1, wherein the conductive projection is greater in cross section at the top than at the base. 9. The electrical connection structure according to claim 1, wherein the second connecting member comprises a flexible substrate having a same structure as the flexible substrate of the first connecting member, and the conductive projection is formed on one or each side of the flexible substrate. 10. The electrical connection structure according to claim 1, wherein the first connecting member further comprises a conductive projection on one or each side of the flexible substrate. 11. The electrical connection structure according to claim 1, wherein a bump electrode is formed on a side of the first connecting member opposite to the side upon which the conductive pad is formed, or on a side of the second connecting member opposite to the side upon which the conductive projection is formed. 12. The electrical connection structure according to claim 1, wherein the second connecting member comprises a same flexible substrate as the first connecting member, and the conductive projection is formed on each of the flexible substrates constituting the first and second connecting members, on a side opposite to the side upon which the conductive pad is formed, wherein the conductive pad and the conductive projection are each located at a periphery of the flexible substrate, leaving an area for mounting a semiconductor device in a center of the flexible substrate. 13. The electrical connection structure according to claim 3, wherein the conductive pad comprises a thin film having a thickness of 0.05 to 100 μm. 14. A first connecting member of an electrical connection structure formed between the first connecting member and a second connecting member that includes a conductive projection, the first connecting member comprising a flexible substrate comprising a flexible insulating film, a conductive pad having elasticity and formed on at least one side of the flexible insulating film, a conductive circuit pattern extending from a rim of the conductive pad, and a through-hole formed through a thickness of the flexible insulating film at a planar position within the conductive pad, and a small aperture formed at a planar position within the conductive pad and communicating with the through-hole, said small aperture having a contour located within the contour of the through-hole as viewed in a direction of a thickness of the flexible insulating film, so that the first and second connecting members are detachably engageable to form an electrical connection by inserting the conductive projection of the second connecting member in the through-hole of the first connecting member, from a side of the flexible insulating film upon which the conductive pad is formed, through the small aperture in the conductive pad, thereby elastically bending the conductive pad and a portion of the flexible insulating film under the conductive pad, along a direction of insertion of the conductive projection, so that the conductive pad is pressed onto the conductive projection due to elastic force of the conductive pad and the flexible insulating film is bent. 15. A second connecting member configured for implementation in the electrical connection structure according to claim 1.