IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0954063
(2007-12-11)
|
등록번호 |
US-7787247
(2010-09-20)
|
발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
6 인용 특허 :
11 |
초록
▼
A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink p
A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink plate having a portion thermally coupled to the heat generating component. The heat sink plate includes a means for forming at least one slot proximate the portion. The fan is adapted to direct airflow cross the portion. The thermal energy generated by the heat generating component is transferred to the fan carrier and ultimately removed from the fan carrier by the airflow. The airflow inducts a secondary airflow drawn through the slot during operation thereby to enhance transfer of the thermal energy from the heat generating component.
대표청구항
▼
What is claimed is: 1. An apparatus with improved heat dissipation, comprising: a circuit board with at least one heat generating component affixed thereto; and a fan and carrier therefor including a heat sink plate and means forming an airflow passageway over a surface thereof, said heat sink plat
What is claimed is: 1. An apparatus with improved heat dissipation, comprising: a circuit board with at least one heat generating component affixed thereto; and a fan and carrier therefor including a heat sink plate and means forming an airflow passageway over a surface thereof, said heat sink plate having a portion thereof along said passageway and downstream of said fan thermally coupled to said heat generating component on one side of said heat sink plate opposite a second side thereof forming said surface, said heat sink plate having means forming at least one slot therein proximate a bounding edge of said portion, said fan being adapted to direct an airflow through said passageway and over said surface, said slot and said portion; wherein thermal energy generated by said heat generating component is transferred to said heat sink plate and ultimately removed therefrom by said airflow, and wherein said airflow passing through said passageway and over said slot reduces the atmospheric pressure over said slot and thereby induces a secondary airflow through said slot from said one side of said heat sink plate to said second side during operation of said fan, thereby enhancing removal of thermal energy from said heat generating component. 2. An apparatus as recited in claim 1, wherein said heat sink plate includes an opening formed therein defining said portion, and a thermal block flush-mounted within said opening and having at least one recessed portion on an edge thereof cooperating with an edge of said heat sink plate defining said opening to form said slot. 3. An apparatus as recited in claim 1, wherein said portion is configured as a thermal block formed as an integral part of said heat sink plate. 4. An apparatus as recited in claim 2, wherein said thermal block is formed of metal and includes a plurality of additional recessed portions formed along at least one other edge thereof, said additional recessed portions cooperating with an edge of said heat sink plate defining said opening to form additional slots through which said airflow induces additional secondary airflow during operation of said fan. 5. An apparatus as recited in claim 1, further comprising: flow directing vanes disposed within said passageway and on said heat sink plate and configured to direct said airflow from said fan across said surface and said portion. 6. An apparatus as recited in claim 5, wherein each said vane includes a generally elongated strip, and further comprising: an upper plate disposed directly on said vanes so that said vanes, said heat sink plate, and said upper plate form a plurality of air passageways through which said airflow flows in passing from said fan across said surface and said portion. 7. An apparatus as recited in claim 6, wherein said upper plate has a portion that is convex relative to said heat sink plate and positioned over said slot to increase the velocity of the airflow passing thereover. 8. An apparatus as recited in claim 5, wherein said vanes are formed by a plurality of elongated c-shaped channels positioned in adjacent parallel relationship and affixed to said heat sink plate. 9. An apparatus as recited in claim 1, further comprising: a top cover secured to said fan carrier and including an opening through which said fan draws air. 10. An apparatus as recited in claim 1, further comprising: a plurality of radiator fins disposed directly on said heat sink plate and configured to transfer thermal energy to an ambient atmosphere. 11. An apparatus as recited in claim 10, further comprising: a top cover secured to said fan carrier and including slots for ventilating said fins and an opening through which said fan draws air. 12. An apparatus as recited in claim 1, wherein said circuit board includes multiple heat generating elements affixed thereto, further comprising: a plurality of protrusions disposed beneath a bottom surface of said heat sink plate and configured to physically contact said elements to transfer thermal energy generated by said elements to said heat sink plate during operation. 13. An apparatus as recited in claim 1, further comprising: a pair of flow directing fences respectively disposed on opposite sides of said portion and beneath a bottom surface of said heat sink plate on said one side thereof to at least partially define a region of space surrounding said portion and occupied by said heat generating component, wherein most of the air in said secondary flow comes from said space to enhance transfer of thermal energy from said heat generating component. 14. An apparatus as recited in claim 1, wherein said circuit board forms part of a graphics card. 15. An apparatus as recited in claim 14, wherein said heat generating component includes a GPU. 16. In an assembly including a printed circuit board with at least one heat generating component affixed thereto, and a heat dissipating mechanism also affixed to said printed circuit board for removing thermal energy from the heat generating component, an improved heat dissipating mechanism comprising: a fan and carrier therefor including a heat sink plate and means forming an airflow passageway over a surface thereof, said heat sink plate having a portion thereof within said passageway thermally coupled to said heat generating component, said portion having a means forming at least one slot proximate a bounding edge of said portion, said fan being adapted to direct an airflow through said passageway and over said surface, said slot and said portion; wherein thermal energy generated by said heat generating component is transferred to said heat sink plate and ultimately removed therefrom by said airflow, and wherein said airflow passing through said passageway and over said slot reduces the atmospheric pressure over said slot and thereby induces a secondary airflow through said slot during operation, thereby enhancing transfer of thermal energy from said heat generating component. 17. In an assembly as recited in claim 16, wherein said means includes a thermal block flush-mounted to said plate and having at least one recessed portion on an edge thereof to form said slot. 18. In an assembly as recited in claim 16, wherein said portion is configured as a thermal block formed as an integral part of said heat sink plate. 19. In an assembly as recited in claim 17, wherein said thermal block is formed of metal. 20. In an assembly as recited in claim 16 and further comprising: flow directing vanes disposed within said passageway and on said heat sink plate and configured to direct said airflow from said fan across said surface and said portion. 21. In an assembly as recited in claim 20, wherein each said vane includes a generally elongated strip, and further comprising: an upper plate disposed directly on said vanes so that said vanes, said heat sink plate, and said upper plate form a plurality of channels in said air passageway through which said airflow flows in passing from said fan across said surface and said portion. 22. In an assembly as recited in claim 21, wherein said upper plate has a portion convex relative to said heat sink plate and said portion is positioned over said slot to reduce the cross sectional area of said passageway and thereby increase the velocity of the airflow passing thereover. 23. In an assembly as recited in claim 20, wherein said vanes are formed by a plurality of elongated c-shaped channels positioned in adjacent parallel relationship and affixed to said heat sink plate. 24. In an assembly as recited in claim 16 and further comprising: a top cover secured to said fan carrier and including an opening through which said fan draws air. 25. In an assembly as recited in claim 16 and further comprising: a plurality of radiator fins disposed directly on said heat sink plate and configured to transfer thermal energy to an ambient atmosphere. 26. In an assembly as recited in claim 16 and further comprising: a top cover secured to said fan carrier and including slots for ventilating said fins and an opening through which said fan draws air. 27. In an assembly as recited in claim 16, wherein said printed circuit board includes multiple heat generating elements affixed thereto, and further comprising: a plurality of protrusions disposed beneath a bottom surface of said heat sink plate and configured to physically contact said elements thereby to transfer thermal energy generated by said elements therefrom during operation. 28. In an assembly as recited in claim 16 and further comprising: a pair of flow directing fences respectively disposed on opposite sides of said portion and beneath a bottom surface of said heat sink plate on said one side thereof to at least partially define a region of space surrounding said portion and occupied by said heat generating component, wherein most of the air in said secondary flow comes from said region of space to thereby enhance transfer of thermal energy from said heat generating component. 29. An apparatus for transferring thermal energy from at least one heat generating component affixed to a circuit board or the like, comprising: a fan for generating an airflow; and fan carrying means including a heat sink plate means and a plurality of flow directing vanes defining a plurality of airflow passageways which pass over one side of said heat sink plate means, at least some of said passageways passing across a thermal energy transfer portion of said heat sink plate means adapted to be thermally coupled on the other side thereof to a heat generating component, said heat sink plate means having at least one slot formed therein and disposed proximate a bounding edge of said thermal energy transfer portion, said fan being adapted to cause an airflow through said passageways and across said slot and said thermal energy transfer portion; wherein thermal energy generated by the heat generating component and transferred to said heat sink plate means is removed therefrom by said airflow, and wherein the airflow through the passageways passing over said slot induces a secondary airflow through said slot from a region of space on the opposite side of said heat sink plate means and adjacent at least one side of the heat generating component to the inducing passageways, thereby enhancing removal of thermal energy from the heat generating component. 30. An apparatus for transferring thermal energy as recited in claim 29, wherein said thermal energy transfer portion is defined by a thermal block forming a part of said heat sink plate means. 31. An apparatus for transferring thermal energy as recited in claim 30, wherein said heat sink plate means includes an opening formed therein and wherein said thermal block is flush-mounted within said opening and has at least one recessed portion on an edge thereof which cooperates with an edge of said opening to form said slot. 32. An apparatus for transferring thermal energy as recited in claim 31, wherein said thermal block is formed of metal and includes additional recessed portions formed along at least one other edge thereof, said additional recessed portions cooperating with said heat sink plate means to form additional slots through which said airflow induces secondary airflow during operation. 33. An apparatus for transferring thermal energy as recited in claim 29, further comprising: at least one flow directing fence disposed beneath said other side of said heat sink plate means and proximate said slot, said fence defining at least one side of said region of space beneath said slot and proximate a bounding edge of said thermal energy transfer portion. 34. An apparatus for transferring thermal energy as recited in claim 33, wherein said heat sink plate means has at least one other slot formed therein and disposed on a side of said thermal energy transfer portion opposite said one slot and proximate another bounding edge of said thermal energy transfer portion, said fan being adapted to cause said airflow through at least some of said passageways to also flow across said other slot to induce another secondary airflow through said other slot from a region of space adjacent at least one other side of the heat generating component to the inducing passageways, thereby further enhancing removal of thermal energy from the heat generating component.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.