The present invention provides an optical device that is miniature, is highly sensitive and has a simplified package, and a manufacturing method thereof with high production efficiency and high reliability. The present invention is an optical device comprising: a photoelectric conversion element (50
The present invention provides an optical device that is miniature, is highly sensitive and has a simplified package, and a manufacturing method thereof with high production efficiency and high reliability. The present invention is an optical device comprising: a photoelectric conversion element (50) having at least one photoelectric conversion portion (1) which is formed on a substrate (10); a sealing material (14); and a connection terminal (3). The optical device comprises an optical window which is an interface between the photoelectric conversion element (50) and an outside of the optical device; and an aperture (6) formed in the sealing material 14, and whose bottom face is the optical window. An entire face of the optical window is exposed to the outside. An optical adjustment element (13) may be formed on the interface. In this case, the interface between the optical adjustment element (13) and the outside is the optical window.
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The invention claimed is: 1. An optical device comprising: a substrate having a first face and a second face, opposite said first face; a photoelectric conversion element having a photoelectric conversion portion which is formed on the first face of the substrate; a connection terminal electrically
The invention claimed is: 1. An optical device comprising: a substrate having a first face and a second face, opposite said first face; a photoelectric conversion element having a photoelectric conversion portion which is formed on the first face of the substrate; a connection terminal electrically connected to the photoelectric conversion element; a sealing material which seals the photoelectric conversion element and the connection terminal; an optical adjustment element formed on the second face of the substrate to provide an interface for the light to propagate to or from; and an aperture that exposes the optical adjustment element on one side of the optical device through which light is allowed to enter from outside of said optical device or exit to the outside of the optical device. 2. The optical device according to claim 1, wherein the element that is the optical adjustment element is formed integrally with the photoelectric conversion element. 3. The optical device according to any one of claims 1 and 2, wherein the optical adjustment element is a light anti-reflection element. 4. The optical device according to claim 3, wherein the light anti-reflection element is a scattering control layer. 5. The optical device according to claim 1, wherein the photoelectric conversion element performs any one of detection and emission of light in an infrared region. 6. The optical device according to claim 1, wherein the photoelectric conversion element is a quantum type photoelectric conversion element capable of operation at a room temperature. 7. The optical device according to any one of claims 5 and 6, wherein the photoelectric conversion element is formed by connecting in series a plurality of photoelectric conversion elements. 8. The optical device according to claim 6, wherein the quantum type photoelectric conversion element belongs to at least any one of a photoconductor type, a photodiode type, a phototransistor type and a LASER diode type; and the quantum type photoelectric conversion element comprises a layer formed of a semiconductor containing at least any one of In and Sb, and a barrier layer for diffusion current suppression. 9. The optical device according to claim 1, wherein the photoelectric conversion element comprises: a first face including the aperture through which light enter or exits; a second face formed opposite to the first face, wherein the second face includes at least any one of a shielding plate which absorbs electromagnetic noise; and a light reflection plate which increases the absorption or emission efficiency for the light. 10. The optical device according to claim 1, wherein the light enters into or exits from the sealing material and the connection terminal through the aperture. 11. The optical device according to claim 1, wherein the photoelectric conversion element and the connection terminal are connected to each other through a signal transfer element. 12. A method of manufacturing an optical device comprising a photoelectric conversion element having a photoelectric conversion portion which is formed on a first face of a substrate; an optical adjustment element formed on a second face of the substrate opposite the first face to provide an interface for the light to propagate to or from; a connection terminal electrically connected to the photoelectric conversion element; and a sealing material which seals the photoelectric conversion element and the connection terminal, the method comprising: forming a first protective film for protecting the optical adjustment element; sealing at least a part of the connection terminal and the photoelectric conversion element by using the sealing material; forming an aperture on one side of the optical device through which light is allowed to enter from outside of the optical device or exit to the outside of the optical device; and removing the first protective film, wherein the aperture that exposes the optical adjustment element is formed by removing the first protective film. 13. The method of manufacturing an optical device according to claim 12, wherein the optical adjustment element is formed integrally with the photoelectric conversion element. 14. The method of manufacturing an optical device according to any one of claims 12 and 13, further comprising separating elements in the optical device between the forming of the first protective film and the sealing. 15. The method of manufacturing an optical device according to claim 12, wherein, during aperture forming, if a thickness of the first protective film is denoted as t, etching is performed to a depth x (0≦x≦t) from a surface of the first protective film by using the surface of the first protective film as a basis. 16. The method of manufacturing an optical device according to claim 12, wherein the aperture is formed by etching utilizing a physical technique. 17. The method of manufacturing an optical device according to claim 16, wherein the etching utilizing a physical technique is sandblast etching. 18. The method of manufacturing an optical device according to claim 12, wherein the aperture is formed, in the one side through which light is allowed to enter to or exit from the sealing material and the connection terminal. 19. The method of manufacturing an optical device according to claim 12, wherein the photoelectric conversion element and the connection terminal are connected to each other through a signal transfer element. 20. The method of manufacturing an optical device according to claim 12, wherein the aperture is formed in the sealing material; and the manufacturing method further comprising forming a second protective film on a face of the sealing material between the sealing and the aperture formation, the second protective film protecting at least a part of the sealing material except for the aperture, the face being intended to have the aperture formed thereon. 21. The method of manufacturing an optical device according to claim 12, wherein: the aperture is formed in the connection terminal; the connection terminal has a penetrating pattern; and the sealing material having entered the pattern during the sealing is removed while forming the aperture. 22. The method of manufacturing an optical device according to claim 12, further comprising: electrically connecting a signal transfer element and the photoelectric conversion element to each other; electrically connecting the signal transfer element and the connection terminal to each other before the sealing, wherein the signal transfer element includes at least one of: a signal processing circuit which processes an output from the photoelectric conversion element; a driver circuit which drives an electric signal directed to the photoelectric conversion element; and an interposer which electrically connects the photoelectric conversion element and the connection terminal to each other, wherein during the sealing, at least a part of the connection terminal, the photoelectric conversion element and the signal transfer element are sealed by the sealing material.
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