초록 ▼

Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board includes an insulating material; a vi

Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board includes an insulating material; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating material having the via-hole formed therein; and a copper pattern plating layer formed on a given region of the insulating material, which has the copper seed layer formed thereon, and in the via-hole.

대표청구항 ▼

What is claimed is: 1. A printed circuit board, comprising: an insulating material of thermal plastic polyimide; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating mat

What is claimed is: 1. A printed circuit board, comprising: an insulating material of thermal plastic polyimide; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating material having the via-hole formed therein; and a copper pattern plating layer formed on a given region of the insulating material, which has the copper seed layer formed thereon, and in the via-hole. 2. The printed circuit board of claim 1, wherein the insulating material has a thickness of 10-50 μm. 3. The printed circuit board of claim 2, wherein the thickness of the insulating material is 25 μm. 4. The printed circuit board of claim 1, wherein the copper seed layer has a thickness of less than 0.5 μm. 5. The printed circuit board of claim 4, wherein the thickness of the copper seed layer is 10 nm to 0.5 μm.