초록 ▼

An imaging device and method of fabricating the same is disclosed. The imaging device may include an imaging sensor base, an image detector and a multilayer board. The imaging sensor base has a bonded hub having uniform flatness. The mounting hub sized to fit into a receptacle in the multilayer boar

An imaging device and method of fabricating the same is disclosed. The imaging device may include an imaging sensor base, an image detector and a multilayer board. The imaging sensor base has a bonded hub having uniform flatness. The mounting hub sized to fit into a receptacle in the multilayer board. The image detector sized to match a size of the imaging sensor base and bonded to a top surface of the imaging sensor base. The imaging device may also include a readout integrated circuit (ROIC) sized to substantially match the size of the imaging sensor base and disposed on the image detector. A plurality of equi-spaced flexures and receptacles for receiving the plurality of flexures may also be used to maintain positional stability and minimize thermal strain.

대표청구항 ▼

The invention claimed is: 1. An imaging device comprising: an imaging sensor base having a mounting hub on a bottom surface, the mounting hub sized to fit into a receptacle; and an image detector sized to substantially match a size of the imaging sensor base and bonded to a top surface of the imagi

The invention claimed is: 1. An imaging device comprising: an imaging sensor base having a mounting hub on a bottom surface, the mounting hub sized to fit into a receptacle; and an image detector sized to substantially match a size of the imaging sensor base and bonded to a top surface of the imaging sensor base, the imaging sensor base and the image detector composed of closely matched refractory materials; wherein said mounting hub is circular and the circumference of the mounting hub comprises a plurality of equi-spaced flexure receptacles. 2. The imaging device of claim 1 further comprising a multilayer board having the receptacle. 3. The imaging device of claim 2, wherein the multilayer board comprises a ceramic material and alumina. 4. The imaging device of claim 1, wherein the imaging sensor base is fabricated from a material selected from a group consisting of molybdenum, nickel steel alloy, nickel-cobalt ferrous alloy, beryllium, alumina and aluminum nitride. 5. The imaging device of claim 1 further comprising a readout integrated circuit (ROIC) sized to substantially match the size of the imaging sensor base and disposed on the image detector. 6. An imaging device comprising: an imaging sensor base having a top surface and a bottom surface and a mounting hub on said bottom surface; an image detector sized to substantially match a size of the imaging sensor base and bonded to the top surface of the imaging sensor base, the imaging sensor base and the image detector composed of closely matched refractory materials; and means for isolating temperature induced strain from the image detector; wherein said mounting hub is circular and the circumference of the mounting hub comprises a plurality of equi-spaced flexure receptacles. 7. The imaging device of claim 6, wherein the imaging sensor base is fabricated from a material selected from a group consisting of molybdenum, nickel steel alloy, nickel-cobalt ferrous alloy, beryllium, alumina and aluminum nitride. 8. The imaging device of claim 6 further comprising a multilayer board having a receptacle for receiving the mounting hub. 9. An imaging device comprising: an imaging sensor base having a top surface and a bottom surface and a mounting hub on said bottom surface; an image detector sized to substantially match a size of the imaging sensor base and bonded to the top surface of the imaging sensor base, the imaging sensor base and the image detector composed of closely matched refractory materials; means for isolating temperature induced strain from the image detector; a multilayer board having a receptacle for receiving the mounting hub; wherein the multilayer board comprises a plurality of equi-spaced flexure receptacles. 10. The imaging device of claim 6 or 9 further comprising a plurality of equi-spaced flexures distinct from said mounting hub and receptacles, said equi-spaced flexures arranged to engage with respective equi-spaced flexure receptacles, the plurality of equi-spaced flexures de-coupling thermally induced strain from the image detector to reduce directional deformation of the image detector. 11. A method of fabricating an imaging device comprising: bonding an image detector to a top surface of an imaging sensor base having a mounting hub on a bottom surface, the mounting hub substantially sized to fit into a receptacle, the imaging sensor base and the image detector composed of closely matched refractory materials; wherein said mounting hub is circular and the circumference of the mounting hub comprises a plurality of equi-spaced flexure receptacles. 12. The method of claim 11, wherein the imaging sensor base is fabricated from a material selected from a group consisting of molybdenum, nickel steel alloy, nickel-cobalt ferrous alloy, beryllium, alumina and aluminum nitride. 13. The method of claim 11 further comprising bonding the mounting hub of the imaging sensor base to a multilayer board. 14. The method of claim 11 wherein the multilayer board comprises a ceramic material and alumina. 15. A method of fabricating an imaging device having an image detector, an imaging sensor base, a multilayer board and a plurality of equi-spaced flexures, the image detector sized to substantially match a size of the imaging sensor base, the imaging sensor base having a mounting hub on a bottom surface and sized to fit into a receptacle of the multilayer board, the mounting hub and the multilayer board having a plurality of equi-spaced and opposite flexure receptacles, said equi-spaced flexures being distinct from said mounting hub and receptacles, the method comprising: coupling the image detector to a top surface of the imaging sensor base; engaging the plurality of equi-spaced flexures to the plurality of equi-spaced and opposite flexure receptacles of the mounting hub and the multilayer board; and coupling the mounting hub to the multilayer board. 16. The method of claim 15, wherein the imaging sensor base and the image detector are composed of closely matched refractory materials. 17. The method of claim 15 wherein each of the plurality of equi-spaced flexures comprises titanium or gamma alumina.