초록 ▼

An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing mater

An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing material is proximate a first side of the semiconductor device and a second side of the semiconductor device opposite the first side of the semiconductor device. Furthermore, the load-distributing material completely surrounds the semiconductor device and contacts the mechanical load apparatus, the substrate, and the semiconductor device. The load-distributing material can be thermally conductive and comprises an elastomer and/or a liquid. The load-distributing material comprises a LGA interposer adapted to connect the substrate to a PCB below the substrate and/or a second substrate. Moreover, the load-distributing material comprises compressible material layers and rigid material layers. The load-distributing material comprises a rigid material incased in a compressible material.

대표청구항 ▼

What is claimed is: 1. A land grid array structure, comprising: at least one semiconductor device over a substrate; a mechanical load apparatus over said semiconductor device; and a load-distributing material between said mechanical load apparatus and said substrate, wherein said load-distributing

What is claimed is: 1. A land grid array structure, comprising: at least one semiconductor device over a substrate; a mechanical load apparatus over said semiconductor device; and a load-distributing material between said mechanical load apparatus and said substrate, wherein said load-distributing material is proximate a first side of said semiconductor device, and wherein said load-distributing material is proximate a second side of said semiconductor device opposite said first side of said semiconductor device, wherein said load-distributing material contacts said mechanical load apparatus, said substrate, and said semiconductor device. 2. The structure according to claim 1, wherein said load-distributing material completely surrounds said semiconductor device. 3. The structure according to claim 1, wherein said load-distributing material is thermally conductive and comprises at least one of an elastomer and a liquid. 4. The structure according to claim 1, further comprising a non-load bearing thermally conductive material between said semiconductor device and said mechanical load apparatus. 5. The structure according to claim 1, further comprising: a land grid array interposer adapted to connect said substrate to at least one of a printed circuit board and a second substrate. 6. The structure according to claim 1, wherein said load-distributing material comprises compressible material layers and rigid material layers. 7. The structure according to claim 1, wherein said load-distributing material comprises a rigid material incased in a compressible material. 8. The structure according to claim 1, further comprising: a printed circuit board below said substrate; a lower substrate below said printed circuit board; at least one lower semiconductor device below said lower substrate; a lower mechanical load apparatus below said lower semiconductor device; and a lower load-distributing material between said lower mechanical load apparatus and said lower substrate, wherein said lower load-distributing material is proximate a first side of said lower semiconductor device, and wherein said lower load-distributing material is proximate a second side of said lower semiconductor device opposite said first side of said lower semiconductor device. 9. A land grid array structure, comprising: at least one semiconductor device over a substrate; a mechanical load apparatus over said semiconductor device; a load-distributing material between said mechanical load apparatus and said substrate, wherein said load-distributing material is proximate a first side of said semiconductor device, wherein said load-distributing material is proximate a second side of said semiconductor device opposite said first side of said semiconductor device; and a land grid array interposer adapted to connect said substrate to at least one of a printed circuit board and a second substrate, wherein said load-distributing material contacts said mechanical load apparatus, said substrate, and said semiconductor device. 10. The structure according to claim 9, further comprising a non-load bearing thermally conductive material between said semiconductor device and said mechanical load apparatus. 11. A land grid array structure, comprising: at least one semiconductor device over a substrate; a mechanical load apparatus over said semiconductor device; a load-distributing material between said mechanical load apparatus and said substrate, wherein said load-distributing material is proximate a first side of said semiconductor device, wherein said load-distributing material is proximate a second side of said semiconductor device opposite said first side of said semiconductor device; and a land grid array interposer adapted to connect said substrate to at least one of a printed circuit board and a second substrate, wherein said load-distributing material completely surrounds said semiconductor device. 12. A land grid array structure, comprising: at least one semiconductor device over a substrate; a mechanical load apparatus over said semiconductor device; a load-distributing material between said mechanical load apparatus and said substrate, wherein said load-distributing material is proximate a first side of said semiconductor device, wherein said load-distributing material is proximate a second side of said semiconductor device opposite said first side of said semiconductor device; and a land grid array interposer adapted to connect said substrate to at least one of a printed circuit board and a second substrate, wherein said load-distributing material is thermally conductive and comprises at least one of an elastomer and a liquid.