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An imager comprising a sphere of dielectric material and a geodesically configured substrate disposed adjacent said sphere. The geodesically configured substrate comprises a plurality of triangularly shaped elements, at least selected ones of the triangularly shaped elements having an array of detec

An imager comprising a sphere of dielectric material and a geodesically configured substrate disposed adjacent said sphere. The geodesically configured substrate comprises a plurality of triangularly shaped elements, at least selected ones of the triangularly shaped elements having an array of detectors disposed thereon, the detectors in the array also being disposed adjacent the dielectric sphere for receiving and detecting incoming electromagnetic waves delivered via said sphere.

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What is claimed is: 1. An imager comprising: a sphere of dielectric material; a geodesically configured substrate disposed adjacent said sphere, the geodesically configured substrate comprising a plurality of triangularly shaped elements, at least selected ones of said triangularly shaped elements

What is claimed is: 1. An imager comprising: a sphere of dielectric material; a geodesically configured substrate disposed adjacent said sphere, the geodesically configured substrate comprising a plurality of triangularly shaped elements, at least selected ones of said triangularly shaped elements having an array of detectors disposed thereon, the detectors in said array also being disposed adjacent said dielectric sphere for receiving and detecting incoming electromagnetic waves delivered via said sphere. 2. The imager of claim 1 wherein the sphere of dielectric material has a dielectric constant in the range of 3 to 6. 3. The imager of claim 1 wherein the array of detectors has a triangular shape. 4. The imager of claim 1 wherein each detector in said array of detectors comprises a chip of a semiconductor material having an integrated diode and an integrated antenna structure formed thereon. 5. The imager of claim 4 wherein the integrated diode and integrated antenna structure formed on the detector are electrically coupled to wires arranged on an exterior surface of the geodesically configured substrate. 6. The imager of claim 1 wherein the sphere of dielectric material is disposed interiorly of said geodesically configured substrate. 7. The imager of claim 1 wherein the sphere of dielectric material has a radially varying dielectric constant. 8. An imager comprising: a sphere of dielectric material; a geodesically configured substrate disposed adjacent said sphere, the geodesically configured substrate comprising a plurality of triangularly shaped elements, at least selected ones of said triangularly shaped elements having an array of detectors disposed thereon, the detectors in said array also being disposed adjacent said dielectric sphere for receiving and detecting incoming electromagnetic waves delivered via said sphere, wherein each detector in said array of detectors comprises a chip of a semiconductor material having an integrated diode and an integrated antenna structure formed thereon, wherein the integrated antenna structure comprises a circularly shaped inner conductive member and an outer conductive member, with an annularly shaped slot there between, the diode bridging the slot and with the cathode of the diode being coupled to one of the inner and outer conductive members and the anode of the diode being coupled to another one of the inner and outer conductive members. 9. The imager of claim 8 further including a capacitive element in the slot adjacent the diode. 10. A millimeter wave imager comprising: a spherical dielectric lens; and detectors mounted in multiple planar detector focal planes, bounded by triangles, the detectors in the planar focal planes being arranged as a geodesic configuration confronting the spherical dielectric lens. 11. The millimeter wave imager of claim 10 wherein the detectors are arranged on a chip of a semiconductor material having at least one integrated diode and at least one integrated antenna structure formed thereon. 12. The millimeter wave imager of claim 11 wherein the integrated diode and integrated antenna structure formed on the detector are electrically coupled to wires coupled to a data logger. 13. The millimeter wave imager of claim 10 wherein said detectors are mounted in multiple planar detector focal planes disposed exteriorly of said spherical dielectric lens. 14. A millimeter wave imager comprising: a spherical dielectric lens; and detectors mounted in multiple planar detector focal planes, bounded by triangles, the detectors in the planar focal planes being arranged as a geodesic configuration confronting the spherical dielectric lens, wherein the detectors are arranged on a chip of a semiconductor material having at least one integrated diode and at least one integrated antenna structure formed thereon, wherein the integrated antenna structure comprises a circularly shaped inner conductive member and an outer conductive member, with an annularly shaped slot there between, the diode bridging the slot and with the cathode of the diode being coupled to one of the inner and outer conductive members and the anode of the diode being coupled to another one of the inner and outer conductive members. 15. The millimeter wave imager of claim 14 further including a capacitive element in the slot adjacent the diode. 16. A structure comprising a plurality of planar circuit panels arranged in a predetermined configuration about a sphere of dielectric material, at least selected ones of the circuit panels having an array of densely placed monolithic detector chips disposed thereon, each monolithic detector chip comprising a body of semiconductor material with an integrated diode and integrated antenna and each circuit panel having a major surface arranged parallel to a tangent of the sphere of dielectric material. 17. The structure of claim 16, wherein the integrated antenna comprises a circularly shaped inner conductive member and an outer conductive member, with an annularly shaped slot therebetween, the diode bridging the slot and with the cathode of the diode being coupled to one of the inner and outer conductive members and the anode of the diode being coupled to another one of the inner and outer conductive members. 18. The structure of claim 16 wherein the plurality of planar circuit panels are formed from a single sheet of dielectric material, which is foldable along fold lines disposed between selected ones of the plurality of planar circuit panels, to form said structure about said sphere of dielectric material. 19. The structure of claim 16 wherein the sphere of dielectric material has a radially varying dielectric constant. 20. In combination, a single substrate material which is folded about a dielectric sphere to thereby assume a geodesic structure surrounding said dielectric sphere, the geodesic structure being defined by a plurality flat triangular planar circuit panels, at least selected ones of the circuit panels having an array of detectors disposed thereon. 21. A structure comprising a plurality of planar circuit panels arranged in a predetermined configuration about a sphere of dielectric material by folding along fold lines, at least selected ones of the circuit panels having an array of monolithic detector chips disposed thereon, each monolithic detector chip comprising a body of semiconductor material with an integrated diode and integrated antenna, the plurality of planar circuit panels, after folding on said fold lines, define a geodesic shape.