[특허]Power converter package and thermal management

Power converter package and thermal management 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-021/00
출원번호	UP-0014662 (2008-01-15)
등록번호	US-7799615 (2010-10-11)
발명자 / 주소	Vinciarelli, Patrizio LaFleur, Michael B. McCauley, Charles I. Starenas, Paul V.
출원인 / 주소	VLT, Inc.
대리인 / 주소	Fish & Richardson P.C.
인용정보	피인용 횟수 : 0 인용 특허 : 45

초록 ▼

Power conversion apparatus can include a circuit board with power conversion circuitry and a package. The package may be formed by encapsulating areas of the circuit board assembly either before or after the interface contacts are attached to the circuit board. A method for encapsulating two sides of a substrate can include providing a mold that fills a larger first cavity to create a sealing force on a smaller second cavity. The encapsulant flows through the first cavity into the second cavity. A thermal extender can include a surface for mounting a heat dissipating power converter and a surface for mating with an external circuit board. Interface conductors may mate with contacts on the heat dissipating power converter and with conductive regions on the external circuit board. A heat sink may be thermally coupled to remove heat generated by the power converter.

대표청구항 ▼

What is claimed is: 1. A method for encapsulating two sides of a substrate comprising: providing a mold including a first mold section having a first cavity for encapsulating a first region of a first surface of the substrate and a second mold section having a second cavity for encapsulating a second region of a second surface of the substrate; sealing the first mold section against the first surface of the substrate around a periphery of the first region; sealing the second mold section against the second surface of the substrate around a periphery of the second region; providing a fill conduit for introducing encapsulating material into the first cavity at a first end of the mold; and providing a channel having an opening in the first cavity for allowing encapsulating material to flow from the first cavity into the second cavity. 2. The method of claim 1 further comprising: forcing encapsulating material under pressure through the fill conduit; filling the second cavity with encapsulating material conducted through the channel from the first cavity. 3. The method of claim 1 wherein the fill conduit is provided at a first end of the mold and the channel opening in the first cavity is provided at an end opposite the first end. 4. A method for encapsulating two sides of a substrate comprising: closing a mold on the substrate, including a first mold section having a first cavity for encapsulating a first region of a first surface of the substrate and a second mold section having a second cavity for encapsulating a second region of a second surface of the substrate; creating a sealing force for forcing the substrate against the second mold section to seal the second cavity by injecting encapsulating material into the first cavity. 5. The method of claim 4 further comprising conducting encapsulating material through a channel from the first cavity to fill the second cavity. 6. The method of claim 5 wherein: the encapsulating material is injected into a first end of the first cavity and conducted from the first cavity from a second end opposite from the first end. 7. The method of claim 1 or 4 further comprising: providing a step-over cavity in the second mold section outside of the second cavity for accommodating features protruding from the second surface of the substrate. 8. The method of claim 1 or 4 wherein the second region is smaller than the first region. 9. The method of claim 1 or 5 wherein the channel comprises an aperture through the substrate. 10. The method of claim 1 or 4 further comprising: providing a step-over cavity in at least one of the mold sections outside of the respective first or second cavity, the step-over cavity accommodating features protruding from the first or second surface of the substrate. 11. A method for encapsulating two sides of a substrate comprising: providing a substrate having a first surface and a second surface; mounting a magnetic core to the substrate with a first portion of the core located in a first region of the first surface, the first portion extending above the first surface, and with a second portion of the core located in a second region of the second surface, the second portion extending above the second surface; providing an opening through the substrate; providing a mold including a first mold section having a first cavity for encapsulating the first region of the first surface of the substrate and a second mold section having a second cavity for encapsulating the second region of the second surface of the substrate; and providing a fill conduit for introducing encapsulating material into the first cavity. 12. The method of claim 11 wherein the substrate comprises a printed circuit board. 13. The method of claim 11 further comprising: closing the mold on the substrate; forcing encapsulating material under pressure through the fill conduit into the first cavity; and allowing encapsulant to pass from one of the first or second cavity to the other of the first or second cavity. 14. The method of claim 11 further comprising: filling the second cavity with encapsulating material conducted through the opening in the substrate from the first cavity. 15. A method for encapsulating two sides of a substrate comprising: providing a mold including a first mold section having a first cavity for encapsulating a first region of a first surface of the substrate and a second mold section having a second cavity for encapsulating a second region of a second surface of the substrate; using the substrate to seal the first cavity and the second cavity; providing an aperture in the substrate connecting the first and second cavities; providing a fill conduit for introducing encapsulating material into the first cavity at a first end of the mold; and flowing the encapsulating material from the first cavity through the aperture of the substrate into the second cavity.

이 특허에 인용된 특허 (45)

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Saxelby ; Jr. John R. ; Hedlund ; III Walter R., Circuit encapsulation process.
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McDonnal John E. (San Jose CA), DC to DC converter apparatus.
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Wallace James S. (Sugarland TX) Russell Ernie (Richmond TX) Baudouin Daniel (Missouri City TX), Edge-mounted, surface-mount integrated circuit device.
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Ohashi Shigeo (Tokyo JPX), Electrical control device.
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Martich Mark E., Electromechanical switching device package with controlled impedance environment.
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Martich Mark E., Electromechanical switching device package with controlled impedance environment.
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Craft Scott (Phoenix AZ), Electronic assembly having enhanced heat dissipating capabilities.
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de Simon Mauro,ITX, Electronic control unit for a vacuum pump.
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Ogawa, Toshio; Takahashi, Masaaki; Kamimura, Noritaka; Yamada, Kazuji; Kaminaga, Toshiaki, Electronic device and method of fabricating the same.
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Azar Kaveh, Enhanced cooling of a heat dissipating circuit element.
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Kim, Jong Sik, Heat dissipation structure of integrated circuit (IC).
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Boucard Michel (Tournefeuille FRX) Thirion Christian (Auterive FRX) Maurel Christian (Toulouse FRX), Housing for an electronic circuit.
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Lai Vincent (930 W. Maude Ave. Sunnyvale CA 94086) Hsu J. J. (930 W. Maude Ave. Sunnyvale CA 94086), IC package connector.
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Vinciarelli Patrizio ; Prager Jay, Low profile mounting of power converters with the converter body in an aperture.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Power converter package and thermal management 원문보기

초록 ▼

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연구과제 타임라인

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Power converter package and thermal management 원문보기

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