[특허]Microchannels for BioMEMS devices

Microchannels for BioMEMS devices 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-021/46 H01L-021/31
출원번호	UP-0045853 (2008-03-11)
등록번호	US-7799656 (2010-10-11)
발명자 / 주소	Ouellet, Luc Wright, Patrick
출원인 / 주소	DALSA Semiconductor Inc.
대리인 / 주소	Marks & Clerk
인용정보	피인용 횟수 : 0 인용 특허 : 108

초록

A method is disclosed for making a MEMS device wherein anhydrous HF exposed silicon nitride is used as a temporary adhesion layer allowing the transfer of a layer from a Carrier Wafer to a Device Wafer.

대표청구항 ▼

We claim: 1. A method of making a MEMS device, comprising: depositing a silicon nitride layer on a carrier wafer; chemically modifying said silicon nitride layer by exposure to anhydrous hydrofluoric acid to form a modified surface layer subject to thermal decomposition into gaseous by-products; forming a patterned first photopolymer layer on said modified surface layer; forming a patterned second photopolymer layer on a device wafer; bonding the patterned first and second photopolymer layers of the carrier wafer and the device wafer together to form an integrated device by applying heat and pressure; and applying heat to decompose said modified surface layer and thereby separate the carrier wafer from the device wafer. 2. A method as claimed in claim 1, wherein said carrier wafer and device wafer are silicon wafers. 3. A method as claimed in claim 1, wherein the silicon nitride layer is deposited by low pressure chemical vapor deposition at a temperature in a range from 750 to 900° C. 4. A method as claimed in claim 1, wherein said patterned first and second photopolymer layers comprise a negative tone photopolymer. 5. A method as claimed in claim 1, wherein said carrier and device wafers when bonded together form microchannels. 6. A method as claimed in claim 5, wherein the patterned first photopolymer layer on the carrier wafer forms a lid portion of said microchannels and said patterned second photopolymer layer on the device wafer forms a base of said microchannels. 7. A method as claimed in claim 1, wherein after separation of said carrier wafer and said device wafer, said bonded patterned first and second photopolymer layers are subjected to hardening treatment. 8. A method of forming a MEMS device containing microchannels, comprising: depositing a silicon nitride layer on a carrier wafer; modifying a surface portion of said silicon nitride layer by exposure to anhydrous hydrofluoric acid to form a modified surface layer; forming a patterned first photopolymer layer on said modified surface layer; forming a patterned second photopolymer layer on a device wafer; bonding said patterned first and second photopolymer layers together to form an integrated device containing the microchannels; and releasing said carrier wafer by heating said structures to decompose said modified surface layer. 9. A method as claimed in claim 8, wherein said patterned first photopolymer layer provides a lid portion of said microchannels, and said patterned second photopolymer layer provides a base portion of said microchannels. 10. A method as claimed in claim 8, wherein said patterned first and second photopolymer layers are stabilized by baking at a temperature not exceeding 95° C. prior to bonding said patterned first and second photopolymer layers together. 11. A method as claimed in claim 8, wherein after bonding said patterned first and second photopolymer layers are subjected to hardening treatment. 12. A method as claimed in claim 8, wherein said patterned first and second photopolymer layers are bonded together by applying heat and pressure to said carrier and device wafers. 13. A method as claimed in claim 8, wherein the silicon nitride layer has a thickness lying in the range of 0.05 μm to 1.0 μm. 14. A method as claimed in claim 8, wherein the patterned second photopolymer layer deposited on the device wafer is deposited in separate steps as two photopolymer sublayers. 15. A method as claimed in claim 8, wherein the exposure to anhydrous hydrofluoric acid is carried out in the presence of an organic volatile component. 16. A method as claimed in claim 8, wherein said carrier and device wafers are silicon wafers.

이 특허에 인용된 특허 (108)

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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연합인증

Microchannels for BioMEMS devices 원문보기

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Microchannels for BioMEMS devices 원문보기

초록

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연구과제 타임라인

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