Information processing apparatus
원문보기
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0165855
(2008-07-01)
|
등록번호 |
US-7800899
(2010-10-11)
|
우선권정보 |
KR-10-2007-0086584(2007-08-28) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Samsung Electronics Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
9 |
초록
▼
An information processing apparatus includes a casing having a first accommodating unit, and a second accommodating unit which protrudes from at least one area of the first accommodating unit; a main body which includes at least one heat generating component which is accommodated in the first accomm
An information processing apparatus includes a casing having a first accommodating unit, and a second accommodating unit which protrudes from at least one area of the first accommodating unit; a main body which includes at least one heat generating component which is accommodated in the first accommodating unit, and a port unit which is formed at an outer side of the first accommodating unit; and a heat radiating unit which is accommodated in the second accommodating unit, and discharges heat of the heat generating component to an outside of the casing.
대표청구항
▼
What is claimed is: 1. A mobile computing apparatus, comprising: a main body casing; a display pivotably coupled to the main body casing; a plurality of ports located at an outer side of the main body casing to electrically communicate with an external device; a heat generating component accommodat
What is claimed is: 1. A mobile computing apparatus, comprising: a main body casing; a display pivotably coupled to the main body casing; a plurality of ports located at an outer side of the main body casing to electrically communicate with an external device; a heat generating component accommodated in the main body casing; a cooling fan located in the main body casing to discharge heat generated by the heat generating component to an outside of the main body casing; and a heat discharge portion located at the outer side of the main body casing to discharge heated air moved by the cooling fan to outside the main body casing, wherein the main body casing includes an upper accommodating portion and a lower accommodating portion located below the upper accommodating portion, the lower accommodating portion includes at least an inwardly curved outer side that curves inwardly from the upper accommodating portion, and the heat discharge portion is provided at the inwardly curved outer side of the lower accommodating portion such that at least a part of the heat discharge portion is located below at least one of the plurality of ports provided at the upper accommodating portion. 2. The mobile computing apparatus according to claim 1, wherein the heat generating component is mounted to a lower surface of a printed circuit board located in the upper accommodating portion of the main body casing, and the cooling fan is situated in the lower accommodating portion so as to draw external air into an interior of the main body casing via an intake hole provided at least on the bottom surface of the lower accommodating portion and move the air across the heat generating component. 3. The mobile computing apparatus according to claim 2, wherein the lower accommodating unit comprises an intake hole separate from the heat discharge portion to enable external air to flow into an inside of the lower accommodating unit. 4. The mobile computing apparatus according to claim 1, wherein the heat generating component is mounted to a printed circuit board located in the upper accommodating unit, and the mobile computing apparatus comprises a heat transmitting unit which leads the heat generated from the mounted heat generating component to the cooling fan. 5. The mobile computing apparatus according to claim 4, wherein the heat generating component is mounted to a lower surface of the printed circuit board. 6. The mobile computing apparatus according to claim 4, wherein the heat generating component is mounted to an upper surface of the printed circuit board, and the heat transmitting unit comprises a through hole formed through the printed circuit board to transmit heat from the heat generating component. 7. The mobile computing apparatus according to claim 4, wherein the heat transmitting unit comprises a heat pipe which extends from the heat generating component to the cooling fan. 8. The mobile computing apparatus according to claim 4, wherein the cooling fan further comprises: a supporting member which supports the cooling fan against the printed circuit board so that the cooling fan can be distanced from a surface of the printed circuit board. 9. The mobile computing apparatus according to claim 4, wherein the heat generating component is positioned at a central portion of the printed circuit board. 10. A mobile computing apparatus, comprising: a main body casing including: an upper accommodating portion having at least one heat generating component accommodated therein and a port unit formed at an outer side thereof to electrically communicate with an external device, and a lower accommodating portion extending downward from and having a smaller area than the upper accommodating portion, the lower accommodating portion including a cooling fan which is accommodated therein and discharges heat of the heat generating component to an outside of the main body casing; and a display pivotably coupled to the main body casing, wherein the main body casing includes a heat discharge hole located at the outer side of the casing to discharge heated air moved by the cooling fan to outside the main body casing, the lower accommodating portion includes an inwardly curved outer side that curves inwardly from the upper accommodating portion such that a bottom surface of the lower accommodating portion covers a smaller horizontal area than the upper accommodating portion, and the heat discharge hole is provided at the inwardly curved outer side of the lower accommodating portion such that a portion of the heat discharge hole is located below the port provided at the upper accommodating portion. 11. The mobile computing apparatus according to claim 10, wherein the lower accommodating unit is inwardly stepped with respect to the first accommodating unit. 12. The mobile computing apparatus according to claim 11, wherein the lower accommodating unit further includes: an intake hole to intake external air and a discharge hole to discharge air including air from the cooling fan. 13. The mobile computing apparatus according to claim 12, further comprising: a heat transmitting unit to transmit heat generated from the at least one heat generating component to the cooling fan. 14. The mobile computing apparatus according to claim 10, wherein the heat generating component is mounted to a lower surface of a printed circuit board located in the upper accommodating portion of the casing, and the cooling fan is situated in the lower accommodating portion so as to draw external air into an interior of the main body casing via an intake hole provided at least on the bottom surface of the lower accommodating portion and move the air across the heat generating component. 15. A mobile computing apparatus, comprising: a main body casing including: an upper accommodating portion having a data port in one side thereof and a heat generating unit on an inside thereof; and a lower accommodating portion protruding from the upper accommodating portion, the lower accommodating portion including a cooling fan to receive heat from the heat generating unit and to expel the heat from the heat dissipation portion; and a display pivotably coupled to the main body casing, wherein the main body casing includes a heat discharge hole located at the outer side of the casing to discharge heated air moved by the cooling fan to outside the main body casing, the lower accommodating portion includes an inwardly curved outer side that curves inwardly from the upper accommodating portion such that a bottom surface of the lower accommodating portion covers a smaller horizontal area than the upper accommodating portion, and the heat discharge hole is provided at the inwardly curved outer side of the lower accommodating portion such that a portion of the heat discharge hole is located below the port provided at the upper accommodating portion. 16. The mobile computing apparatus according to claim 15, wherein at least one side edge of the lower accommodation portion is offset inwardly from a corresponding side edge of the main portion. 17. The mobile computing apparatus according to claim 16, wherein the lower accommodating portion includes a vent in the side edge portion that is offset inwardly from the corresponding side edge of the upper accommodating portion.
이 특허에 인용된 특허 (9)
-
Kitahara,Chihei, Cooling apparatus having an electronic fan for cooling an electronic apparatus.
-
Tomioka,Kentaro, Cooling device and electronic apparatus.
-
Hata, Yukihiko; Tomioka, Kentaro, Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit.
-
Tomioka Kentaro,JPX, Electronic apparatus with a fan unit, extension apparatus for extending the function of an electronic apparatus, and electronic apparatus system.
-
Hiroshi Nakamura JP; Kazuya Shibasaki JP, Electronic equipment system and extension device for expanding the functions of electronic equipment.
-
Lai, Chih-Hsi, Heat dissipation apparatus.
-
DeLuga,Ronald E.; Moore,Earl; Doczy,Paul, Portable computer power system.
-
Fujiwara, Norio, Portable information processing apparatus.
-
Chen,Yung Hui; Lin,Po An, Waterproof thermal management module and portable.
이 특허를 인용한 특허 (1)
-
Degner, Brett W.; Andre, Bartley K.; Bataillou, Jeremy D.; Nigen, Jay S.; Ligtenberg, Christiaan A.; Hopkinson, Ron A.; Schwalbach, Charles A.; Casebolt, Matthew P.; Rundle, Nicholas A.; Liang, Frank F., Optimized vent walls in electronic devices.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.