IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0947539
(2004-09-23)
|
등록번호 |
US-7805954
(2010-10-26)
|
우선권정보 |
JP-2004-149618(2004-05-19) |
발명자
/ 주소 |
- Yamanaka, Kazunori
- Nakanishi, Teru
|
출원인 / 주소 |
|
대리인 / 주소 |
Krantz, Quintos & Hanson, LLP
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
8 |
초록
▼
The high-frequency circuit cooling apparatus comprises a package container 14 for housing a high-frequency circuit, a tank 16 for storing a gas to be introduced into the package container 14, a cold head 12 for cooling the package container 14 and the tank 16, pipes 24, 26 connected to the tank 16,
The high-frequency circuit cooling apparatus comprises a package container 14 for housing a high-frequency circuit, a tank 16 for storing a gas to be introduced into the package container 14, a cold head 12 for cooling the package container 14 and the tank 16, pipes 24, 26 connected to the tank 16, for supplying the gas into the tank 16, pipes 18, 22 detachably connected between the tank 16 and the package container 14, for introducing the gas in the tank 16 into the package container 14, and pipes 34, 36 detachably connected to the package container 14, for discharging the gas in the package container 14.
대표청구항
▼
What is claimed is: 1. A high-frequency circuit cooling apparatus comprising: a package container for housing a high-frequency circuit; a tank for storing a gas to be introduced into the package container; a cooling unit for cooling the package container and the tank; a first pipe connected to the
What is claimed is: 1. A high-frequency circuit cooling apparatus comprising: a package container for housing a high-frequency circuit; a tank for storing a gas to be introduced into the package container; a cooling unit for cooling the package container and the tank; a first pipe connected to the tank, for supplying the gas into the tank; a second pipe detachably connected between the tank and the package container, for introducing the gas in the tank into the package container; and a third pipe detachably connected to the package container, for discharging the gas in the package container, wherein the package container includes a container of ceramics and a metal film formed on a inside wall of the container. 2. The high-frequency circuit cooling apparatus according to claim 1, further comprising a vacuum container accommodating the cooling unit, the package container and the tank. 3. The high-frequency circuit cooling apparatus according to claim 2, wherein the container is formed of alumina, zirconia, partially stabilized zirconia or stabilized zirconia, and the metal film is formed of gold, silver or copper. 4. The high-frequency circuit cooling apparatus according to claim 1, wherein the container is formed of alumina, zirconia, partially stabilized zirconia or stabilized zirconia, and the metal film is formed of gold, silver or copper. 5. A high-frequency circuit cooling apparatus comprising: a package container for housing a high-frequency circuit; a tank for storing a gas to be introduced into the package container; a cooling unit for cooling the package container and the tank; a first pipe connected to the tank, for supplying the gas into the tank; a second pipe detachably connected between the tank and the package container, for introducing the gas in the tank into the package container; and a third pipe detachably connected to the package container, for discharging the gas in the package container, wherein a connection between the second pipe and the package container, and a connection between the third pipe and the package container are sealed by metal seals. 6. The high-frequency circuit cooling apparatus according to claim 5, further comprising a vacuum container accommodating the cooling unit, the package container and the tank. 7. A high-frequency circuit cooling apparatus comprising: a package container for housing a high-frequency circuit; a tank for storing a gas to be introduced into the package container; a cooling unit for cooling the package container and the tank; a first pipe connected to the tank, for supplying the gas into the tank; a second pipe detachably connected between the tank and the package container, for introducing the gas in the tank into the package container; and a third pipe detachably connected to the package container, for discharging the gas in the package container, wherein the package container and/or the tank are in contact with the cooling unit via a solid medium having heat conductivity. 8. The high-frequency circuit cooling apparatus according to claim 7, further comprising a vacuum container accommodating the cooling unit, the package container and the tank. 9. The high-frequency circuit cooling apparatus according to claim 8, wherein the solid medium is hydrogen carbide grease, indium sheet or graphite. 10. The high-frequency circuit cooling apparatus according to claim 7, wherein the solid medium is hydrogen carbide grease, indium sheet or graphite. 11. A high-frequency circuit cooling apparatus comprising: a package container for housing a high-frequency circuit; a tank for storing a gas to be introduced into the package container; a cooling unit for cooling the package container and the tank; a first pipe connected to the tank, for supplying the gas into the tank; a second pipe detachably connected between the tank and the package container, for introducing the gas in the tank into the package container; a third pipe detachably connected to the package container, for discharging the gas in the package container; a gas supply unit for supplying the gas into the tank; a temperature sensor disposed near the package container, for detecting a temperature of a vicinity of the package container; and a control unit for controlling a supply of the gas of the gas supply unit into the tank, based on a result of a detection of the temperature near the vicinity of the package container given by the temperature sensor. 12. The high-frequency circuit cooling apparatus according to claim 11, further comprising a vacuum container accommodating the cooling unit, the package container and the tank.
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