초록 ▼

The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC)

The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC) tape and LED modules in the formation of lighting devices including, but not limited to, LED devices, High Brightness (HB) LED backlights, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display lighting.

대표청구항 ▼

What is claimed is: 1. A light emitting diode module having two or more LTCC (low temperature co-fired ceramic) tape layers; each tape layer comprising 40 to 70 weight percent glass frit; 30 to 60 weight percent refractory ceramic filler; 0 to 10 weight percent of one or more inorganic pigments; di

What is claimed is: 1. A light emitting diode module having two or more LTCC (low temperature co-fired ceramic) tape layers; each tape layer comprising 40 to 70 weight percent glass frit; 30 to 60 weight percent refractory ceramic filler; 0 to 10 weight percent of one or more inorganic pigments; dispersed in organic medium, wherein said refractory ceramic filler and said inorganic pigment have a refractive index in the range of 1.5 to 3.5 and said refractory ceramic filler has a flexural strength of at least 150 MPa; having one or more cavities in said tape layers; having at least two electrical vias and at least one thermal via in said tape layers; having at least one functioning light emitting diode chip; wherein said LTCC (low temperature co-fired ceramic) tape layers provide a desired circuit pattern and said circuit pattern is electrically connected through said electrical vias, thus, forming a functioning chip carrier and wherein at least one functioning light emitting diode chip is mounted to said chip carrier and wherein at least one thermal via is connected to a heat sink and wherein said thermal via dissipates heat released from said functioning light emitting diode chip through its connection to said heat sink; wherein at least three functioning light emitting diode chips are mounted to said chip carrier and wherein the color of said functioning light emitting diode chips is selected from white, red, green, and blue. 2. The light emitting diode module of claim 1 wherein said functioning light emitting diode chips have an operating wattage of equal to or greater than 0.5 watts. 3. The light emitting diode module of claim 1 wherein said functioning light emitting diode chips have an operating wattage of equal to or greater than 1.0 watts.