IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0721128
(2005-12-13)
|
등록번호 |
US-7816770
(2010-11-08)
|
우선권정보 |
FR-04 52994(2004-12-15) |
국제출원번호 |
PCT/FR2005/051077
(2005-12-13)
|
§371/§102 date |
20070607
(20070607)
|
국제공개번호 |
WO06/064158
(2006-06-22)
|
발명자
/ 주소 |
|
출원인 / 주소 |
- Commissariat a l'Energie Atomique
- Centre National d'Etudes Spatiales
|
대리인 / 주소 |
Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
6 |
초록
▼
To hermetically seal a cavity in a microelectronic component, a cap located in a sealing device is positioned above the orifice opening into the cavity. The cap plastically deforms to seal the cavity. The sealing device includes a cavity permitting the cavity of the microelectronic component to be f
To hermetically seal a cavity in a microelectronic component, a cap located in a sealing device is positioned above the orifice opening into the cavity. The cap plastically deforms to seal the cavity. The sealing device includes a cavity permitting the cavity of the microelectronic component to be filled. The sealing device slides along the component so as to be positioned opposite either the filling cavity, or the cap.
대표청구항
▼
The invention claimed is: 1. A hermetic sealing device of a microelectronic component including a cavity opening via an orifice onto a first surface, the sealing device comprising: a second surface configured to cooperate with the first surface; and a cap adjacent to the second surface, wherein at
The invention claimed is: 1. A hermetic sealing device of a microelectronic component including a cavity opening via an orifice onto a first surface, the sealing device comprising: a second surface configured to cooperate with the first surface; and a cap adjacent to the second surface, wherein at least one part of the cap is a plastically deformable material, and the hermetic sealing device is configured to position the cap partially into the orifice of the cavity, in its non deformed state, and to hermetically obstruct the orifice of the microelectronic component with the cap in a plastic deformed state. 2. The hermetic sealing device according to claim 1, further comprising a first cavity open on the second surface, in which the cap is housed. 3. The hermetic sealing device according to claim 1, further comprising a first cavity that traverses and is open, or configured to open, onto the second surface, located at a distance that is not zero from the cap. 4. The hermetic sealing device according to claim 1, in which the plastically deformable material is a soft metal. 5. The hermetic sealing device according to claim 1, in which the cap comprises an inert core and a part made of meltable material. 6. The hermetic sealing device according to claim 1, further comprising means for connecting the cap to a pressure tool. 7. The hermetic sealing device according to claim 1, in which the cap substantially has a shape of a mushroom comprising a base and a cover made of a semi-conductor material, and one part in meltable material located on the surface of the cover attached to the base, wherein the height of the cap between the surface of the cover opposite the base and the end of the base opposite the cover is between 100 μm and 1 mm. 8. A system comprising the hermetic sealing device according to claim 1 and the microelectronic component comprising the cavity opening via the orifice onto the first surface, that can slide with respect to the second surface of the hermetic sealing device. 9. The system according to claim 8, in which the first and the second surface are flat. 10. The system according to claim 8, in which the first surface of the component comprises a metallic coating. 11. The system according to claim 8, in which the first surface comprises a deposit of meltable material. 12. The system according to claim 8, in which the cap is composed at least partially of a same material as a layer of the component adjacent to the first surface. 13. The system according to claim 8, further comprising guiding means for controlling movement of the device with respect to the component. 14. A hermetic sealing process of a cavity of a microelectronic component opening via an orifice, comprising: providing a hermetic sealing device for the microelectronic component, the hermetic sealing device including a second surface configured to cooperate with a first surface, and a cap adjacent to the second surface, wherein at least one part of the cap is a plastically deformable material, and the hermetic sealing device is configured to position the cap partially into the orifice of the cavity, in its non deformed state, and to hermetically obstruct the orifice of the microelectronic component with the cap in a plastic deformed state; using the hermetic sealing device to position the cap partially into the orifice of the cavity, in its non deformed state; and plastically deforming the cap so as to obstruct the orifice hermetically. 15. The process according to claim 14, in which the cap is configured to be in light contact with a surface of the component after plastic deformation. 16. The process according to claim 14, in which the device is positioned by sliding the device along the microelectronic component. 17. The process according to claim 14, comprising positioning of the device on the component, filling of the cavity, and sliding of the device. 18. A hermetic sealing device of a first surface of a microelectronic component, the sealing device comprising: a second surface; first and second cavities opening onto, or configured to communicate with, the second surface, wherein the second cavity traverses, wherein a cap is housed inside the first cavity and adjacent to the second surface, and wherein at least one part of the cap is a plastically deformable material and the hermetic sealing device is configured to position the cap partially into an orifice of the microelectronic component in its non-deformed state, and to hermetically obstruct the orifice of the microelectronic component with the cap in a plastic deformed state. 19. The hermetic sealing device according to claim 18, further comprising means for connecting the second cavity to a system for pumping or filling. 20. The hermetic sealing device according to claim 18, further comprising means for bringing into communication the first cavity and the second cavity.
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