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Coating for reducing contamination of substrates during processing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
  • H01L-021/306
  • H01L-021/683
  • C23F-001/00
  • B23B-031/38
출원번호 UP-0786876 (2004-02-24)
등록번호 US-7824498 (2010-11-22)
발명자 / 주소
  • Parkhe, Vijay D.
  • Ahmann, Kurt J.
  • Tsai, Matthew C.
  • Sansoni, Steve
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Janah, Ashok K.
인용정보 피인용 횟수 : 10  인용 특허 : 43

초록

A substrate support has a support structure and a coating on the support structure having a carbon-hydrogen network. The coating has a contact surface having a coefficient of friction of less than about 0.3 and a hardness of at least about 8 GPa. The contact surface of the coating is capable of redu

대표청구항

What is claimed is: 1. A substrate support comprising: (a) a ceramic structure having an electrode embedded therein, the electrode being chargeable to electrostatically hold a substrate; and (b) a contact surface comprising a plurality of mesas, the mesas comprising a coating of a diamond-like carb

이 특허에 인용된 특허 (43)

  1. Zide, Barry M.; Kirkpatrick, Sean R., Apparatus and method for reduced particulate generation during workpiece handling.
  2. Tanga Michifumi,JPX ; Kitagawa Takahiro,JPX, Articles with diamond coating formed thereon by vapor-phase synthesis.
  3. Goel Arvind (Buffalo NY) Bray Donald J. (East Amherst NY) Martin Steven C. (Williamsville NY) Blakely Keith A. (Buffalo NY), Capacitive thin films using diamond-like nanocomposite materials.
  4. Phillip R. Sommer ; Paul B. Butterfield ; Manoocher Birang, Chemical mechanical planarization system.
  5. Neerinck Dominique,BEX ; Persoone Peter,BEX, Coating comprising layers of diamond like carbon and diamond like nanocomposite compositions.
  6. Donohue,Timothy J., Conditioner disk for use in chemical mechanical polishing.
  7. Suzuki Kenji JP; Raijiro Koga JP, Conditioning disk for conditioning a polishing pad.
  8. Frihart Charles Richard ; Kliwinski Joseph, Conductive wire coating.
  9. Massler, Orlaw; Pedrazzini, Mauro; Wohlrab, Christian; Eberle, Hubert; Grischke, Martin, DLC coating system and process and apparatus for making coating system.
  10. Massler,Orlaw; Pedrazzini,Mauro; Wohlrab,Christian; Eberle,Hubert; Grischke,Martin; Michler,Thorsten, DLC layer system and method for producing said layer system.
  11. Han, Nianci; Shih, Hong; Sun, Jennifer Y.; Xu, Li, Diamond coated parts in a plasma reactor.
  12. O'Donnell, Robert J.; Daugherty, John E.; Chang, Christopher C., Diamond coatings on reactor wall and method of manufacturing thereof.
  13. Fernandez, Andres; Thomas, Timothy; Chen, Xiaolan; Coyle, Steven T.; Yu, Ming; Mankos, Marian, Diamond supported photocathodes for electron sources.
  14. Neerinck Dominique,BEX ; Goel Arvind, Diamond-like nanocomposite compositions.
  15. Dorfman Veniamin F. ; Goel Arvind, Diamond-like nanocomposite corrosion resistant coatings.
  16. Dambrine Marc,FRX ; Geromini Osvaldo La Violette,CHX ; Janot Denis,FRX, Die for forming extrudate having two visible longitudinal components.
  17. Larsen Grant Kenji, Electrostatic wafer clamp having low particulate contamination of wafers.
  18. Sorensen Carl A. ; Winkler Daniel, Heating element with a diamond sealing material.
  19. Sorensen Carl A. ; Winkler Daniel, Heating element with a diamond sealing material.
  20. Shamouilian Shamouil ; Kumar Ananda H. ; Kholodenko Arnold ; Grimard Dennis S. ; Mohn Jonathan D. ; Chafin Michael G. ; Collins Kenneth S., High density plasma process chamber.
  21. Grimard Dennis S. ; Parkhe Vijay ; Levinstein Hyman ; Chen Fusen ; Chafin Michael G., Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported ther.
  22. Seamons,Martin Jay; Yeh,Wendy H.; Rathi,Sudha S. R.; Padhi,Deenesh; Luan,Andy (Hsin Chiao); Tang,Sum Yee Betty; Kulkarni,Priya; Sivaramakrishnan,Visweswaren; Kim,Bok Hoen; M'Saad,Hichem; Wang,Yuxiang May; Kwan,Michael Chiu, Liquid precursors for the CVD deposition of amorphous carbon films.
  23. Sastri Suri A. (Lexington MA) Pemsler J. Paul (Lexington MA) Cooke Richard A. (Framingham MA) Litchfield John K. (Bedford MA) Smith Mark B. (Ipswich MA), Metal-bonded, carbon fiber-reinforced composites.
  24. Bache Roger J. (Lower Earley GB2) Parker Colin F. (Tilehurst GB2), Method and apparatus for forming or modifying cutting edges.
  25. Ravi Kramadhati, Method and apparatus for the use of diamond films as dielectric coatings on electrostatic chucks.
  26. Dorfman Veniamin (8 Norman Dr. Shoreham NY 11786) Pypkin Boris (Moscow SUX), Method for forming diamond-like nanocomposite or doped-diamond-like nanocomposite films.
  27. Dominique Neerinck BE; Peter Persoone BE; Marc Sercu BE, Method for making a non-sticking diamond-like nanocomposite.
  28. Otsuki Masashi,JPX ; Wada Hiroaki,JPX ; Takahashi Yoshitomo,JPX ; Saito Tasuku,JPX, Method for producing sintered silicon carbide.
  29. Wang, Yuxiang May; Rathi, Sudha S. R.; Kwan, Michael Chiu; M'Saad, Hichem, Method of depositing an amorphous carbon film for etch hardmask application.
  30. Sugiyama Osamu,JPX ; Miya Yukio,JPX ; Koike Ryota,JPX ; Toida Takashi,JPX ; Sekine Toshiichi,JPX, Method of forming hard carbon film over the inner surface of guide bush.
  31. Anderson Robert A. (Albuquerque NM) Seager Carleton H. (Albuquerque NM), Micromachined silicon electrostatic chuck.
  32. Yeh, Wendy H.; Ahn, Sang; Bencher, Christopher Dennis; M'Saad, Hichem; Rathi, Sudha, Nitrogen-free antireflective coating for use with photolithographic patterning.
  33. Sathrum Paul E. (Sparta NJ) Coll Bernard F. (Sparta NJ), Plasma enhancement apparatus and method for physical vapor deposition.
  34. Yamazaki Shunpei (Atsugi JPX) Tsuchiya Mitsunori (Atsugi JPX) Kawano Atsushi (Atsugi JPX) Imatou Shinji (Atsugi JPX) Nakashita Kazuhisa (Atsugi JPX) Hamatani Toshiji (Atsugi JPX) Inushima Takashi (At, Plasma processing method and apparatus.
  35. Yamazaki Shunpei (Tokyo JPX) Tsuchiya Mitsunori (Atsugi JPX) Hayashi Shigenori (Atsugi JPX) Hirose Naoki (Atsugi JPX) Ishida Noriya (Atsugi JPX) Sasaki Mari (Atsugi JPX) Kawano Atsushi (Isehara JPX), Plasma processing method and apparatus.
  36. Takahashi Yoshitomo,JPX ; Wada Hiroaki,JPX ; Miyamoto Taro,JPX, Process for making a silicon carbide sintered body.
  37. Takahashi Yoshitomo,JPX ; Wada Hiroaki,JPX ; Satou Akira,JPX, Process for making heater member.
  38. Otsuki Masashi,JPX ; Endo Shigeki,JPX, Product holder.
  39. Chang Chow Ling, Semiconductor processing chamber having diamond coated components.
  40. Takahashi Yoshitomo,JPX ; Wada Hiroaki,JPX ; Satou Akira,JPX, Sputtering target disk.
  41. Bou Pierre,FRX ; Herbin Renee,FRX ; Rats David,FRX ; Vandenbulcke Lionel,FRX, Surface treatment of carbonaceous material for making a subsequent deposit of diamond adherent and diamond-covered piec.
  42. Ravi Kramadhati, Use of carbon-based films in extending the lifetime of substrate processing system components.
  43. Kaihotsu Hideki (Tokyo JPX) Shimeno Kazuhiro (Tokyo JPX) Tometsuka Kouji (Tokyo JPX), Wafer transfer plate.

이 특허를 인용한 특허 (10)

  1. Shinozaki, Hiroyuki, Dresser disk.
  2. Cooke, Richard A., Electrostatic chuck.
  3. Lin, I-Kuan; Cooke, Richard A.; Rybczynski, Jakub, Electrostatic chuck with photo-patternable soft protrusion contact surface.
  4. Lin, I-Kuan; Cooke, Richard A.; Rybczynski, Jakub, Electrostatic chuck with photo-patternable soft protrusion contact surface.
  5. Cooke, Richard A.; Richard, Nate; Donnell, Steven; Vose, Mark; Liu, Yan, Electrostatic chuck with polymer protrusions.
  6. Cooke, Richard A.; Stone, Dale K.; Stone, Lyudmila; Blake, Julian; Suuronen, David, High surface resistivity electrostatic chuck.
  7. Hosoba, Miyuki; Sakata, Junichiro; Ohara, Hiroki; Yamazaki, Shunpei, Method for manufacturing semiconductor device.
  8. Sun, Jennifer Y.; Thach, Senh; Kanungo, Biraja P.; Firouzdor, Vahid, Substrate support assembly having a plasma resistant protective layer.
  9. Parkhe, Vijay D.; Narendrnath, Kadthala Ramaya, Substrate support assembly having metal bonded protective layer.
  10. Boyd, Jr., Wendell Glenn; Parkhe, Vijay D.; Kuo, Teng-Fang; Ding, Zhenwen, Substrate support assembly with deposited surface features.
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