초록 ▼

A process for synthesizing formulations for polyimides suitable for use in high-temperature composites in which all reactions other than chain-extension have already taken place prior to making a composite is described, wherein the resulting oligomers comprise a backbone and at least one difunctiona

A process for synthesizing formulations for polyimides suitable for use in high-temperature composites in which all reactions other than chain-extension have already taken place prior to making a composite is described, wherein the resulting oligomers comprise a backbone and at least one difunctional endcap. The resulting resin systems have only the single step of endcap-to-endcap reactions during composite processing. Prior to the initiation temperature of these endcap-to-endcap reactions, the resins are stable affording the composite manufacturer a very large processing window.

대표청구항 ▼

That which is claimed: 1. A method for forming a polymeric composite comprising: (i) reacting an aromatic dianhydride directly with at least one dinadic phenyl amine endcap to form polyimide oligomers, wherein the oligomers may then only react through endcap-to-endcap reactions and are otherwise la

That which is claimed: 1. A method for forming a polymeric composite comprising: (i) reacting an aromatic dianhydride directly with at least one dinadic phenyl amine endcap to form polyimide oligomers, wherein the oligomers may then only react through endcap-to-endcap reactions and are otherwise latent and unreactive below the temperature at with these reactions occur; (ii) impregnating reinforcing materials with an effective amount of the polyimide oligomers; (iii) curing the polyimide oligomers by subjecting the polyimide oligomer impregnated materials to temperatures ranging from about 200° C. to about 350° C. at pressures ranging from about atmospheric to about 1000 p.s.i. 2. A method of forming a polymeric composite according to claim 1, wherein the reinforcing materials comprise glass fibers. 3. A method of forming a polymeric composite according to claim 1, wherein the aromatic dianhydride is a compound selected from the group consisting of 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, 3,4,3′,4′-biphenyltetracarboxylic dianhydride, 2,2 bis (3′,4′-dicarboxy phenyl) hexafluoro propane dianhydride, 2,3,3′,4′-biphenyltetracarboxylic dianhydride, and 2,3,3′,4′-biphenyltetracarboxylic dianhydride. 4. A method of forming a polymeric composite according to claim 1, wherein the aromatic dianhydride comprises: wherein R is selected from the group consisting of wherein L is —CH2—, —(CH3)2C—, —(CH3)2C—, —O—, —S—, —SO2— or —CO—; wherein y is —SO2—, —S—, —(CF3)2C—, —O—, or —(CH3)2C—; and n is selected such that the molecular weight does not exceed about 3000. 5. A method of forming a polymeric composite according to claim 1, wherein the dinadic phenyl amine comprises: wherein (NA) is nadic anhydride illustrated by the formula: 6. A method of forming a polymeric composite according to claim 5, wherein the polyimide oligomer impregnated materials are subjected to a pressure during the curing process that is sufficient to re-dissolve any cyclopentadiene that releases during the curing process. 7. A method for forming a polymeric composite comprising: (i) forming a polyimide oligomer by directly reacting an aromatic dianhydride with at least one amine functional endcap to form the polyimide oligomer, wherein the resulting polyimide oligomers may then only react through endcap-to-endcap reactions and are otherwise latent and unreactive below the temperature at with these reactions occur; (ii) impregnating reinforcing materials with an effective amount of the resulting polyimide oligomers; (iii) curing the polyimide oligomers by subjecting the polyimide oligomer impregnated materials to temperatures ranging from about 200° C. to about 350° C. at pressures ranging from about atmospheric to about 1000 p.s.i. 8. A method of forming a polymeric composite according to claim 7, wherein the reinforcing materials comprise glass fibers. 9. A method of forming a polymeric composite according to claim 7, wherein the aromatic dianhydride is a compound selected from the group consisting of 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, 3,4,3′,4′-biphenyltetracarboxylic dianhydride, 2,2 bis (3′,4′-dicarboxy phenyl) hexafluoro propane dianhydride, 2,3,3′,4′-biphenyltetracarboxylic dianhydride, and 2,3,3′,4′-biphenyltetracarboxylic dianhydride. 10. A method of forming a polymeric composite according to claim 7, wherein the aromatic dianhydride comprises: wherein R is selected from the group consisting of wherein L is —CH2—, —(CH3)2C—, —(CH3)2C—, —O—, —S—, —SO2— or —CO—; wherein y is —SO2—, —S—, —(CF3)2C—, —O—, or —(CH3)2C—; and n is selected such that the molecular weight does not exceed about 3000. 11. A method of forming a polymeric composite according to claim 7, wherein the endcap comprises: wherein (NA) is nadic anhydride illustrated by the formula: 12. A method of forming a polymeric composite according to claim 11, wherein the polyimide oligomer impregnated materials are subjected to a pressure during the curing process that is sufficient to re-dissolve any cyclopentadiene that releases during the curing process.