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Thermal control through a channel structure is disclosed. In one embodiment, an apparatus includes devices operable at an undesired temperature relative to a desired operating temperature, a vented cover of each of devices, and a channel structure formed along a side face of each of the devices, the

Thermal control through a channel structure is disclosed. In one embodiment, an apparatus includes devices operable at an undesired temperature relative to a desired operating temperature, a vented cover of each of devices, and a channel structure formed along a side face of each of the devices, the channel structure having any number of ridges to transfer a gas between the vented cover and an external location to the apparatus. The gas may modify an operating state of the devices from the undesired temperature to the desired operating temperature. A heat structure coupled to the vented cover and the side face may absorb a portion of an energy dissipated by at least one of the devices. A printed circuit board may be formed along an opposite face relative to the vented cover to enable the gas to escape to the external location through a cavity of the apparatus.

대표청구항 ▼

What is claimed is: 1. An apparatus comprising: a plurality of devices operable at an undesired temperature relative to a desired operating temperature; a vented cover of each of the plurality of devices; and a channel structure formed along a side face of each of the plurality of devices, the chan

What is claimed is: 1. An apparatus comprising: a plurality of devices operable at an undesired temperature relative to a desired operating temperature; a vented cover of each of the plurality of devices; and a channel structure formed along a side face of each of the plurality of devices, the channel structure having a plurality of ridges to transfer a gas between the vented cover and an external location to the apparatus, wherein a printed circuit board formed along an opposite face relative to the vented cover to enable the gas to escape to the external location through a cavity of the apparatus, wherein the printed circuit board is carved in a saw-tooth pattern along a periphery of the printed circuit board to provide optimal escape characteristics. 2. The apparatus of claim 1 wherein the gas is used to modify an operating state of the plurality of devices from the undesired temperature to the desired operating temperature. 3. The apparatus of claim 1 further comprising a heat structure coupled to the vented cover and the side face to absorb a portion of an energy dissipated by at least one of the plurality of devices. 4. The apparatus of claim 3 wherein the heat structure is formed along multiple sides of each of the plurality of devices. 5. The apparatus of claim 4 wherein the heat structure includes a hollow core to channel the gas through the heat structure to a gap between adjacent ones of the plurality of ridges. 6. The apparatus of claim 1 further comprising the printed circuit board formed along the opposite face relative to the vented cover to enable the gas to escape to the external location through the cavity of the apparatus. 7. The apparatus of claim 6 wherein the printed circuit board is carved in the saw-tooth pattern along the periphery of the printed circuit board to provide optimal escape characteristics. 8. The apparatus of claim 7 wherein the printed circuit board includes a contiguous region formed in an area between adjacent ones of the plurality of devices. 9. The apparatus of claim 1 wherein the plurality of devices are electrically coupled together to form a storage array. 10. A method of forming an array structure, comprising: forming a series of ridges along opposite faces of a plurality of devices of the array structure; removing a portion of a material of a front cover associated with the array structure; and patterning a periphery of a printed circuit board of the array structure such that a rear gap formed along the periphery aligns with a channel gap between adjacent ones of the series of ridges, and wherein the printed circuit board is carved in a saw-tooth pattern along a periphery of the printed circuit board to provide optimal escape characteristics. 11. The method of claim 10 further comprising attaching a heat absorber to at least one face of each of the plurality of devices to dissipate a heat produced when an electromechanical unit in each of the plurality of devices is operating. 12. The method of claim 10 further comprising bending a channeled pipe at a right angle; and positioning one portion of the channeled pipe along the front cover and another portion aligned with a gap between adjacent ones of the series of ridges. 13. The method of claim 10 wherein the removing the portion of the material of the front cover forms a series of vents in the front cover. 14. The method of claim 13 further comprising patterning a printed circuit board positioned along an opposite face relative to the front cover to enable a gas to escape to an external location when channeled from the series of vents to a cavity of the array structure behind the printed circuit board. 15. The method of claim 14 wherein the printed circuit board is carved in a saw tooth pattern along a periphery of the printed circuit board to provide optimal escape characteristics, and wherein the printed circuit board includes a contiguous region formed in an area between adjacent ones of the plurality of devices. 16. A system, comprising: a network; a storage array of devices stacked flush against each other; a data processing system coupled to the storage array through the network; a motion generator positioned in front of the storage array to direct generate gas flow into the devices by controlling the velocity of the gas through at least one of an upper surface and a lower surface of each of the devices forming the storage array; a connector to couple each device of the storage array of devices with other devices of the storage array of devices; and a printed circuit board of the storage array formed with a contiguous material at a center location between adjacent ones of the devices of the storage array, wherein the printed circuit board is patterned in a saw-tooth pattern along a periphery of the printed circuit board. 17. The network of claim 16 further comprising a heat absorber coupled with the storage array to dissipate a heat produced when at least one electro-mechanical unit in the storage array is operating. 18. The network of claim 16 further comprising a housing that encompasses the motion generator and the storage array in a single structure.