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Exemplary lead assemblies include a lead body having a plurality of conductor wires embedded therein, a plurality of electrode contacts at least partially disposed on an outer surface of the lead body, and a plurality of switching networks each configured to control an operation of one or more of th

Exemplary lead assemblies include a lead body having a plurality of conductor wires embedded therein, a plurality of electrode contacts at least partially disposed on an outer surface of the lead body, and a plurality of switching networks each configured to control an operation of one or more of the plurality of electrode contacts.

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What is claimed is: 1. A lead assembly comprising: a lead body having a plurality of conductor wires embedded therein, wherein the plurality of conductor wires comprises an input/output wire, a ground wire, an anode wire and a cathode wire, wherein the input/output wire, the ground wire, the anode

What is claimed is: 1. A lead assembly comprising: a lead body having a plurality of conductor wires embedded therein, wherein the plurality of conductor wires comprises an input/output wire, a ground wire, an anode wire and a cathode wire, wherein the input/output wire, the ground wire, the anode wire and the cathode wire are separate wires; a plurality of electrode contacts at least partially disposed on an outer surface of said lead body; and a plurality of switching networks located within the lead body, each switching network corresponding to and configured to control an operation of one or more of said plurality of electrode contacts, wherein each of said plurality of electrode contacts is connected to at least one of said plurality of switching networks, each of said conductor wires is electrically coupled to each of said switching networks and wherein each of said switching networks comprises: a memory unit coupled to the input/output wire and configured to store one or more unique address codes and one or more stimulation parameters configured to facilitate independent control of each of said electrode contacts, and a switching element configured to selectively switch between coupling a corresponding electrode contact to said anode wire and to said cathode wire in response to signals received at the memory unit from the input/output wire. 2. The lead assembly of claim 1, wherein each of said electrode contacts is configured to apply stimulation current to one or more stimulation sites in accordance with said one or more stimulation parameters, and wherein each of said switching networks comprises adjusting circuitry coupled to the switching element and the memory unit and configured to adjust one or more of said stimulation parameters selected from stimulation amplitude or frequency adjustments. 3. The lead assembly of claim 1, further comprising one or more hermetically sealed enclosures each configured to house one or more of said switching networks. 4. The lead assembly of claim 1, further comprising one or more ball connectors configured to electrically couple one or more of said conductor wires to one or more of said switching networks. 5. The lead assembly of claim 4, further comprising a square wire guide coupled to a portion of at least one of the ball connectors. 6. The lead assembly of claim 1, wherein each of said electrode contacts is hemispherically shaped, and wherein each of said switching networks is disposed within a complementary hemispherically shaped enclosure and configured and arranged to couple to each of said electrode contacts to form a spherical electrode assembly unit. 7. The lead assembly of claim 1, wherein each of said electrode contacts is cubic shaped, and wherein each of said switching networks is disposed within a cubic shaped enclosure and configured and arranged to couple to each of said electrode contacts to form a electrode assembly unit. 8. The lead assembly of claim 1, wherein the one or more stimulation parameters comprises stimulation amplitude. 9. The lead assembly of claim wherein the one or more stimulation parameters comprises frequency adjustments. 10. A system comprising: an implantable stimulator configured to generate electrical stimulation current; and a lead assembly coupled to said implantable stimulator, said lead assembly comprising: a lead body having a plurality of conductor wires embedded therein, wherein the plurality of conductor wires comprises an input/output wire, a ground wire, an anode wire and a cathode wire, wherein the input/output wire, the ground wire, the anode wire and the cathode wire are separate wires; a plurality of electrode contacts at least partially disposed on an outer surface of said lead body; and a plurality of switching networks located within the lead body, each switching network corresponding to and configured to control an operation of one or more of said plurality of electrode contacts, wherein each of said plurality of electrode contacts is connected to at least one of said plurality of switching networks, each of said conductor wires is electrically coupled to each of said switching networks and wherein each of said switching networks comprises: a memory unit coupled to the input/output wire and configured to store one or more unique address codes and one or more stimulation parameters configured to facilitate independent control of each of said electrode contacts, and a switching element configured to selectively switch between coupling a corresponding electrode contact to said anode wire and to said cathode wire in response to signals received at the memory unit from the input/output wire. 11. The system of claim 10, wherein said stimulator is configured to selectively apply said stimulation current to one or more stimulation sites via a subset of said electrode contacts by transmitting one or more address codes corresponding to said subset of said electrode contacts to one or more of said switching networks via the input/output wire. 12. The system of claim 8, wherein each of said electrode contacts is configured to apply stimulation current to one or more stimulation sites in accordance with said one or more stimulation parameters, and wherein each of said switching networks comprises adjusting circuitry coupled to the memory unit and switching element and configured to adjust one or more of said stimulation parameters selected from stimulation amplitude or frequency adjustments. 13. The system of claim 10, further comprising one or more hermetically sealed enclosures each configured to house one or more of said switching networks. 14. The system of claim 10, further comprising one or more ball connectors configured to electrically couple one or more of said conductor wires to one or more of said switching networks. 15. A method comprising: generating electrical stimulation current; providing a lead body having a plurality of conductor wires embedded therein, wherein the plurality of conductor wires comprises an input/output wire, a ground wire, an anode wire and a cathode wire, wherein the input/output wire, the anode wire and the cathode wire are separate wires; providing a plurality of electrode contacts each having a corresponding switching network located within the lead body and configured to control an operation thereof, wherein each of said plurality of electrode contacts is connected to at least one of the switching networks, each of said conductor wires is electrically coupled to each of said switching networks and each of said switching networks comprises a memory unit coupled to the input/output wire and configured to store one or more unique address codes and one or more stimulation parameters configured to facilitate independent control of each of said plurality of electrode contacts, and a switching element configured to selectively switch between coupling a corresponding electrode contact to said anode wire and to said cathode wire in response to signals received at the memory unit from the input/output wire; storing one or more unique address codes and one or more stimulation parameters within the memory unit of each of said switching networks for facilitating independent control of each of said electrode contacts; and selectively applying said stimulation current to one or more stimulation sites via a subset of said electrode contacts by transmitting one or more stimulation parameters to one or more of said switching networks via one or more of said conductor wires. 16. The method of claim 15, further comprising adjusting said stimulation current applied via said subset of said electrode contacts with adjusting circuitry of one or more of said switching networks.