Filtered feedthrough assemblies for implantable devices and methods of manufacture
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01G-004/35
출원번호
UP-0858498
(2007-09-20)
등록번호
US-7839620
(2011-01-22)
발명자
/ 주소
Iyer, Rajesh V.
Miltich, Thomas P.
출원인 / 주소
Medtronic, Inc.
인용정보
피인용 횟수 :
4인용 특허 :
17
초록▼
A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer in
A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer including a noble metal. Another solder joint may be formed between the capacitive member and each feedthrough pin; and, for an assembly including a plurality of feedthrough pins, each of the other solder joints may be formed from a solder pre-form mounted onto the external surface of the capacitive element by inserting each pin through a corresponding ring of a plurality of rings connected together to form the solder pre-form.
대표청구항▼
The invention claimed is: 1. A filtered feedthrough assembly for an implantable medical device, the assembly comprising: a ferrule; a feedthrough pin extending within the ferrule; a capacitive element located within the ferrule, the capacitive element including a bore, through which the pin extends
The invention claimed is: 1. A filtered feedthrough assembly for an implantable medical device, the assembly comprising: a ferrule; a feedthrough pin extending within the ferrule; a capacitive element located within the ferrule, the capacitive element including a bore, through which the pin extends, and an external surface extending laterally outward from an opening of the bore; and a first solder joint coupling the capacitive element to the ferrule; wherein the external surface of the capacitive element includes a first portion adjacent to the first solder joint, the first portion being overlaid with a layer comprising a noble metal. 2. The assembly of claim 1, further comprising a non-conductive strain-relief member mounted on the external surface of the capacitive element and surrounding the pin. 3. The assembly of claim 1, further comprising: a second solder joint coupling the capacitive element to the pin; and wherein the external surface of the capacitive element further includes a second portion adjacent the second solder joint, the second portion being overlaid with a layer comprising a noble metal. 4. The assembly of claim 3, further comprising a non-conductive strain-relief member mounted over the second solder joint and surrounding the pin. 5. A solder pre-form used in manufacturing a feedthrough assembly for an implantable medical device, the solder pre-form comprising a plurality of rings connected together, each ring of the plurality of rings having an inner diameter sized to fit around a feedthrough pin of the feedthrough assembly. 6. The solder pre-form of claim 5, wherein the plurality of rings are connected together by a stringer extending between adjacent rings of the plurality of rings. 7. The solder pre-form of claim 6, wherein each stringer includes a discontinuity. 8. The solder pre-form of claim 5, further comprising an outer member extending alongside the plurality of rings and being connected to at least one ring of the plurality of rings. 9. The solder pre-form of claim 5, further comprising an outer member extending alongside the plurality of rings; and wherein the plurality of rings are connected together by the outer member, and at least one stringer extends between each ring of the plurality of rings and the outer member. 10. The solder pre-form of claim 9, wherein each of the at least one stringers includes a discontinuity. 11. The solder pre-form of claim 5, further comprising an outer member extending alongside the plurality of rings and being connected to at least one ring of the plurality of rings; wherein the outer member includes a bend for conforming around an edge of a capacitive element of the feedthrough assembly. 12. An implantable medical device comprising a housing and a filtered feedthrough assembly extending therethrough, the filtered feedthrough assembly comprising: a ferrule coupled to the housing of the device; a feedthrough pin extending within the ferrule; a capacitive element located within the ferrule, the capacitive element including a bore, through which the pin extends, and an external surface extending laterally outward from an opening of the bore; and a first solder joint coupling the capacitive element to the ferrule; wherein the external surface of the capacitive element includes a first portion adjacent to the first solder joint, the first portion being overlaid with a layer comprising a noble metal. 13. The device of claim 12, wherein the feedthrough assembly further comprises a non-conductive strain-relief member mounted on the external surface of the capacitive element and surrounding the pin. 14. The device of claim 12, wherein the feedthrough assembly further comprises: a second solder joint coupling the capacitive element to the pin; and wherein the external surface of the capacitive element further includes a second portion adjacent the second solder joint, the second portion being overlaid with a layer comprising a noble metal. 15. The device of claim 14, wherein the feedthrough assembly further comprises a non-conductive strain-relief member mounted over the second solder joint and surrounding the pin. 16. The solder pre-form of claim 5 wherein the solder pre-form comprises tin, gold, or indium.
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이 특허에 인용된 특허 (17)
Wolf William D. ; Fraley Mary A. ; Seifried Lynn M. ; Hoch Ronald F., Adhesively- and solder-bonded capacitive filter feedthrough for implantable medical devices.
Seifried Lynn M. ; Lessar Joseph F. ; Wolf William D. ; Fraley Mary A. ; Tidemand Kevin K. ; Engmark David B. ; Hoch Ronald F. ; Wiklund Craig L., Capacitive filter feedthrough for implantable medical device.
William D. Wolf ; James Strom ; Craig L. Wiklund ; Mary A. Fraley ; Lynn M. Seifried ; James E. Volmering ; Patrick F. Malone ; Samuel F. Haq, Capacitive filtered feedthrough array for an implantable medical device.
Stevenson Robert A. ; Haskell Donald K. ; Brendel Richard L., EMI filter feedthough terminal assembly having a capture flange to facilitate automated assembly.
Stevenson,Robert A.; Brendel,Richard L.; Frysz,Christine; Hussein,Haytham; Knappen,Scott; Stevenson,Ryan A., EMI filter terminal assembly with wire bond pads for human implant applications.
Stevenson,Robert A.; Brendel,Richard L.; Frysz,Christine; Hussein,Haytham; Knappen,Scott, Feedthrough terminal assembly with lead wire bonding pad for human implant applications.
Stevenson Robert A. ; Haskell Donald K. ; Brendel Richard L., Hermetically sealed EMI feedthrough filter capacitor for human implant and other applications.
Brendel, Richard L.; Stevenson, Robert A., Internally grounded feedthrough filter capacitor with improved ground plane design for human implant and other applications.
Allen, Kevin M.; Shipman, Thomas W.; Frysz, Christine, Multipin feedthrough containing a ground pin passing through an insulator and directly brazed to a ferrule.
Deininger, Steven T.; Baade, Michael J.; Iyer, Rajesh V., Implantable medical devices and related connector enclosure assemblies utilizing conductors electrically coupled to feedthrough pins.
Deininger, Steven T.; Baade, Michael J.; Iyer, Rajesh V., Implantable medical devices and related connector enclosure assemblies utilizing conductors electrically coupled to feedthrough pins.
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