초록 ▼

A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is po

A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.

대표청구항 ▼

What is claimed is: 1. A heat dissipation device comprising: a fin unit; a heat absorbing block having a bottom surface adapted for thermally contacting an electronic component; a heat spreader contacting the fin unit and transferring heat thereto for dissipation, wherein the heat spreader is a tab

What is claimed is: 1. A heat dissipation device comprising: a fin unit; a heat absorbing block having a bottom surface adapted for thermally contacting an electronic component; a heat spreader contacting the fin unit and transferring heat thereto for dissipation, wherein the heat spreader is a tabular heat pipe, one end of which is arranged on a top surface of the heat absorbing block and adapted for thermally connecting the electronic component, and another end of which is received in the fin unit; and a heat isolation layer comprising polyurethane foam, wherein the heat isolation layer is fixedly coated on top surfaces of the fin unit, the heat absorbing block, and the heat pipe. 2. The heat dissipation device of claim 1, wherein the heat isolation layer is formed by spraying a liquid polyurethane onto the outer surface of the heat dissipation device, and then cooling the liquid polyurethane to form the polyurethane foam bonding to the outer surface of the heat dissipation device directly. 3. A computer comprising: a top cover; a bottom cover opposite to the top cover; an electronic component located on the bottom cover; and a heat dissipation device received in the computer and located entirely between the top and bottom covers, the heat dissipation device comprising a fin unit and a heat spreader, the heat spreader thermally interconnecting the fin unit and the electronic component, an outer surface of the heat dissipation device facing and adjacent to the top cover, a heat isolation layer being fixedly coated over substantially an entire surface of the heat spreader facing the top cover, and wherein the heat isolation layer comprises polyurethane foam. 4. The computer of claim 3, wherein the heat spreader is a vapor chamber comprising a top wall, a bottom wall parallel to the top wall and a sidewall hermetically interconnecting the top wall and the bottom wall, the top wall, the bottom wall and the sidewall cooperatively forming a sealed space containing a working fluid therein, the top wall facing and adjacent to the top cover of the computer, and the heat isolation layer being coated on the top wall. 5. The computer of claim 4, wherein one end of the bottom wall of the heat spreader thermally contacts the electronic component, and another end of the bottom wall of the heat spreader thermally contacts a top surface of the fin unit. 6. The computer of claim 3, wherein the heat spreader is a tabular heat pipe, a cutout is defined in the fin unit through which the heat pipe extends, a top surface of the fin unit faces and is adjacent to the top cover of the computer, and the heat isolation layer is coated on the top surface of the fin unit. 7. The computer of claim 6, further comprising a heat absorbing block comprising a bottom surface thermally contacting the electronic component, one end of the heat pipe arranged on a top surface of the heat absorbing block, and the heat isolation layer further coated on top surfaces of the heat absorbing block and the heat pipe after the heat absorbing block and the heat pipe are connected together. 8. The computer of claim 3, wherein the heat isolation layer is formed by spraying a liquid polyurethane onto the outer surface of the heat dissipation device, and then cooling the liquid polyurethane to form the polyurethane foam bonding to the outer surface of the heat dissipation device directly. 9. A heat dissipation device for dissipating heat generated by an electronic component in a laptop computer comprising a top cover and a bottom cover, the heat dissipation device located entirely between the top and bottom covers, comprising: a heat spreader having a first portion for thermally connecting with the electronic component to absorb the heat therefrom and a second portion; a fin unit thermally connecting with the second portion of the heat spreader for dissipating the heat away from the heat spreader; and a heat isolation layer fixedly coated over substantially an entire surface of the heat spreader which faces and is adjacent to the top cover of the laptop computer when the heat dissipation device is deployed in the laptop computer. 10. The heat dissipation device of claim 9, wherein the heat isolation layer is made of polyurethane foam. 11. The heat dissipation device of claim 10, wherein the polyurethane foam is directly coated on the surface. 12. The heat dissipation device of claim 10, wherein the polyurethane foam is secured to the surface via an adhesive therebetween. 13. The heat dissipation device of claim 10, further comprising a fan for generating an airflow through the fin unit. 14. The heat dissipation device of claim 13, wherein the fin unit is divided into two perpendicular fin groups.