Dual-chamber fluid pump for a multi-fluid electronics cooling system and method
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F28F-007/00
F04F-001/18
출원번호
UP-0426431
(2006-06-26)
등록번호
US-7841385
(2011-01-31)
발명자
/ 주소
Campbell, Levi A.
Chu, Richard C.
Ellsworth, Michael J.
Iyengar, Madhusudan K.
Schmidt, Roger R.
Simons, Robert E.
출원인 / 주소
International Business Machines Corporation
대리인 / 주소
Monteleone, Esq., Geraldine
인용정보
피인용 횟수 :
0인용 특허 :
18
초록▼
A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second flui
A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.
대표청구항▼
What is claimed is: 1. A cooled electronics system comprising: a multi-fluid cooled electronics module, the multi-fluid cooled electronics module being cooled by a first fluid coolant received at a first inlet thereof and a second fluid coolant received at a second inlet thereof, wherein the first
What is claimed is: 1. A cooled electronics system comprising: a multi-fluid cooled electronics module, the multi-fluid cooled electronics module being cooled by a first fluid coolant received at a first inlet thereof and a second fluid coolant received at a second inlet thereof, wherein the first fluid coolant and the second fluid coolant are immiscible and have different densities; at least one heat exchanger for cooling fluid effluent from the multi-fluid cooled electronics module, the fluid effluent comprising the first fluid coolant and the second fluid coolant; a pump for providing the first fluid coolant and the second fluid coolant to the multi-fluid cooled electronics module from the heat exchanger, the pump comprising: a first fluid path for pumping the first fluid coolant and a second fluid path for pumping the second fluid coolant, the first fluid path comprising a first pumping chamber and the second fluid path comprising a second pumping chamber; at least one diaphragm separating the first pumping chamber and the second pumping chamber; and an actuator coupled to the at least one diaphragm for transitioning the at least one diaphragm between a first position and a second position, wherein transitioning of the at least one diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the at least one diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber. 2. The cooled electronics system of claim 1, wherein the actuator is a piezoelectric actuator, the piezoelectric actuator comprising a piezoelectric material coupled to the at least one diaphragm. 3. The cooled electronics system of claim 1, wherein the first fluid path further comprises a first fluid inlet and a first fluid outlet in fluid communication with the first pumping chamber, and the second fluid path comprises a second fluid inlet and a second fluid outlet in fluid communication with the second pumping chamber, wherein the first fluid inlet, the first fluid outlet, the second fluid inlet and the second fluid outlet each have associated therewith a respective check valve to ensure that first fluid coolant flow through the first fluid path is unidirectional from the first fluid inlet out through the first fluid outlet and second fluid coolant flow through the second fluid path is unidirectional from the second fluid inlet out through the second fluid outlet. 4. The pump cooled electronics system of claim 1, wherein the first pumping chamber is a first cylindrical pumping chamber and the second pumping chamber is a second cylindrical pumping chamber, and wherein the at least one diaphragm comprises a disk-shaped diaphragm isolating the first cylindrical pumping chamber from the second cylindrical pumping chamber, and wherein the actuator comprises a piezoelectric actuator, the piezoelectric actuator comprising a disk-shaped piezoelectric material attached to the disk-shaped diaphragm and electrical wiring connecting to the disk-shaped piezoelectric material, the electrical wiring extending through one of the first cylindrical pumping chamber and the second cylindrical pumping chamber. 5. The pump cooled electronics system of claim 1, wherein the pump further comprises an upper casing and a lower casing sealed together along the peripheries thereof, wherein the upper casing and the at least one diaphragm define the first pumping chamber, and the lower casing and the at least one diaphragm define the second pumping chamber, and wherein the upper casing includes an upper seat for the at least one diaphragm and the lower casing includes a lower seat for the at least one diaphragm and wherein the at least one diaphragm is coupled to the upper casing by an upper circular gasket disposed between the at least one diaphragm and the upper seat of the upper casing and is coupled to the lower casing by a lower circular gasket disposed between the at least one diaphragm and the lower seat of the lower casing. 6. The cooled electronics system of claim 1, wherein the first fluid path through the pump is separate from the second fluid path, and wherein the cooled electronic system further comprises a first coolant loop coupling the first fluid path of the pump to a first inlet of the multi-fluid cooled electronics module and a second coolant loop coupling the second fluid path of the pump to a second inlet of the multi-fluid cooled electronics module. 7. The cooled electronics system of claim 6, wherein the first fluid coolant is a dielectric fluid and the second fluid coolant is an aqueous fluid, and wherein the actuator is a piezoelectric actuator extending partially into the first pumping chamber. 8. The cooled electronics system of claim 1, wherein multi-fluid cooled electronics module comprises the first inlet and the second inlet for respectively, separately receiving the first fluid coolant and the second fluid coolant, and wherein the first fluid coolant and the second fluid coolant form an emulsion within the housing. 9. The cooled electronics system of claim 8, wherein the first fluid coolant is a first liquid coolant and the second fluid coolant is a second liquid coolant. 10. A cooled electronics system comprising: at least one fluid cooled electronics module; at least one heat exchanger for cooling fluid effluent from the at least one fluid cooled electronics module, the fluid effluent comprising a first fluid coolant and a second fluid coolant; a pump for providing the first fluid coolant and the second fluid coolant to the at least one fluid cooled electronics module from the at least one heat exchanger, the pump comprising: a first fluid path for pumping the first fluid coolant and a second fluid path for pumping the second fluid coolant, the first fluid path comprising a first pumping chamber and the second fluid path comprising a second pumping chamber; at least one diaphragm separating the first pumping chamber and the second pumping chamber; an actuator coupled to the at least one diaphragm for transitioning the at least one diaphragm between a first position and a second position, wherein transitioning of the at least one diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the at least one diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber; wherein the at least one fluid cooled electronics module comprises a dual-fluid cooled electronics module, and wherein the first fluid path through the pump is separate from the second fluid path, and wherein the cooled electronic system further comprises a first coolant loop coupling the first fluid path of the pump to a first inlet of the dual-fluid cooled electronics module and a second coolant loop coupling the second fluid path of the pump to a second inlet of the dual-fluid cooled electronics module; and wherein the first fluid coolant and the second fluid coolant are immiscible and have different densities, and wherein the at least one heat exchanger comprises a fluid separation tank, the fluid separation tank receiving as input the fluid effluent from the dual-fluid cooled electronics module, the fluid effluent comprising an emulsion of the first fluid coolant and the second fluid coolant, wherein the first fluid coolant and the second fluid coolant separate in the fluid separation tank based on their immiscibility and different densities, and are separately respectively drawn to a first fluid inlet of the first fluid path of the pump and a second fluid inlet of the second fluid path of the pump by operation of the pump. 11. A method of cooling multi-fluid cooled electronics module, the method comprising: providing a pump for pumping a first fluid coolant and a second fluid coolant to the multi-fluid cooled electronics module, the pump comprising: a first fluid path for pumping the first fluid coolant and a second fluid path for pumping the second fluid coolant, the first fluid path comprising a first pumping chamber and the second fluid path comprising a second pumping chamber; at least one diaphragm separating the first pumping chamber and the second pumping chamber; and an actuator coupled to the at least one diaphragm for transitioning the at least one diaphragm between a first position and a second position, wherein transitioning of the at least one diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the at least one diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber; and employing the actuator to vibrate the at least one diaphragm between the first position and the second position, wherein the vibrating continuously alternately: pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber; and pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber; and providing the first fluid coolant pumped from the first fluid path to a first inlet of the multi-fluid cooled electronics module and providing the second fluid coolant pumped from the second fluid path to a second inlet of the multi-fluid cooled electronics module, wherein the at least one multi-fluid cooled electronics module is cooled by the first fluid coolant and the second fluid coolant, the first fluid coolant and the second fluid coolant being immiscible and having different densities. 12. The method of claim 11, wherein the method further comprises providing a fluid separation tank, the fluid separation tank receiving as input fluid effluent from the dual-fluid cooled electronics module, the fluid effluent comprising an emulsion of the first fluid coolant and the second fluid coolant, wherein the first fluid coolant and the second fluid coolant separate in the fluid separation tank based on their immiscibility and different densities, and wherein the method further comprises cooling the first fluid coolant and the second fluid coolant within the fluid separation tank and separately drawing the first fluid coolant to a first fluid inlet of the first fluid path of the pump, and the second fluid coolant to a second fluid inlet of the second fluid path of the pump via the vibrating of the at least one diaphragm. 13. The method of claim 11, wherein the actuator is a piezoelectric actuator, the piezoelectric actuator comprising a piezoelectric material coupled to the at least one diaphragm, and wherein vibrating the at least one diaphragm is accomplished by applying an alternating electrical potential across the piezoelectric material to transition the at least one diaphragm between the first position and the second position.
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이 특허에 인용된 특허 (18)
Tippetts Thomas B. (Mesa AZ) Cycon ; Jr. Michael F. (Tempe AZ), Compact piezoelectric fluidic air supply pump.
Strimling Walter E. (63 Westcliff Rd. Weston MA 02193), Diaphragm pump arrangement in which alternately expanded and contracted chambers are used independently.
Perlov Gena (18 Disraeli Street Haifa ILX) Tuchman Samuel (15 Hanarkissim Street Kiryat Bialik ILX), Electrodynamic peristaltic fluid transfer device and method.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E.; Singh, Prabjit; Zucco, Paul A., Electronic device substrate assembly with multilayer impermeable barrier and method of making.
Kitano,Makoto; Naganawa,Takashi; Yoshitomi,Yuji; Minamitani,Rintaro; Ohashi,Shigeo; Ashiwake,Noriyuki; Kondo,Yoshihiro; Nakagawa,Tsuyoshi, Liquid cooling system and personal computer using thereof.
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