IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0218149
(2008-07-10)
|
등록번호 |
US-7846818
(2011-01-31)
|
발명자
/ 주소 |
- Henley, Francois J.
- Cheung, Nathan W.
|
출원인 / 주소 |
- Silicon Genesis Corporation
|
대리인 / 주소 |
Townsend and Townsend and Crew LLP
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
229 |
초록
▼
A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to defin
A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material (12) above the selected depth. An energy source is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.
대표청구항
▼
What is claimed is: 1. A process for forming a film of material from a semiconductor substrate using a thermal source, said process comprising: applying an electron beam to a selected region of a semiconductor substrate to form a thermal gradient creating stress to cause a controlled cleaving actio
What is claimed is: 1. A process for forming a film of material from a semiconductor substrate using a thermal source, said process comprising: applying an electron beam to a selected region of a semiconductor substrate to form a thermal gradient creating stress to cause a controlled cleaving action at the selected depth in the semiconductor substrate to free a portion of the semiconductor material to be removed from the semiconductor substrate. 2. The process of claim 1 wherein application of the electron beam initiates the controlled cleaving action. 3. The process of claim 1 wherein the electron beam is a pulse or scan. 4. The process of claim 1 wherein the electron beam is provided by flood, time varying, spatially varying, or continuous. 5. The process of claim 1 wherein the controlled cleaving action forms a single cleave front. 6. The process of claim 1 wherein the controlled cleaving action forms multiple cleave fronts. 7. The process of claim 1 wherein the thermal gradient heats the selected region. 8. The process of claim 1 further comprising introducing particles through a surface of a semiconductor substrate to the selected depth, the particles being at a concentration at the selected depth to define a material to be removed above the selected depth. 9. The process of claim 8 wherein application of the electron beam propagates the controlled cleaving action at the selected depth. 10. The process of claim 8 wherein the particles are derived from a source selected from the group consisting of hydrogen gas, helium gas, water vapor, methane, hydrogen compounds, and light atomic mass particles. 11. The process of claim 8 wherein the particles are selected from the group consisting of neutral molecules, neutral atoms, charged molecules, charged atoms, and electrons. 12. The process of claim 8 wherein the particles are energetic. 13. The process of claim 12 wherein the energetic particles have sufficient kinetic energy to penetrate through the surface to the selected depth underneath the surface. 14. A process for forming a film of material from a semiconductor substrate using a pulse or pulses of an electron beam, said process comprising: providing a semiconductor substrate; introducing a plurality of particles through a surface of a semiconductor substrate to a selected depth underneath said surface, the particles being at a concentration at the selected depth to define a semiconductor material to be removed above the selected depth; and applying an electron beam to a selected region of the semiconductor substrate to form a gradient causing stress to initiate a controlled cleaving action at the selected depth in the semiconductor substrate to free a portion of the semiconductor material to be removed from the semiconductor substrate. 15. The process of claim 14 wherein the gradient comprises a thermal gradient. 16. The process of claim 15 wherein the thermal gradient heats the selected region. 17. The process of claim 14 wherein the electron beam is provided by flood, time varying, spatially varying, or continuous. 18. The process of claim 14 wherein the electron beam is a pulse or scan. 19. The process of claim 14 further comprising providing energy to increase a controlled stress in the semiconductor material and sustain the controlled cleaving action to remove the semiconductor material from the semiconductor substrate to provide a film of material. 20. The process of claim 14 wherein the introducing forms damage selected from the group consisting of atomic bond damage, bond substitution, weakening, and breaking bonds of the semiconductor substrate at the selected depth. 21. The process of claim 20 wherein the damage creates stress in the semiconductor substrate. 22. The process of claim 20 wherein the damage reduces an ability of the semiconductor substrate material to withstand stress without a possibility of a cleaving of the semiconductor substrate. 23. The process of claim 14 wherein the introducing causes stress of the semiconductor material at the selected depth by a presence of the particles at the selected depth. 24. The process of claim 14 wherein the introducing is a step of beam line ion implantation. 25. The process of claim 14 wherein the introducing is a step of plasma immersion ion implantation. 26. The process of claim 14 further comprising a step of joining the surface of the semiconductor substrate to a surface of a target substrate to form a stacked assembly. 27. The process of claim 14 wherein the semiconductor substrate is made of a material selected from the group consisting of silicon, silicon carbide, group III/V material, plastic, ceramic material, monocrystalline silicon, polycrystalline silicon, amorphous silicon, and multi-layered substrate. 28. The process of claim 14 wherein the controlled cleaving action forms a single cleave front. 29. The process of claim 14 wherein the controlled cleaving action forms multiple cleave fronts. 30. The process of claim 14 wherein the particles are derived from a source selected from the group consisting of hydrogen gas, helium gas, water vapor, methane, hydrogen compounds, and light atomic mass particles. 31. The process of claim 14 wherein the particles are selected from the group consisting of neutral molecules, neutral atoms, charged molecules, charged atoms, and electrons. 32. The process of claim 14 wherein the particles are energetic. 33. The process of claim 32 wherein the energetic particles have sufficient kinetic energy to penetrate through the surface to the selected depth underneath the surface. 34. A process for forming a film of material from a semiconductor substrate using an electron beam, said process comprising: providing a semiconductor substrate; introducing a plurality of particles through a surface of a semiconductor substrate to a selected depth underneath said surface, the particles being at a concentration at the selected depth to define a material to be removed above the selected depth; and applying an electron beam to a selected region of the semiconductor substrate to form a thermal gradient causing stress to initiate a controlled cleaving action at the selected depth in the semiconductor substrate to free a portion of a semiconductor material to be removed from the semiconductor substrate, the process further comprising providing energy to sustain the controlled cleaving action to remove the semiconductor material from the semiconductor substrate to provide a film of material. 35. A process for forming a film of material from a semiconductor substrate using a thermal pulse or pulses, said process comprising: providing a semiconductor substrate; and applying an electron beam to the semiconductor substrate, thereby providing energy to a selected region of the semiconductor substrate to form a gradient causing stress to initiate a controlled cleaving action at a selected depth in the semiconductor substrate to free a portion of a semiconductor material to be removed from the semiconductor substrate, wherein the providing energy increases a controlled stress in the semiconductor material and sustains the controlled cleaving action to remove the semiconductor material from the semiconductor substrate to provide a film of material. 36. The process of claim 35 wherein the gradient comprises a thermal gradient. 37. The process of claim 35 wherein the electron beam is provided by flood, time varying, spatially varying, or continuous. 38. The process of claim 35 wherein the electron beam is a pulse or scan. 39. The process of claim 35 further comprising introducing a plurality of particles through a surface of a semiconductor substrate to the selected depth prior to applying the electron beam. 40. The process of claim 39 wherein the introducing forms damage selected from the group consisting of atomic bond damage, bond substitution, weakening, and breaking bonds of the semiconductor substrate at the selected depth. 41. The process of claim 40 wherein the damage creates stress in the semiconductor substrate. 42. The process of claim 40 wherein the damage reduces an ability of the semiconductor substrate material to withstand stress without a possibility of a cleaving of the semiconductor substrate. 43. The process of claim 39 wherein the introducing causes stress of the semiconductor material at the selected depth by a presence of the particles at the selected depth. 44. The process of claim 39 wherein the introducing is a step of beam line ion implantation. 45. The process of claim 39 wherein the introducing is a step of plasma immersion ion implantation. 46. The process of claim 35 further comprising a step of joining the surface of the semiconductor substrate to a surface of a target substrate to form a stacked assembly. 47. The process of claim 35 wherein the semiconductor substrate is made of a material selected from the group consisting of silicon, silicon carbide, group III/V material, plastic, ceramic material, monocrystalline silicon, polycrystalline silicon, amorphous silicon, and multi-layered substrate.
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