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An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employ

An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

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What is claimed is: 1. A removable airflow director adapted to facilitate cooling within a computing device having an outer housing, one or more heat producing elements and one or more cooling fans, the removable airflow director comprising: a first contoured portion adapted to direct a first airfl

What is claimed is: 1. A removable airflow director adapted to facilitate cooling within a computing device having an outer housing, one or more heat producing elements and one or more cooling fans, the removable airflow director comprising: a first contoured portion adapted to direct a first airflow from one of said one or more cooling fans in a first specific manner through a first thermal zone within the computing device; and a second contoured portion adapted to direct a second airflow from one of said one or more cooling fans in a second specific manner through a second thermal zone within the computing device, wherein said first and second thermal zones comprise separate and distinct thermal zones within said computing device. 2. The removable airflow director of claim 1, wherein cooling within said first and second thermal zones occurs at different rates due to differences in the first and second contoured portions of said removable airflow director. 3. The removable airflow director of claim 1, wherein said first thermal zone encompasses a processor. 4. The removable airflow director of claim 1, wherein said second thermal zone encompasses a peripheral card. 5. The removable airflow director of claim 1, further including: an associated sensor configured to determine whether said removable airflow director is properly positioned proximate to the computing device, wherein said sensor generates an error signal when said removable airflow director is not properly positioned proximate to the computing device. 6. A computing device, comprising: a heat producing element; a fan; a contoured member configured to direct airflow from the fan across the heat producing element; and a detection system configured to generate an error signal that results in a corrective action when the contoured member is improperly positioned relative to the computing device, wherein an adverse thermal condition within the computing device results when said contoured member is improperly positioned relative to the computing device. 7. The computing device of claim 6, wherein said contoured member comprises a removable airflow director, said removable airflow director including a first contoured portion adapted to direct a first airflow from said fan in a first specific manner through a first thermal zone within the computing device, and a second contoured portion adapted to direct a second airflow from said fan in a second specific manner through a second thermal zone within the computing device, wherein said first and second thermal zones comprise separate and distinct thermal zones within said computing device. 8. The computing device of claim 7, wherein said heat producing element is a processor, and further including: a peripheral card, wherein said first thermal zone encompasses said processor and wherein said second thermal zone encompasses said peripheral card. 9. The computing device of claim 6, wherein a proper positioning of said contoured member results in a more efficient cooling of said heat producing element. 10. The computing device of claim 6, wherein said detection system includes a proximity sensor or an optical sensor. 11. A method of cooling a computing device having a heat producing element, a cooling fan, an airflow director and a sensor, the method comprising: determining with said sensor whether said airflow director is properly positioned proximate to the computing device, wherein a proper positioning of said airflow director results in a more efficient cooling of said heat producing element and an improper positioning of said airflow director results in a less efficient cooling of said heat producing element; and generating an error signal when said airflow director is not properly positioned proximate to the computing device. 12. The method of claim 11, wherein said airflow director includes a first contoured portion adapted to direct a first airflow from said cooling fan in a first specific manner through a first thermal zone within the computing device, and a second contoured portion adapted to direct a second airflow from said cooling fan in a second specific manner through a second thermal zone within the computing device, wherein said first and second thermal zones comprise separate and distinct thermal zones within said computing device. 13. The method of claim 11, wherein an adverse thermal condition within the computing device results when said airflow director is improperly positioned relative to the computing device. 14. The method of claim 11, wherein the generation of said error signal results in a corrective action. 15. The method of claim 11, wherein said sensor comprises a proximity sensor or an optical sensor. 16. A computer, comprising: a heat producing element; a fan configured to generate an airflow; a removable contoured member configured to direct at least a portion of said airflow across said heat producing element; and a sensor configured to determine whether said contoured member is improperly positioned relative to the remainder of said computer. 17. The computer of claim 16, wherein said removable contoured member includes a first contoured portion adapted to direct a first airflow from said fan in a first specific manner through a first thermal zone within the computing device, and a second contoured portion adapted to direct a second airflow from said fan in a second specific manner through a second thermal zone within the computing device, wherein said first and second thermal zones comprise separate and distinct thermal zones within said computing device. 18. The computer of claim 16, wherein an adverse thermal condition within the computer results when said removable contoured member is improperly positioned relative to the remainder of said computer. 19. The computer of claim 16, wherein a proper positioning of said airflow director results in a more efficient cooling of said heat producing element and an improper positioning of said airflow director results in a less efficient cooling of said heat producing element. 20. The computer of claim 16, wherein said sensor comprises a proximity sensor or an optical sensor.