초록 ▼

A semiconductor device includes: a semiconductor substrate including an active element formation face on which an active element is formed, and a rear face that is on a side opposite to the active element formation face; a penetration electrode penetrating the semiconductor substrate; an element ele

A semiconductor device includes: a semiconductor substrate including an active element formation face on which an active element is formed, and a rear face that is on a side opposite to the active element formation face; a penetration electrode penetrating the semiconductor substrate; an element electrode formed on or above the active element formation face; detection electrodes formed on or above the rear face, electrically connected to the element electrode via the penetration electrode, and detecting a remaining amount of the ink by being wet in the ink; a storage circuit storing the remaining amount of ink; an antenna formed on either one of the active element formation face and the rear face, transmitting and receiving information; and a control circuit controlling the detection electrodes, the antenna, and the storage circuit.

대표청구항 ▼

What is claimed is: 1. A semiconductor device comprising: a semiconductor substrate including an active element formation face on which an integrated circuit is formed, and a rear face that is on a side opposite to the active element formation face; a penetration electrode penetrating the semicondu

What is claimed is: 1. A semiconductor device comprising: a semiconductor substrate including an active element formation face on which an integrated circuit is formed, and a rear face that is on a side opposite to the active element formation face; a penetration electrode penetrating the semiconductor substrate; an element electrode formed on or above the active element formation face; detection electrodes formed on or above the rear face, electrically connected to the element electrode via the penetration electrode, and detecting a remaining amount of the ink by being wet in the ink; and an antenna formed on either one of the active element formation face and the rear face, transmitting and receiving information; wherein the integrated circuit includes a storage circuit storing the remaining amount of ink and a control circuit controlling the detection electrodes, the antenna, and the storage circuit. 2. The semiconductor device according to claim 1, wherein a part of the penetration electrode is the detection electrode. 3. The semiconductor device according to claim 2, wherein a part of the penetration electrode includes a protrusion protruding from the rear face, and the protrusion is the detection electrode. 4. The semiconductor device according to claim 1, further comprising: a conductive layer formed on or above the rear face of the semiconductor substrate with a passivation film therebetween; a protective film formed so as to cover the conductive layer; and an opening formed on the protective film, exposing at least a part of the conductive layer, wherein the detection electrode is constituted by the part of the conductive layer exposed through the opening. 5. The semiconductor device according to claim 1, further comprising: a conductive layer formed on or above the rear face of the semiconductor substrate with a passivation film therebetween; a protective film formed so as to cover the conductive layer; and an opening formed on the protective film, exposing at least a part of the conductive layer; and a bump formed on the conductive layer exposed through the opening, wherein the bump is the detection electrode. 6. The semiconductor device according to claim 1, further comprising: an insulating layer formed on or below a bottom layer of the detection electrodes. 7. The semiconductor device according to claim 1, wherein the antenna and the detection electrodes are formed directly on the active element formation face or the rear face using the same conductive material as that constituting the integrated circuit. 8. The semiconductor device according to claim 1, further comprising: a plated film formed on a surface of the detection electrode. 9. The semiconductor device according to claim 1, further comprising: a dielectric layer formed on or below a bottom layer of the antenna. 10. The semiconductor device according to claim 1, further comprising: three or more detection electrodes. 11. An ink cartridge used for an electronic device unit including an antenna, the ink cartridge comprising: an ink cartridge casing including a container that accommodates ink; and a liquid sensor including a semiconductor device that detects and manages information relating to the ink accommodated in the container, wherein the semiconductor device includes: a semiconductor substrate including an active element formation face on which an integrated circuit is formed, and a rear face that is on a side opposite to the active element formation face; a penetration electrode penetrating the semiconductor substrate; an element electrode formed on or above the active element formation face; detection electrodes exposed in the container, formed in the ink cartridge casing, formed on or above the rear face, electrically connected to the element electrode via the penetration electrode, and detecting a remaining amount of the ink by being wet in the ink; and a first antenna formed on either one of the active element formation face and the rear face, transmitting and receiving information, wherein the integrated circuit includes a storage circuit storing the remaining amount of ink, and a control circuit controlling the detection electrodes, the first antenna, and the storage circuit. 12. The ink cartridge according to claim 11, wherein a plurality of pairs of the detection electrodes of the semiconductor device are formed along the depth direction of the container, the detection electrodes being arranged along a bottom face of the container. 13. The ink cartridge according to claim 12, wherein a plurality of the semiconductor devices are formed along the depth direction of the container, the detection electrodes of at least one of the semiconductor devices being arranged along a bottom face of the container. 14. An electronic device comprising: the ink cartridge according to claim 11; and an electronic device unit including a second antenna.