초록 ▼

A semiconductor device including a semiconductor substrate is provided. The semiconductor substrate includes a substrate having an insulating surface, and a plurality of stacks over the substrate having an insulating surface. Each of the plurality of stacks includes a bonding layer over the substrat

A semiconductor device including a semiconductor substrate is provided. The semiconductor substrate includes a substrate having an insulating surface, and a plurality of stacks over the substrate having an insulating surface. Each of the plurality of stacks includes a bonding layer over the substrate having an insulating surface, an insulating layer over the bonding layer, and a single crystal semiconductor layer over the insulating layer. The substrate having an insulating surface has a depression, and the depression is provided between one of the plurality of stacks and another adjacent one of the plurality of stacks.

대표청구항 ▼

What is claimed is: 1. A method for manufacturing a semiconductor device including a semiconductor substrate comprising the steps of: arranging a plurality of single crystal semiconductor substrates in a tray; forming an insulating layer over the plurality of single crystal semiconductor substrates

What is claimed is: 1. A method for manufacturing a semiconductor device including a semiconductor substrate comprising the steps of: arranging a plurality of single crystal semiconductor substrates in a tray; forming an insulating layer over the plurality of single crystal semiconductor substrates; forming a damaged region in each of the plurality of single crystal semiconductor substrates by irradiating the plurality of single crystal semiconductor substrates with ions; forming a bonding layer over the insulating layer; bonding each of the plurality of single crystal semiconductor substrates and a substrate having an insulating surface with the bonding layer interposed therebetween; separating the plurality of single crystal semiconductor substrates with a plurality of single crystal semiconductor layers left over the substrate having an insulating surface; and forming a depression in the substrate having an insulating surface, wherein the depression is formed between one of the plurality of single crystal semiconductor layers and another adjacent one of the plurality of single crystal semiconductor layers. 2. The method for manufacturing a semiconductor device according to claim 1, wherein a distance between one of the plurality of single crystal semiconductor layers and another adjacent one of the plurality of single crystal semiconductor layers is less than or equal to 0.5 mm. 3. The method for manufacturing a semiconductor device according to claim 1, wherein a depth of the depression is more than or equal to 2 nm and less than or equal to 20 nm. 4. The method for manufacturing a semiconductor device according to claim 1, wherein the bonding layer includes a silicon oxide film. 5. The method for manufacturing a semiconductor device according to claim 1, wherein the insulating layer includes at least one of a silicon oxide film, a silicon nitride film, a silicon oxynitride film, and a silicon nitride oxide film. 6. The method for manufacturing a semiconductor device according to claim 1, wherein the tray includes quartz glass or stainless steel. 7. A method for manufacturing a semiconductor device including a semiconductor substrate comprising the steps of: arranging a plurality of single crystal semiconductor substrates in a tray; forming an insulating layer over the plurality of single crystal semiconductor substrates; forming a damaged region in each of the plurality of single crystal semiconductor substrates by irradiating the plurality of single crystal semiconductor substrates with ions; forming a bonding layer over the insulating layer; bonding each of the plurality of single crystal semiconductor substrates and a substrate having an insulating surface with the bonding layer interposed therebetween; separating the plurality of single crystal semiconductor substrates with a plurality of single crystal semiconductor layers left over the substrate having an insulating surface; forming a depression in the substrate having an insulating surface, wherein the depression is formed between one of the plurality of single crystal semiconductor layers and another adjacent one of the plurality of single crystal semiconductor layers, and removing a surface of each of the plurality of single crystal semiconductor layers. 8. The method for manufacturing a semiconductor device according to claim 7, wherein a distance between one of the plurality of single crystal semiconductor layers and another adjacent one of the plurality of single crystal semiconductor layers is less than or equal to 0.5 mm. 9. The method for manufacturing a semiconductor device according to claim 7, wherein a depth of the depression is more than or equal to 2 nm and less than or equal to 20 nm. 10. The method for manufacturing a semiconductor device according to claim 7, wherein the bonding layer includes a silicon oxide film. 11. The method for manufacturing a semiconductor device according to claim 7, wherein the insulating layer includes at least one of a silicon oxide film, a silicon nitride film, a silicon oxynitride film, and a silicon nitride oxide film. 12. The method for manufacturing a semiconductor device according to claim 7, wherein the tray includes quartz glass or stainless steel.