IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0259748
(2008-10-28)
|
등록번호 |
US-7858411
(2011-02-24)
|
우선권정보 |
JP-2001-402016(2001-12-28) |
발명자
/ 주소 |
- Yamazaki, Shunpei
- Murakami, Masakazu
- Takayama, Toru
- Maruyama, Junya
|
출원인 / 주소 |
- Semiconductor Energy Laboratory Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
13 인용 특허 :
28 |
초록
▼
The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLE
The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.
대표청구항
▼
What is claimed is: 1. A method for fabricating a light emitting device comprising a layer containing a light emitting element, the method comprising: forming a layer containing a thin film transistor over a first substrate; forming the layer containing the light emitting element over the layer con
What is claimed is: 1. A method for fabricating a light emitting device comprising a layer containing a light emitting element, the method comprising: forming a layer containing a thin film transistor over a first substrate; forming the layer containing the light emitting element over the layer containing the thin film transistor; bonding a second flexible substrate to the layer containing the light emitting element; peeling the layer containing the thin film transistor and the layer containing the light emitting element bonded with the second flexible substrate from the first substrate; and bonding a third flexible substrate to the layer containing the thin film transistor to sandwich the layer containing the thin film transistor and the layer containing the light emitting element between the second flexible substrate and the third flexible substrate. 2. The method for fabricating the light emitting device according to claim 1, wherein the second flexible substrate comprises plastic. 3. The method for fabricating the light emitting device according to claim 1, wherein the second flexible substrate to be bonded to the layer containing the light emitting element has curvature. 4. The method for fabricating the light emitting device according to claim 1, wherein the third flexible substrate comprises plastic. 5. The method for fabricating the light emitting device according to claim 1, further comprising: applying the light emitting device to a display portion. 6. The method for fabricating the light emitting device according to claim 1, further comprising: attaching the light emitting device to a main body, a window, or a seat of a vehicle. 7. The method for fabricating the light emitting device according to claim 1, further comprising: attaching the light emitting device to a main body, a window, a dashboard part, an automobile body or a seat of an automobile. 8. A method for fabricating a light emitting device comprising a layer containing a light emitting element, the method comprising: forming a layer containing a thin film transistor over a first substrate; forming the layer containing the light emitting element over the layer containing the thin film transistor; bonding a second flexible substrate to the layer containing the light emitting element via an adhesive; peeling the layer containing the thin film transistor and the layer containing the light emitting element bonded with the second flexible substrate from the first substrate; and bonding a third flexible substrate to the layer containing the thin film transistor to sandwich the layer containing the thin film transistor and the layer containing the light emitting element between the second flexible substrate and the third flexible substrate. 9. The method for fabricating the light emitting device according to claim 8, wherein the second flexible substrate comprises plastic. 10. The method for fabricating the light emitting device according to claim 8, wherein the second flexible substrate to be bonded to the layer containing the light emitting element has curvature. 11. The method for fabricating the light emitting device according to claim 8, wherein the third flexible substrate comprises plastic. 12. The method for fabricating the light emitting device according to claim 8, further comprising: applying the light emitting device to a display portion. 13. The method for fabricating the light emitting device according to claim 8, further comprising: attaching the light emitting device to a main body, a window, or a seat of a vehicle. 14. The method for fabricating the light emitting device according to claim 8, further comprising: attaching the light emitting device to a main body, a window, a dashboard part, an automobile body or a seat of an automobile. 15. A method for fabricating a light emitting device comprising a layer containing a light emitting element, the method comprising: forming a layer containing at least one selected from metal, oxide, and nitride over a first substrate; forming a layer containing a thin film transistor over the layer containing the at least one selected from metal, oxide, and nitride; forming the layer containing the light emitting element over the layer containing the thin film transistor; bonding a second flexible substrate to the layer containing the light emitting element; peeling the layer containing the thin film transistor and the layer containing the light emitting element bonded with the second flexible substrate from the first substrate; and bonding a third flexible substrate to the layer containing the thin film transistor to sandwich the layer containing the thin film transistor and the layer containing the light emitting element between the second flexible substrate and the third flexible substrate. 16. The method for fabricating the light emitting device according to claim 15, wherein the second flexible substrate comprises plastic. 17. The method for fabricating the light emitting device according to claim 15, wherein the second flexible substrate to be bonded to the layer containing the light emitting element has curvature. 18. The method for fabricating the light emitting device according to claim 15, wherein the third flexible substrate comprises plastic. 19. The method for fabricating the light emitting device according to claim 15, further comprising: applying the light emitting device to a display portion. 20. The method for fabricating the light emitting device according to claim 15, further comprising: attaching the light emitting device to a main body, a window, or a seat of a vehicle. 21. The method for fabricating the light emitting device according to claim 15, further comprising: attaching the light emitting device to a main body, a window, a dashboard part, an automobile body or a seat of an automobile. 22. A method for fabricating a light emitting device comprising a layer containing a light emitting element, the method comprising: forming a layer containing a thin film transistor over a first substrate; forming a layer containing the light emitting element over the layer containing the thin film transistor; bonding a second flexible substrate to the layer containing the light emitting element via a first adhesive; peeling the layer containing the thin film transistor and the layer containing the light emitting element bonded with the second flexible substrate from the first substrate; and bonding a third flexible substrate to the layer containing the thin film transistor via a second adhesive to sandwich the layer containing the thin film transistor and the layer containing the light emitting element between the second flexible substrate and the third flexible substrate. 23. The method for fabricating the light emitting device according to claim 22, wherein the second flexible substrate comprises plastic. 24. The method for fabricating the light emitting device according to claim 22, wherein the second flexible substrate to be bonded to the layer containing light emitting element has curvature. 25. The method for fabricating the light emitting device according to claim 22, wherein the third flexible substrate comprises plastic. 26. The method for fabricating the light emitting device according to claim 22, further comprising: applying the light emitting device to a display portion. 27. The method for fabricating the light emitting device according to claim 22, further comprising: attaching the light emitting device to a main body, a window, or a seat of a vehicle. 28. The method for fabricating the light emitting device according to claim 22, further comprising: attaching the light emitting device to a main body, a window, a dashboard part, an automobile body or a seat of an automobile. 29. A method for fabricating a light emitting device comprising a layer containing a light emitting element, the method comprising: forming a layer containing at least one selected from metal, oxide, and nitride over a first substrate; forming a layer containing a thin film transistor over the layer containing the at least one selected from metal, oxide, and nitride; forming the layer containing the light emitting element over the layer containing the thin film transistor; bonding a second flexible substrate to the layer containing the light emitting element via a first adhesive; peeling the layer containing the thin film transistor and the layer containing the light emitting element bonded with the second flexible substrate from the first substrate; and bonding a third flexible substrate to the layer containing the thin film transistor via a second adhesive to sandwich the layer containing the thin film transistor and the layer containing the light emitting element between the second flexible substrate and the third flexible substrate. 30. The method for fabricating the light emitting device according to claim 29, wherein the second flexible substrate comprises plastic. 31. The method for fabricating the light emitting device according to claim 29, wherein the second flexible substrate to be bonded to the organic light emitting layer has curvature. 32. The method for fabricating the light emitting device according to claim 29, wherein the third flexible substrate comprises plastic. 33. The method for fabricating the light emitting device according to claim 29, further comprising: applying the light emitting device to a display portion. 34. The method for fabricating the light emitting device according to claim 29, further comprising: attaching the light emitting device to a main body, a window, or a seat of a vehicle. 35. The method for fabricating the light emitting device according to claim 29, further comprising: attaching the light emitting device to a main body, a window, a dashboard part, an automobile body or a seat of an automobile. 36. A method for fabricating a light emitting device comprising a layer containing a light emitting element, the method comprising: forming a layer containing a thin film transistor over a first substrate; forming the layer containing the light emitting element over the layer containing the thin film transistor; bonding a second flexible substrate to the layer containing the light emitting element; peeling the layer containing the thin film transistor and the layer containing the light emitting element bonded with the second flexible substrate from the first substrate; and bonding a third flexible substrate to the layer containing the thin film transistor via an adhesive to sandwich the layer containing the thin film transistor and the layer containing the light emitting element between the second flexible substrate and the third flexible substrate. 37. The method for fabricating the light emitting device according to claim 36, wherein the second flexible substrate comprises plastic. 38. The method for fabricating the light emitting device according to claim 36, wherein the second flexible substrate to be bonded to the layer containing the light emitting element has curvature. 39. The method for fabricating the light emitting device according to claim 36, wherein the third flexible substrate comprises plastic. 40. The method for fabricating the light emitting device according to claim 36, further comprising: applying the light emitting device to a display portion. 41. The method for fabricating the light emitting device according to claim 36, further comprising: attaching the light emitting device to a main body, a window, or a seat of a vehicle. 42. The method for fabricating the light emitting device according to claim 36, further comprising: attaching the light emitting device to a main body, a window, a dashboard part, an automobile body or a seat of an automobile. 43. A method for fabricating a liquid crystal display device comprising a liquid crystal layer, the method comprising: forming a layer containing a thin film transistor over a first substrate; bonding a second flexible substrate to the layer containing the thin film transistor; forming a liquid crystal layer between the layer containing the thin film transistor and the second flexible substrate; peeling the liquid crystal layer bonded with the second flexible substrate from the first substrate; and bonding a third flexible substrate to the layer containing the thin film transistor to sandwich the layer containing the thin film transistor and the liquid crystal layer between the second flexible substrate and the third flexible substrate. 44. The method for fabricating the liquid crystal display device according to claim 43, wherein the second flexible substrate comprises plastic. 45. The method for fabricating the liquid crystal display device according to claim 43, wherein the second flexible substrate to be bonded to the liquid crystal layer has curvature. 46. The method for fabricating the liquid crystal display device according to claim 43, wherein the third flexible substrate comprises plastic. 47. The method for fabricating the liquid crystal display device according to claim 43, further comprising: attaching the liquid crystal display device to a main body, a window, or a seat of a vehicle. 48. The method for fabricating the liquid crystal display device according to claim 43, further comprising: attaching the liquid crystal display device to a main body, a window, a dashboard part, an automobile body or a seat of an automobile.
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