초록 ▼

Methods and apparatus for forming a product from ultra thin layers of a base material are disclosed. Some embodiments provide a process that allows one to structure a silicon base material, like the ingot, and to transfer this structure into a respective silicon process step. Some embodiments provid

Methods and apparatus for forming a product from ultra thin layers of a base material are disclosed. Some embodiments provide a process that allows one to structure a silicon base material, like the ingot, and to transfer this structure into a respective silicon process step. Some embodiments provide a process that allows one to structure any complex structured layer stacks, where the layers can be applied on top of each other using, e.g., bonding technology.

대표청구항 ▼

What is claimed is: 1. A method of structuring individual silicon layers, comprising:providing a base material;applying a master structure to said base material, said master structure comprising vias or mesa structures;exfoliating at least two ultra thin layers from the master structure; andtransfer

What is claimed is: 1. A method of structuring individual silicon layers, comprising:providing a base material;applying a master structure to said base material, said master structure comprising vias or mesa structures;exfoliating at least two ultra thin layers from the master structure; andtransferring the at least two ultra thin layers of said master structure to a desired process product.