초록 ▼

A method for evaluating three-dimensional (3-D) coordinate system measurement accuracy of an optical 3-D measuring system using targeted artifacts is provided. In this regard, an exemplary embodiment of a method for evaluating 3-D coordinate system measurement accuracy using targeted artifacts compr

A method for evaluating three-dimensional (3-D) coordinate system measurement accuracy of an optical 3-D measuring system using targeted artifacts is provided. In this regard, an exemplary embodiment of a method for evaluating 3-D coordinate system measurement accuracy using targeted artifacts comprises: taking a series of measurements from different positions and orientations using target dots on a targeted artifact with an optical 3-D measuring system; and calculating measurement errors using the series of measurements. An exemplary embodiment of a targeted artifact used with the method includes a base and target dots located on the base.

대표청구항 ▼

The invention claimed is: 1. A method for evaluating three-dimensional (3-D) coordinate system measurement accuracy of an optical 3-D measuring system using targeted artifacts, comprising the steps of:taking a series of measurements from different positions and orientations using target dots on a ta

The invention claimed is: 1. A method for evaluating three-dimensional (3-D) coordinate system measurement accuracy of an optical 3-D measuring system using targeted artifacts, comprising the steps of:taking a series of measurements from different positions and orientations using target dots on a targeted artifact with an optical 3-D measuring system; andcalculating measurement errors using the series of measurements;wherein taking a series of measurements comprises:determining, at a home position, a predetermined number of different 3-D length measurements using the target dots; andrecording the predetermined number of different 3-D length measurements.