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Glass plate with glass frit structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C03C-014/00
출원번호 US-0742078 (2007-04-30)
등록번호 US7871949 (2011-01-03)
우선권정보 KR-2007-0-2007-0001681(2007-01-05)
발명자 / 주소
  • Lee, Seung-Han
  • Choi, Jong-Seo
  • Jeon, Jin-Hwan
  • Sin, Sang-Wook
출원인 / 주소
  • Samsung Mobile Display Co., Ltd.
대리인 / 주소
    Knobbe Martens Olson & Bear LLP
인용정보 피인용 횟수 : 29  인용 특허 : 7

초록

A light emitting device includes: a first substrate; a second substrate; a light emitting unit interposed between the first substrate and the second substrate; and a sealing material bonding the first substrate to the second substrate and sealing the light emitting unit. The sealing material compris

대표청구항

What is claimed is: 1. A glass frit comprising vanadium in the form of V+4; wherein the glass frit has a light transmittance of about 50% or less for light with the wavelength of 810nm;wherein the glass frit is in the form of a sintered body; andwherein the V+4 exists more on a surface of the sinter

이 특허에 인용된 특허 (7)

  1. Boroson Michael L. ; Serbicki Jeffrey P. ; Bessey Peter G., Desiccation of moisture-sensitive electronic devices.
  2. Aitken,Bruce G.; Carberry,Joel P.; DeMartino,Steven E.; Hagy,Henry E.; Lamberson,Lisa A.; Miller, II,Richard J.; Morena,Robert; Schroeder, III,Joseph F.; Streltsov,Alexander; Widjaja,Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
  3. Yoshida, Masahiro; Hatate, Yasuo; Sarata, Tsugumitsu; Uemura, Yoshimitsu; Honda, Tomoyuki, Lead-free glass material for use in sealing and, sealed article and method for sealing using the same.
  4. Kawami Shin,JPX ; Nakada Hitoshi,JPX ; Naito Takemi,JPX, Organic EL element.
  5. Ohji Masahiko (Shiga JPX) Fukushima Norikazu (Shiga JPX), Powdery coating glass material, coating glass paste using the same and coating glass composition prepared thereby.
  6. Akhtar Masyood (San Diego CA) Le Kim C. (San Diego CA) Pedigo Jess (La Mesa CA) Smith Charles H. (Ramona CA), Sealing glass compositions.
  7. Krupetsky, Dmitriy; Schmid, Anthony P.; Ludwig, Paul N., Tuned sealing material for sealing of a flat panel display.

이 특허를 인용한 특허 (29)

  1. Marques, Paulo Gaspar Jorge, Durable frit composition and composites and devices comprised thereof.
  2. Shimomura, Akihisa; Yoshizumi, Kensuke, Glass pattern and method for forming the same, sealed body and method for manufacturing the same, and light-emitting device.
  3. Miyazawa, Masamichi; Hamada, Jun, Lead-free glass and sealing material.
  4. Yanagisawa, Masamichi; Hamada, Jun, Lead-free glass and sealing material.
  5. Hatano, Kaoru; Nishido, Yusuke; Yamazaki, Shunpei, Light-emitting device.
  6. Nishido, Yusuke; Yamazaki, Shunpei, Light-emitting device, electronic device, lighting device, and method for manufacturing the light-emitting device.
  7. Nishido, Yusuke; Yamazaki, Shunpei, Light-emitting device, electronic device, lighting device, and method for manufacturing the light-emitting device.
  8. Fukai, Shuji; Kubota, Yusuke; Jikumaru, Mika; Nishi, Takeshi; Shimomura, Akihisa; Nagano, Yoji; Nakamura, Daiki, Method for bonding substrates, method for manufacturing sealing structure, and method for manufacturing light-emitting device.
  9. Tanaka, Koichiro, Method for manufacturing glass sealed body and method for manufacturing light-emitting device.
  10. Miyairi, Hidekazu; Shimomura, Akihisa, Method for manufacturing sealed structure including welded glass frits.
  11. Shimomura, Akihisa; Miyairi, Hidekazu, Method of heating dispersion composition and method of forming glass pattern.
  12. Shimomura, Akihisa, Method of manufacturing light-emitting device.
  13. Shimomura, Akihisa, Method of manufacturing sealed body and method of manufacturing light-emitting device.
  14. Philippens, Marc; Schlenker, Tilman, Organic component and method for the production thereof.
  15. Wang, Dan, Packaging method and display device.
  16. Nishido, Yusuke, Sealed body, light-emitting module and method of manufacturing sealed body.
  17. Nishido, Yusuke, Sealed body, light-emitting module, and method of manufacturing sealed body.
  18. Shimomura, Akihisa, Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device.
  19. Shimomura, Akihisa, Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device.
  20. Yamazaki, Shunpei; Nakamura, Daiki; Nishido, Yusuke, Sealed structure, light-emitting device, electronic device, and lighting device.
  21. Yamazaki, Shunpei; Nakamura, Daiki; Nishido, Yusuke, Sealed structure, light-emitting device, electronic device, and lighting device.
  22. Yamazaki, Shunpei; Nakamura, Daiki; Nishido, Yusuke, Sealed structure, light-emitting device, electronic device, and lighting device.
  23. Nishido, Yusuke, Sealing structure and organic electroluminescence device.
  24. Ito, Minato; Yokoyama, Kohei; Nishido, Yusuke, Sealing structure, device, and method for manufacturing device.
  25. Kimura, Hajime, Semiconductor device and method for manufacturing the same.
  26. Kuwabara, Hideaki, Semiconductor device and method for manufacturing the same.
  27. Kuwabara, Hideaki, Semiconductor device and method for manufacturing the same.
  28. Kuwabara, Hideaki, Semiconductor device and method for manufacturing the same.
  29. Carroll, Alan Frederick; Hang, Kenneth Warren; Laughlin, Brian J.; Mikeska, Kurt Richard; Torardi, Carmine; Vernooy, Paul Douglas, Thick-film pastes containing lead- and tellurium-oxides, and their use in the manufacture of semiconductor devices.
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