초록 ▼

In a disk drive device in which low-density gas is sealed, embodiments of the present invention help to improve joint reliability at a solder joint section between a feedthrough and an enclosure with respect to stress applied by deformation due to changes in temperature environment in use. According

In a disk drive device in which low-density gas is sealed, embodiments of the present invention help to improve joint reliability at a solder joint section between a feedthrough and an enclosure with respect to stress applied by deformation due to changes in temperature environment in use. According to one embodiment, helium gas is sealed in an interior space of an HDD. A feedthrough is solder jointed to a feedthrough mounting surface of a base. At a part with relatively large thermal stress, a width of the feedthrough mounting surface is increased, and at a part with relatively small thermal stress, a width of the feedthrough mounting surface is decreased. This prevents a crack penetrating path from being generated at the solder joint section due to the thermal stress and prevents the solder joint section from contacting pins.

대표청구항 ▼

What is claimed is: 1. A disk drive device comprising:a disk;a motor for rotating the disk;a head for accessing the disk;a moving mechanism for supporting and moving the head;a base for housing the disk, the motor, the head and the moving mechanism;a cover joined to the base; andgas which has lower

What is claimed is: 1. A disk drive device comprising:a disk;a motor for rotating the disk;a head for accessing the disk;a moving mechanism for supporting and moving the head;a base for housing the disk, the motor, the head and the moving mechanism;a cover joined to the base; andgas which has lower density than air sealed within an interior space which is formed by joining the base and the cover; wherein:the disk drive further comprises a feedthrough which is solder-jointed to the base to cover an opening penetrating the base to join an outside of the device and the interior space and is connected electrically to a wiring arranged in the interior space;the base has a mounting surface on which the feedthrough is mounted around the opening;the feedthrough includes a flange whose outline is larger than the opening and pins which are fixed to the flange and are electrically connected to the wiring;a rim part of the flange is solder-jointed to the mounting surface; andthe solder-jointed mounting surface has a first part and a second part whose width is larger than the one of the first part, and thermal stress at the solder joint section of the second part is larger than the one of the first part.