초록 ▼

A cooling structure of a power semiconductor device includes a cooling water passage and a plurality of fins. The cooling water for cooling the power semiconductor device flows through the cooling water passage. The plurality of fins are provided on a path of the cooling water passage and set up wit

A cooling structure of a power semiconductor device includes a cooling water passage and a plurality of fins. The cooling water for cooling the power semiconductor device flows through the cooling water passage. The plurality of fins are provided on a path of the cooling water passage and set up with a spacing therebetween in a direction orthogonal to a flow direction of the cooling water. The plurality of fins promote heat exchange between the power semiconductor device and the cooling water. The plurality of fins have ends facing the upstream side of a cooling water flow. The end of at least one fin among the plurality of fins is arranged so as to be displaced to a more upstream side of the cooling water flow than the ends of the fins adjacent to both sides of the at least one fin. By such a configuration, there is provided a cooling structure of a power semiconductor device and an inverter with excellent cooling efficiency.

대표청구항 ▼

The invention claimed is: 1. A cooling structure of a power semiconductor device, comprising:a cooling water passage that is formed opposite to a mounting surface where the power semiconductor device is mounted, a cooling water for cooling said power semiconductor device flowing through the cooling

The invention claimed is: 1. A cooling structure of a power semiconductor device, comprising:a cooling water passage that is formed opposite to a mounting surface where the power semiconductor device is mounted, a cooling water for cooling said power semiconductor device flowing through the cooling water passage; anda plurality of fins provided on a path of said cooling water passage and set up with a spacing therebetween in a direction orthogonal to a flow direction of the cooling water to promote heat exchange between said power semiconductor device and the cooling water,said plurality of fins having ends facing an upstream side of a cooling water flow, andsaid end of at least one fin among said plurality of fins being arranged so as to be displaced to a more upstream side of the cooling water flow than said ends of the fins adjacent to both sides of said fin,whereinsaid cooling water passage is formed at a position between a pair of inner walls that are arranged on both sides of said plurality of fins and face each other,said cooling water passage meanders on said mounting surface, andat a straight portion of said cooling water passage extending straight, said ends are arranged so as to be displaced from a downstream side to the upstream side of the cooling water flow as a distance from each of said pair of inner walls increases.