초록 ▼

A substrate processing method is arranged to perform a heat process on a substrate with a coating film formed thereon to bake and cure the coating film. At first, the substrate, with the coating film formed thereon, is held at a preparatory temperature lower than a lower limit of temperature for bak

A substrate processing method is arranged to perform a heat process on a substrate with a coating film formed thereon to bake and cure the coating film. At first, the substrate, with the coating film formed thereon, is held at a preparatory temperature lower than a lower limit of temperature for baking and curing the coating film, to adjust distribution of a predetermined component in the coating film. Then, the substrate, with distribution of the predetermined component thus adjusted, is subjected to a heat process at a temperature not lower than the lower limit of temperature.

대표청구항 ▼

What is claimed is: 1. A substrate processing apparatus for performing a heat process on a plurality of substrates each with a coating film formed thereon to bake and cure the coating film, while sequentially transferring the substrates, the apparatus comprising:a substrate supporting section config

What is claimed is: 1. A substrate processing apparatus for performing a heat process on a plurality of substrates each with a coating film formed thereon to bake and cure the coating film, while sequentially transferring the substrates, the apparatus comprising:a substrate supporting section configured to hold each substrate, with the coating film formed thereon, at a preparatory temperature lower than a lower limit of temperature for baking and curing the coating film, to adjust distribution of a predetermined component in the coating film;a heat processing section configured to subject each substrate, with the coating film formed thereon, to a heat process at a temperature not lower than the lower limit of temperature;a transfer mechanism configured to transfer each substrate, with the coating film formed thereon, from the substrate supporting section to the heat processing section; anda control section configured to execute control fordistinguishing the substrates from each other in accordance with a first state and a second state where an elapsed time length since formation of the coating film is shorter and not shorter, respectively, than a predetermined time length,holding each substrate having the first state at the preparatory temperature by the heat processing section, and then subjecting the substrate having the first state to a heat process at a temperature not lower than the lower limit of temperature, andsubjecting each substrate having the second state to a heat process by the heat processing section at a temperature not lower than the lower limit of temperature, without holding the substrate having the second state at the substrate supporting section.