초록

With embodiments disclosed herein, the distribution of gated power is done using on-die layers without having to come back out and use package layers.

대표청구항 ▼

What is claimed is: 1. An IC device, comprising:a package substrate having an ungated supply grid; andan IC die having: (i) circuitry to receive one or more gated supplies, and (ii) a plurality of embedded power gate (EPG) transistors coupled between the ungated power grid and said circuitry to cont

What is claimed is: 1. An IC device, comprising:a package substrate having an ungated supply grid; andan IC die having: (i) circuitry to receive one or more gated supplies, and (ii) a plurality of embedded power gate (EPG) transistors coupled between the ungated power grid and said circuitry to controllably provide the one or more gated supplies to the circuitry, the IC die having a plurality of die layers, the one or more gated supplies being distributed to said circuitry through the plurality of die layers, wherein the circuitry is divided into separate gated supply domains each having an associated gated supply from the one or more gated supplies, and wherein the circuitry corresponds to a core of a processor.