초록 ▼

A method and an apparatus are used in hot swap of AC or DC line replaceable modules (40A). The apparatus according to one embodiment comprises a pin assembly (183), the pin assembly (183) being connectable to a module (40A) and connectable to a backplane (104), the pin assembly (183) resistively red

A method and an apparatus are used in hot swap of AC or DC line replaceable modules (40A). The apparatus according to one embodiment comprises a pin assembly (183), the pin assembly (183) being connectable to a module (40A) and connectable to a backplane (104), the pin assembly (183) resistively reducing a current associated with the module (40A) during disconnection of the module (40A) from the backplane (104), and presenting a high resistance to the module (40A) during connection of the module (40A) to the backplane (104), and a low resistance to the module (40A) at completion of the connection of the module (40A) to the backplane (104); and a hot swap detector (134) connectable to the pin assembly (183), the hot swap detector (134) detecting the disconnection of the module (40A) from the backplane (104), and detecting the connection of the module (40A) to the backplane (104).

대표청구항 ▼

I claim: 1. An apparatus for hot swap of AC or DC line replaceable modules, said apparatus comprising:a pin assembly, said pin assembly being connectable to a module and connectable to a backplane, said pin assemblyresistively reducing a current associated with said module during disconnection of sa

I claim: 1. An apparatus for hot swap of AC or DC line replaceable modules, said apparatus comprising:a pin assembly, said pin assembly being connectable to a module and connectable to a backplane, said pin assemblyresistively reducing a current associated with said module during disconnection of said module from said backplane, andpresenting a high resistance to said module during connection of said module to said backplane, and a low resistance to said module at completion of said connection of said module to said backplane; anda hot swap detector connectable to said pin assembly, said hot swap detector detecting said disconnection of said module from said backplane, and detecting said connection of said module to said backplane, wherein:said pin assembly comprises a first pin and a second pin,said first pin charges bulk capacitors on said module when said module is connected to said backplane, andsaid second pin subsequently shorts out said first pin.