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Cooling system for a computer system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0578578 (2004-11-08)
등록번호 US7971632 (2011-06-21)
국제출원번호 PCT/DK2004/000775 (2004-11-08)
§371/§102 date 20060505 (20060505)
국제공개번호 WO05/045654 (2005-05-19)
발명자 / 주소
  • Eriksen, André Sloth
출원인 / 주소
  • Asetek A/S
대리인 / 주소
    Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
인용정보 피인용 횟수 : 27  인용 특허 : 44

초록

The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amou

대표청구항

The invention claimed is: 1. A cooling system for a computer system processing unit, comprising:an integrated element, a heat radiator, and a fan, wherein the integrated element comprises a heat exchanging interface, a reservoir, and a pump;wherein the reservoir is adapted to receive a cooling liqui

이 특허에 인용된 특허 (44)

  1. Sanjay K. Roy, Active cold plate/heat sink.
  2. Salmonson Richard B., Air or liquid cooled computer module cold plate.
  3. Robert A. Schmidt ; Bruce A. Smetana ; Thomas T. Weir, Brushless coolant pump and cooling system.
  4. Chien Chuan-Fu,TWX, CPU cooling system.
  5. Hamilton Robin E. ; Fagan Thomas J. ; Kennedy Paul G. ; Woodward William S., Closed loop liquid cooling for semiconductor RF amplifier modules.
  6. Scott, Alexander Robin Walter, Computer cooling apparatus.
  7. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled.
  8. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover.
  9. Cheon Kioan, Cooling system for computer.
  10. Kelly, Kevin W.; Harris, Chad R.; Despa, Mircea S., Crossflow micro heat exchanger.
  11. Kevin W. Kelly ; Chad R. Harris ; Mircea S. Despa, Crossflow micro heat exchanger.
  12. Alvaro Nicolino,ITX, Device for controlling a synchronous electric motor with a permanent magnet rotor.
  13. Batchelder John Samuel, Heat exchange apparatus.
  14. Batchelder John Samuel, Heat exchange apparatus.
  15. Burward-Hoy Trevor (Cupertino CA), Heat exchanger for electronic equipment.
  16. Hsieh Hsin-Mao,TWX, Heat radiating device for notebook computer.
  17. Rife William B. ; Pare Rodney H., Heat sink assembly with adjustable mounting clip.
  18. Reichard Jeffrey A. (Menomonee Falls WI), Heat sink for electrical circuit components.
  19. Frankeny Richard F. (Elgin TX) Hermann Karl (Austin TX), Heat sink for utilization with high density integrated circuit substrates.
  20. Lin Andy,TWX, Heat sink mounting structure.
  21. Tata Peter D., Heatsink assembly with adjustable retaining clip.
  22. Gektin, Vadim; Novotny, Shlomo; Vogel, Marlin R., Heatsink with active liquid base.
  23. Malone,Christopher G.; Simon,Glenn C.; Barsun,Stephan K., High serviceability liquid cooling loop using flexible bellows.
  24. Wang, Chin-Wen, Hydronic pump type heat radiator.
  25. Roy,Sanjay K., Impeller driven active heat sink.
  26. Groshong Leroy E. (Portland OR) Groshong Judson C. (Beaverton OR) Brawn ; deceased R. James (late of Portland OR by Stanley C. Fisher ; administrator), Infusion pump.
  27. Morris, Terrel L.; Belady, Christian L, Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump.
  28. Chen Shiaw-Jong S. ; Hooey Roger J. ; Radke Robert E., Integrated active cooling device for board mounted electric components.
  29. Jahns Thomas M. (Schenectady NY), Integrated current sensor torque control for ac motor drives.
  30. Jairazbhoy,Vivek A.; Reddy,Prathap A.; Trublowski,John, Liquid cooled semiconductor device.
  31. Minamitani, Rintaro; Kitano, Makoto; Ashiwake, Noriyuki; Ohashi, Shigeo; Kondo, Yoshihiro; Naganawa, Takashi; Yoshitomi, Yuji; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using the same.
  32. Gwin, Paul J.; Konstad, Rolf A., Liquid cooling system for processors.
  33. Weber, Richard M.; Barson, George F.; Koehler, Michael D., Method and apparatus for cooling heat-generating structure.
  34. Abbondanti Alberto (Penn Hills PA), Method and apparatus for sampling output AC currents in a voltage-fed inverter power supply.
  35. Iversen Arthur H. (Saratoga CA), Multi-chip module cooling.
  36. Hamilton Robin E. ; Kennedy Paul G. ; Vale Christopher R., Non-mechanical magnetic pump for liquid cooling.
  37. Bingler, Douglas J., Pump system for use in a heat exchange application.
  38. Hata,Yukihiko; Tomioka,Kentaro, Pump, electronic apparatus, and cooling system.
  39. Lustwerk Ferdinand, Sealed motor driven centrifugal fluid pump.
  40. Simpkins, Haskell; Thomas, Stephen M.; Labarge, William J., Solid oxide fuel cell having a monolithic heat exchanger and method for managing thermal energy flow of the fuel cell.
  41. Komatsu Fumito (1632-12 Nomura ; Ooazo Hiroaka ; Shiojini Nagand-ken JPX), Start-up method for synchronous motors.
  42. Purson Herv (Drme FRX) Girardin Denis (Drme FRX), Synchronous motor having selectable rotation direction.
  43. Stefanoski,Zoran; Kim,Jeong H., System for efficiently cooling a processor.
  44. Neng-Chao Chang TW, Water/air dual cooling arrangement for a CPU.

이 특허를 인용한 특허 (27)

  1. Tang, Xian-Xiu, Computer casing having liquid cooling unit.
  2. Moore, David Allen; Franz, John P.; Cader, Tahir; Sabotta, Michael Lawrence, Cooling assembly.
  3. Keller, Scott W.; Rousser, Donald, Cooling pump assembly and cooling system for utility vehicle.
  4. Eriksen, André Sloth, Cooling system for a computer system.
  5. Eriksen, André Sloth, Cooling system for a computer system.
  6. Eriksen, André Sloth, Cooling system for a computer system.
  7. Eriksen, André Sloth, Cooling system for a computer system.
  8. Eriksen, André Sloth, Cooling system for a computer system.
  9. Lyon, Geoff Sean, Fluid heat exchange systems.
  10. Lyon, Geoff Sean, Fluid heat exchange systems.
  11. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  12. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  13. Keller, Scott W., Generator/cooling assembly and system for utility vehicle.
  14. Tsai, Chang-han; Tsai, Shui-Fa, Heat dissipating module, heat dissipating system and circuit module.
  15. Moore, David A; Franz, John P; Cader, Tahir; Sabotta, Michael L, Heat dissipating system.
  16. Lu, Chao-Wen, Heat dissipation device and portable electronic device.
  17. Franz, John P; Cader, Tahir; Sabotta, Michael L; Moore, David A, Liquid cooling.
  18. Franz, John P.; Sabotta, Michael L.; Cader, Tahir; Moore, David A., Liquid temperature control cooling.
  19. Huang, Tai-Chi, Liquid-cooled heat sink.
  20. Huang, Tai-Chi, Liquid-cooled heat sink for electronic devices.
  21. Lyon, Geoff Sean; Holden, Mike; Gierl, Brydon, Manifolded heat exchangers and related systems.
  22. Lyon, Geoff Sean; Holden, Mike; Gierl, Brydon, Modular heat-transfer systems.
  23. Moore, David A; Franz, John P; Cader, Tahir; Sabotta, Michael L, Modular rack system.
  24. Keller, Scott W.; Hauser, Raymond, Power and cooling system for utility vehicle.
  25. Mounioloux, Stephen, Radiator with integrated pump for actively cooling electronic devices.
  26. Best, Christiaan Scott, System and method for air-cooling hard drives in liquid-cooled server rack.
  27. Best, Christiaan Scott, System and method of packaging computing resources for space and fire-resistance.
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