$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Computer cooling system with preferential cooling device selection 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G05D-023/00
출원번호 US-0969766 (2008-01-04)
등록번호 US7991515 (2011-07-19)
우선권정보 CA-2007-573941(2007-01-15)
발명자 / 주소
  • Lyon, Geoff Sean
  • Holden, Michael James
출원인 / 주소
  • Coolit Systems Inc.
대리인 / 주소
    Bennett Jones LLP
인용정보 피인용 횟수 : 8  인용 특허 : 133

초록

A method for cooling an electronic component includes: providing an electronic component and a cooling device to cool the electronic component; determining the heat generating ability of the electronic component; and driving operation of the cooling device to cool the electronic component based on t

대표청구항

We claim: 1. A method for cooling a computer, the method comprising:providing a computer and a cooling system to cool the computer, the cooling system including a louder cooling device and a higher power consuming cooling device;determining the heat generating ability of the computer by determining

이 특허에 인용된 특허 (133)

  1. Meir, Ronen, Active cooling system for CPU and semiconductors also enabling thermal acceleration.
  2. Erler William F. ; O'Hagan Timothy P. ; Grzelak Keith D., Active cooling system for cradle of portable electronic devices.
  3. Mansingh Vivek (Santa Clara CA), Air-cooled heat exchanger for electronic circuit modules.
  4. Smithers Matthew (Lewisville TX), Anchor for securing a heat sink to a printed circuit board.
  5. Hironori Tanaka JP, Apparatus and system for cooling a portable device.
  6. Broder Damon ; Hood ; III Charles D., Apparatus for cooling a heat generating component in a computer.
  7. Anderton Richard L. (West Jordan UT) Curtis Steven E. (Salt Lake City UT), Apparatus for cooling charge coupled device imaging systems.
  8. Hazen William A. (Hopkinton MA), Apparatus for cooling circuits.
  9. Pokhama, Himanshu, Apparatus for cooling heat generating components within a computer system enclosure.
  10. Tanaka Naoto,JPX ; Moritsugi Katsuyuki,JPX, Assembled structure having an enlarged heat transfer area for heat radiation therefrom.
  11. Burn Mark N. (1221 Tyler St. Port Townsend WA 92368), Baffleless tube and shell heat exchanger having fluted tubes.
  12. Lin Shih-Hao,TWX, Ball grid array package with conductive leads.
  13. Kanda Atsushi (Hyogo JPX) Kitani Kazuo (Hyogo JPX) Shirai Kiichirou (Kanagawa JPX), Boiling refrigerant-type cooling system.
  14. Smith Dean L. ; Sobresky Edmund J. ; Kerr Roger S., Bonded cast, pin-finned heat sink and method of manufacture.
  15. Chien Chuan-Fu,TWX, CPU cooling system.
  16. Chien Chuan-Fu,TWX, CPU heat sink.
  17. Ahmann Gerald L. (St. Paul MN) Carlson Douglas M. (Anoka MN) Marquardt Warren B. (Stillwater MN) Offerdahl Richard E. (Shoreview MN) Paulson Roger A. (New Brighton MN) Vacca Anthony A. (New Brighton , Circuit packaging and cooling.
  18. Rolf A. Konstad, Computer assembly for cooling high powered microprocessors.
  19. Porter Warren W. (Escandido CA), Computer component cooling system with local evaporation of refrigerant.
  20. Scott, Alexander Robin Walter, Computer cooling apparatus.
  21. Scott,Alexander Robin Walter, Computer cooling apparatus.
  22. Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
  23. Macias Jose Javier ; Silva Rogelio Hernandez, Computer enclosure cooling unit.
  24. Sauciuc,Ioan; Chrysler,Gregory M.; Mahajan,Ravi V., Computer system having controlled cooling.
  25. Chen,Robert, Contractible and extentable laptop computer external cooler pad.
  26. Agonafer Dereje (Poughkeepsie NY) Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (Mecha, Convertible heat exchanger for air or water cooling of electronic circuit components and the like.
  27. Hosaka Tadao (Yamanashi JPX), Cooling apparatus for electronic equipment with fail-safe condensation protection.
  28. Takahashi Tatsuya,JPX ; Zushi Shizuo,JPX ; Ogata Tetsuo,JPX, Cooling apparatus for use in an electronic system.
  29. Parish IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion.
  30. Arii Hiroshi (Kawasaki JPX) Kawada Hirohito (Mitaka JPX) Yoshida Takashi (Tokyo JPX) Nonaka Chiaki (Tokyo JPX), Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat con.
  31. Heide Wilfried (Altenberg DEX) Muller Friedrich (Nuremberg DEX) Otto Klaus (Nuremberg DEX) Salanki Tibor (Erlangen DEX), Cooling capsule for a thyristor.
  32. Hisano,Katsumi; Takamatsu,Tomonao; Iwasaki,Hideo, Cooling device for electronic element producing concentrated heat and electronic device.
  33. St.ang.hl Lennart ; Wallace ; Jr. John Francis ; Parraz John Carlenas ; Clark Montford Henry ; Winn David, Cooling system and method for distributing cooled air.
  34. Cardella Mark A., Cooling system and method of cooling electronic devices.
  35. Yamamoto Haruhiko (Yokohama JPX) Suzuki Masahiro (Tokyo JPX) Udagawa Yoshiaki (Tokyo JPX) Nakata Mitsuhiko (Kawasaki JPX) Katsuyama Koji (Yokohama JPX) Ono Izumi (Hachioji JPX) Kikuchi Shunichi (Yoko, Cooling system for an electronic circuit device.
  36. Cheon Kioan, Cooling system for computer.
  37. Kikuchi Shunichi (Yokohama JPX) Matsunaga Haruyuki (Atsugi JPX) Katsumi Hideo (Sagamihara JPX) Katsuyama Koji (Yokohama JPX), Cooling system for electronic circuit components.
  38. Mizuno Tsukasa (Tokyo JPX) Okano Minoru (Tokyo JPX), Cooling system for electronic equipment.
  39. Shibasaki Kazuya,JPX, Cooling unit for cooling a heat-generating component and electronic apparatus having the cooling unit.
  40. Chu ; Bing-Lun ; Subbarao ; Wunnava Venkata ; Peale ; Jack ; McCune ; Ke nt ; Steiner ; Marvin Elroy, D-I-P On island.
  41. Carter, Thomas P.; Aaron, David A.; Morrison, Frank T., Densified heat transfer tube bundle.
  42. Logan Max C. (Maplewood MN) Nordstrom Jon T. (Forrest Lake MN), Dew point sensitive computer cooling system.
  43. Kandelman Allen (Granada Hills CA), Distributed accumulator.
  44. Pokharna, Himanshu; DiStefano, Eric, Docking station to cool a computer.
  45. Koizumi Shigeru (Hadano JPX) Zushi Shizuo (Hadano JPX) Komiya Mitsuo (Hadano JPX), Electronic apparatus and method of cooling the same.
  46. Go Hiroshi (Zama JPX) Zushi Shizuo (Hadano JPX) Miyamoto Mitsuo (Hadano JPX), Electronic apparatus cooling system.
  47. Tajima Makoto,JPX, Electronic component cooling unit.
  48. Chang Neng Chao,TWX, Electronic device cooling arrangement.
  49. Ohashi Shigeo (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Tanaka Takeo (Minori-machi JPX) Iwai Susumu (Hadano JPX), Electronic equipment and lap-top type electronic equipment.
  50. Herbert Edward, Fan with heat sink using stamped heat sink fins.
  51. Nakamichi Niro (Tokyo JPX), Finned heat sink.
  52. Meng-Cheng Huang TW; Tony Wang TW, Flow channel type heat dissipating fin set.
  53. Bartholomew Donald D. (Marine MI), Fluid pressure surge damper for a fluid system.
  54. Alexander Arthur Ray ; Porter ; deceased Warren W., Focused air cooling employing a dedicated chiller.
  55. Tobias,David F., Forward-looking fan control using system operation information.
  56. Sui-Lin Lim GB, Generic external portable cooling device for computers.
  57. Li, Yue-Jun, Heat dissipation assembly.
  58. Zhao,Liang Hui; Wu,Yi Qiang, Heat dissipation device.
  59. Lai, Cheng-Tien; Lee, Tsung-Lung; Wang, Shenghua, Heat dissipation device with working liquid received in circulatory route.
  60. Degtiarenko, Pavel V., Heat exchange apparatus.
  61. Andrew W. Batchelor AU; Ben Banney AU; David McDonald AU; Tilak T. Chandratilleke AU, Heat exchanger for an electronic heat pump.
  62. Batchelor, Andrew W.; Banney, Ben; McDonald, David; Chandratilleke, Tilak T., Heat exchanger for an electronic heat pump.
  63. Burward-Hoy Trevor, Heat exchanger for electronic equipment.
  64. Todd, John J.; Longsderff, David R.; Toth, Jerome E., Heat pipe fin stack with extruded base.
  65. Kolman Frank (Phoenix AZ) Brownell Michael (Chandler AZ) Xie Hong (Chandler AZ), Heat pipe to baseplate attachment method.
  66. Itoh Satomi (Hyogo JPX), Heat radiating device.
  67. Huang Yao-Lee,TWX, Heat sink.
  68. Scott, Alexander Robin Walter, Heat sink.
  69. Wang Steven,TWX, Heat sink.
  70. Hsieh, George; Anderson, George R.; Floyde, Cheryl M., Heat sink and retaining clip assembly.
  71. Minakami Ko (Kawasaki JPX) Terashima Toshinori (Yokohama JPX) Maeda Toshio (Yokohama JPX) Sasaki Tomiya (Kawasaki JPX) Hisano Katsumi (Yokohama JPX) Iwasaki Hideo (Kawasaki JPX) Kawano Koichiro (Yoko, Heat sink and the producing method thereof.
  72. Wang Michael (Taipei Hsien TWX), Heat sink assembly for a central processing unit of a computer.
  73. Chun-Chi Chen TW, Heat sink assembly with dual fans.
  74. He, Li; Lee, Tsung-Lung; Lai, Cheng-Tien, Heat sink clip assembly.
  75. Wargo Alec, Heat sink device for power semiconductors.
  76. Casey R. Winkel ; Michael Z. Eckblad, Heat sink mounting method and apparatus.
  77. Wang Mei-Cheng,TWX, Heat sink with flanged portions and spaced apart metal radiating fins.
  78. Macris, Chris, Heat sink/heat spreader structures and methods of manufacture.
  79. Christopher L. Jones, Heat transfer apparatus for sample containing well plates.
  80. Lai Yaw-Huey (Taipei TWX), Heat-dissipating device for a central processing unit chip.
  81. Yu Shu-Jen,TWX, Heat-radiating structure for CPU.
  82. Budelman Gerald A. (Aloha OR), High efficiency heat removal system for electric devices and the like.
  83. Mertol Atila, High performance heat spreader for flip chip packages.
  84. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  85. Chrysler Gregory M. ; Chu Richard C., Hybrid cooling system for electronics module.
  86. Mongia,Rajiv K.; Pokharna,Himanshu; DiStefano,Eric; McEuen,Shawn S.; Wilk,Brian A., IC coolant microchannel assembly with integrated attachment hardware.
  87. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA), Integral heat pipe, heat exchanger, and clamping plate.
  88. Herbst ; II Gerhardt G. (1161 N. Woodsmill Rd. ; Apt C Chesterfield MO 63017), Integrated circuit cooling apparatus.
  89. Swiatosz Edmund (Maitland FL), Integrated circuit temperature gradient and moisture regulator.
  90. Goloff C. Nickolas, Internal accumulator for hydraulic systems.
  91. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  92. Chu Richard C. ; Ellsworth ; Jr. Michael J. ; Simons Robert E., Isothermal heat sink with converging, diverging channels.
  93. Lu Chun Hsin,TWX, Knockdown CPU heat dissipater.
  94. Moskalik,Andrew J.; Gray, Jr.,Charles L., Lightweight low permeation piston-in-sleeve accumulator.
  95. Donahoe Daniel N. ; Gill Michael T., Liquid cooled computer apparatus and associated methods.
  96. Lavochkin Ronald B., Liquid cooled heat sink for cooling electronic components.
  97. Du Sterling ; Shyr You-Yuh ; Kuo Chuan Chiung,TWX ; Yeh Shih Ping,TWX, Look-ahead closed-loop thermal management.
  98. Gray, Jr.,Charles L., Low permeation hydraulic accumulator.
  99. Miller William C. (Owego NY) Smith Russell N. (Friendsville PA) Stutzman Randall J. (Vestal NY), Low temperature conduction module for a cryogenically-cooled processor.
  100. Jay R. Forkas, Mechanical configuration for retaining inboard mounting hardware on finned heat dissipating devices.
  101. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  102. Nishigaki,Nobutaka; Ninomiya,Ryoji; Sakai,Makoto, Method and apparatus for controlling internal heat generating circuit.
  103. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  104. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  105. Porter Warren W. (Escondido CA) Lauffer Donald K. (San Diego CA), Method and apparatus for low temperature integrated circuit chip testing and operation.
  106. Wald, Steven F., Method and apparatus for monitoring and controlling the thermal environment and operating conditions of an integrated circuit.
  107. Suski Edward D. (Lake Forest CA), Method and apparatus for recovering power from semiconductor circuit using thermoelectric device.
  108. Searls, Damion T.; Dishongh, Terrance J.; Jackson, James D.; Morgan, Thomas O.; Weston, Roth O., Method and apparatus for thermally controlling multiple electronic components.
  109. Vernon P. Bollesen, Method for thermally connecting a heat sink to a cabinet.
  110. Matthews James A. (Milpitas CA), Method of fabricating a heat exchanger for solid-state electronic devices.
  111. Smith Dean L. ; Sobresky Edmund J. ; Kerr Roger S., Method of manufacturing an extruded, tiered high fin density heat sink.
  112. Huynh,Hong; King,Anthony; Narasimhan,Susheela, Methods and apparatus for installing a heat sink using surface mount technology.
  113. Pokharna, Himanshu; Chrysler, Gregory M., Mobile computer system with detachable thermoelectric module for enhanced cooling capability in a docking station.
  114. Mundinger David C. ; Worland D. Philip, Modular microchannel heat exchanger.
  115. Chen,Richard; Lee,Yen Lun, Modularized redundant heat sink for dissipating heat generated from chips.
  116. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Moisture barrier seals for cooled IC chip module assemblies.
  117. Nam Sang Sig,KRX ; Kwak Ho Young,KRX ; Kim Jae Hee,KRX, Multi chip module cooling apparatus.
  118. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
  119. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA) Schulte John (Mountain View CA), Optimized integral heat pipe and electronic circuit module arrangement.
  120. Aguilera Rafael E. (Simpsonville SC), Passive CPU cooling and LCD heating for a laptop computer.
  121. Agnew David L., Pre-loaded elastomeric accumulator for hydraulic system.
  122. Christie Alan M. (Swissvale PA) Snyder Kurt I. (Murrysville PA), Pressure surge attenuator.
  123. Wang, Jui-Tung, Protective shield for against damaging circuit board and for safeguarding chip.
  124. Sorensen,George A.; Michaud,Bruce R., Quick-connect thermal solution for computer hardware testing.
  125. Lee Sang-cheol,KRX, Radiator for heat generating components in electronic equipment.
  126. Lee Sang-cheol,KRX, Radiator for heat generating components in electronic equipment.
  127. Sang-cheol Lee KR, Radiator for heat generating components in electronic equipment.
  128. Nicol Edward A. (San Diego CA) Adrian George J. (San Diego CA), Self-aligning liquid-cooling assembly.
  129. Kuo Dah-Chyi,TWX, Stack-fin radiator.
  130. Ostergren Carl D. (Montgomery NY) Paivanas ; deceased John A. (late of Williamsville NY by Sophia Paivanas ; executor), Thermal conduction disc-chip cooling enhancement means.
  131. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Thermoelectric-enhanced heat spreader for heat generating component of an electronic device.
  132. Carney Thomas James, Thin wall, high pressure, volume compensator.
  133. Henry, Robert E.; Farrington, James M.; Kalebich, Joseph M., Waterhammer suppression apparatus.

이 특허를 인용한 특허 (8)

  1. Zwinger, Steven F.; Vaidyanathan, Kalyanaraman; Gross, Kenny C., Controlling a cooling fan for a storage array.
  2. Stiver, David W.; Imwalle, Gregory P., Data center thermal monitoring.
  3. Stiver, David W.; Imwalle, Gregory P., Data center thermal monitoring.
  4. Helberg, Christopher; Meyers, David M., Dual mode portable information handling system cooling.
  5. Cui, Yan; Gao, Tianyi; Ingalz, Charles J.; Heydari, Ali, Method and system for removing heat using heat removal liquid based on workload of server components of electronic racks.
  6. Kato, Takeshi; Nakajima, Tadakatsu; Saito, Tatsuya; Okitsu, Jun; Shiga, Yoko; Miki, Yoshio, Operations management methods and devices thereof in information-processing systems.
  7. Kato, Takeshi; Nakajima, Tadakatsu; Saito, Tatsuya; Okitsu, Jun; Shiga, Yoko; Miki, Yoshio, Operations management methods and devices thereof in systems.
  8. Rowan, Michael T.; Rocca, Christopher; Anthony, Michael D.; Matusiak, Adam; Henriksen, Michael; White, William; Guha, Aloke, Techniques for power analysis.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로