초록 ▼

An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an elect

An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.

대표청구항 ▼

The invention claimed is: 1. A method of manufacturing an interconnect device for connecting to a heat generating device and for connection to a power source, comprising:forming a base member by a first shot of material;overmolding a portion of said base member with a material in a second shot;one o

The invention claimed is: 1. A method of manufacturing an interconnect device for connecting to a heat generating device and for connection to a power source, comprising:forming a base member by a first shot of material;overmolding a portion of said base member with a material in a second shot;one of said first and second shots being a non-plateable, insulative material and the other of said shots being a plateable material;forming a first plated component on said plateable material, said first plated providing a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device; andforming a second plated component on said plateable material, said second plated providing an electrical path between the heat generating device and the circuit member.