초록 ▼

A flexible thermoelectric device and a manufacturing method thereof are provided. Flexible substrates are formed by using LIGA process, micro-electro-mechanical process or electroforming technique. The flexible substrates are used to produce thermoelectric device. The structure and the material prop

A flexible thermoelectric device and a manufacturing method thereof are provided. Flexible substrates are formed by using LIGA process, micro-electro-mechanical process or electroforming technique. The flexible substrates are used to produce thermoelectric device. The structure and the material property of the substrates offer flexible property and tensile property to the thermoelectric device. Thermal transfer enhancement structures such as thermal via or metal diffusion layer are formed on the flexible substrates to overcome the low thermal transfer property of the flexible substrates.

대표청구항 ▼

What is claimed is: 1. A flexible thermoelectric device, comprising:a first substrate and a second substrate, wherein at least one of the first substrate and the second substrate has flexibility;a plurality of thermoelectric pairs, disposed between the first substrate and the second substrate, where

What is claimed is: 1. A flexible thermoelectric device, comprising:a first substrate and a second substrate, wherein at least one of the first substrate and the second substrate has flexibility;a plurality of thermoelectric pairs, disposed between the first substrate and the second substrate, wherein each of the thermoelectric pairs is composed of a first type thermoelectric member and a second type thermoelectric member;a plurality of first electrodes, disposed between the first substrate and the thermoelectric pairs; anda plurality of second electrodes, disposed between the second substrate and the thermoelectric pairs, wherein the first type thermoelectric member and the second thermoelectric member of each of the thermoelectric pairs are alternatively connected with each other in series by the first electrodes and the second electrodes, wherein at least one of the first substrate and the second substrate has a plurality of buffer structures, and the buffer structures is deformed along the substrate direction when the thermoelectric device substrate is warped or stretched.