초록 ▼

A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials. Also disclosed is a laminated wafer wherein a first layer has different thermal properties than a second laye

A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials. Also disclosed is a laminated wafer wherein a first layer has different thermal properties than a second layer of the wafer.

대표청구항 ▼

What is claimed is: 1. A method for forming a laminated wafer comprising the following steps in the sequence set forth:(a) placing the laminated wafer having at least a cellulose resin protective layer and a polycarbonate base layer in a heated environment having a first temperature capable of softe

What is claimed is: 1. A method for forming a laminated wafer comprising the following steps in the sequence set forth:(a) placing the laminated wafer having at least a cellulose resin protective layer and a polycarbonate base layer in a heated environment having a first temperature capable of softening at least the base layer;(b) exposing the base layer to heat at a second temperature higher than the first temperature; and(c) allowing the laminated wafer to form into a desired shape.