초록 ▼

Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and include

Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and includes a housing configured to at least partially surround and form a sealed compartment about the electronic device. Additionally, the cooling apparatus includes dielectric fluid and one or more pumps disposed within the sealed compartment. The dielectric fluid is in direct contact with the electronic device, and the pump is an impingement-cooling, immersed pump disposed to actively pump dielectric fluid within the sealed compartment towards the electronic device. Multiple condenser fins extend from the housing into the sealed compartment in an upper portion of the sealed compartment, and a liquid-cooled cold plate or an air-cooled heat sink is coupled to the top of the housing for cooling the condenser fins.

대표청구항 ▼

What is claimed is: 1. A cooling apparatus comprising: a housing configured to at least partially surround and form a sealed compartment about an electronic device to be cooled; a dielectric fluid disposed within the sealed compartment, wherein the electronic device to be cooled is at least partiall

What is claimed is: 1. A cooling apparatus comprising: a housing configured to at least partially surround and form a sealed compartment about an electronic device to be cooled; a dielectric fluid disposed within the sealed compartment, wherein the electronic device to be cooled is at least partially immersed within the dielectric fluid; at least one pump disposed within the sealed compartment for actively pumping the dielectric fluid disposed within the sealed compartment towards the electronic device to be cooled, the at least one pump comprising an impingement-cooling, immersed pump disposed within the sealed compartment, the impingement-cooling, immersed pump actively pumping the dielectric fluid drawn via an inlet from a lower region of the sealed compartment towards the electronic device to be cooled; and an at least partially submerged baffle disposed adjacent to at least one side of the electronic device to be cooled to facilitate directing of dielectric fluid vapor to an upper region of the sealed compartment, and away from the dielectric fluid in the lower region of the sealed compartment being drawn into the impingement-cooling, immersed pump for active pumping via an outlet towards the electronic device to be cooled, wherein the inlet and the outlet of the impingement-cooling, immersed pump are disposed on different sides of the at least partially submerged baffle.