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Cooling apparatus, systems, and methods 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-021/02
출원번호 US-0990075 (2004-11-16)
등록번호 US8024936 (2011-09-13)
발명자 / 주소
  • Storm, Bruce H
  • Chen, Dingding
  • Song, Haoshi
출원인 / 주소
  • Halliburton Energy Services, Inc.
대리인 / 주소
    Schwegman, Lundberg & Woessner, P.A.
인용정보 피인용 횟수 : 7  인용 특허 : 54

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (54)

  1. Tonkovich Anna Lee Y. ; Roberts Gary L. ; Call Charles J. ; Wegeng Robert S. ; Wang Yong, Active microchannel heat exchanger.
  2. Flores Aaron G. (Sugar Land TX), Apparatus and method for actively cooling instrumentation in a high temperature environment.
  3. Hache, Jean-Michel, Apparatus and method for actively cooling instrumentation in a high temperature environment.
  4. DiFoggio, Rocco; Reittinger, Peter W., Atomic clock for downhole applications.
  5. Cotte, John Michael; McCullough, Kenneth John; Moreau, Wayne Martin; Simons, John P.; Taft, Charles J.; Volant, Richard P., Check valve for micro electro mechanical structure devices.
  6. Hamilton Robin E. ; Fagan Thomas J. ; Kennedy Paul G. ; Woodward William S., Closed loop liquid cooling for semiconductor RF amplifier modules.
  7. Bennett Gloria A. (Los Alamos NM), Compact acoustic refrigerator.
  8. MacCracken Calvin D. (Englewood NJ), Compact storage of seat and coolness by phase change materials while preventing stratification.
  9. Potter Robert M. ; Tester Jefferson W., Continuous drilling of vertical boreholes by thermal processes: including rock spallation and fusion.
  10. Gunnerson Fred S. (Oviedo FL) Sanderlin F. Dave (Lakeland FL) Iurato Joy R. (Tampa FL) Padilla Antonio A. (Tampa FL), Controllable heat pipes for thermal energy transfer.
  11. Patel, Chandrakant D.; Obermaier, Hannsjorg; Barber, Vernon Alan, Cooling plate arrangement for electronic components.
  12. Wyland Christopher P., Device and method for convective cooling of an electronic component.
  13. Michael H. Bunyan, Double-side thermally conductive adhesive tape for plastic-packaged electronic components.
  14. Rocco DiFoggio, Downhole sorption cooling of electronics in wireline logging and monitoring while drilling.
  15. Owens Steve (Katy TX) Bouldin Brett (Pearland TX), Downhole system for extending the life span of electronic components.
  16. Boesen George F. (Park Ridge IL), Downhole thermoelectric refrigerator.
  17. de Kanter Scipio (Missouri City TX), Downhole tool cooling system.
  18. Bell, Lon E., Efficiency thermoelectrics utilizing thermal isolation.
  19. Gates William George,GBX, Electronic apparatus.
  20. Carlson Douglas M. (Anoka MN) Ohman Randall L. (San Antonio TX) Thorndyke Lloyd M. (Edina MN), Electronic module cooling system using parallel air streams.
  21. da Silva, Elson Dias, Fluid conduction utilizing a reversible unsaturated siphon with tubarc porosity action.
  22. Clay Rufus G. (5500 Byers Fort Worth TX 76107), Geothermal energy recovery.
  23. Goiffon John J. (Grapevine TX) Thawley S. Tom (Dallas TX), Heat sink/retainer clip for a downhole electronics package of a measurements-while-drilling telemetry system.
  24. Sharp, Stanley O., High density electronics packaging system for hostile environment.
  25. Drube, Paul; Neeser, Timothy; Shaw, Thomas; Wondra, David, High flow pressurized cryogenic fluid dispensing system.
  26. Magda Mankaruse ; Nagui Mankaruse, High performance cold plate.
  27. Steinmeyer Florian,DEX, Indirect cooling system for an electrical device.
  28. Bhatia,Rakesh, Integrated circuit cooling apparatus and method.
  29. Owens Steve ; Bouldin Brett ; Elliott Gary, Integrated converter for extending the life span of electronic components.
  30. Himanshu Pokharna ; Eric DiStefano, Method and apparatus for external cooling an electronic component of a mobile hardware product, particularly a notebook computer, at a docking station having a thermoelectric cooler.
  31. LaGrotta James T. ; LaGrotta Richard T., Method and apparatus for heat regulating electronics products.
  32. Burward-Hoy Trevor, Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment.
  33. Edelson Jonathan Sidney,ILX, Method and apparatus for vacuum diode heat pump.
  34. Skala Stephen F. (3839 S. Wenonah Ave. Berwyn IL 60402), Method for reducing thermal degradation of a heat exchange fluid.
  35. Fripp,Michael L.; Storm, Jr.,Bruce H.; Huh,Michael; Schultz,Roger Lynn, Methods of heating energy storage devices that power downhole tools.
  36. Stephen D. O'Connor ; Eugene Dantsker, Microfluidic devices for heat transfer.
  37. Darren W. Simmons ; Arthur G. Rudick, Modular eutectic-based refrigeration system.
  38. Mundinger David C. ; Worland D. Philip, Modular microchannel heat exchanger.
  39. Bhatia Rakesh, Package with integrated thermoelectric module for cooling of integrated circuits.
  40. Marsala, Joseph, Pumped liquid cooling system using a phase change refrigerant.
  41. Storm, Bruce H; Schultz, Roger L.; Fripp, Michael L., Rechargeable energy storage device in a downhole operation.
  42. Rogers, C. James; Hughes, Gregory G.; Zhang, L. Winston; Grippe, Frank M.; Cheema, Rifaquat, Serpentine, slit fin heat sink device.
  43. Storm, Bruce H; Schultz, Roger L.; Fripp, Michael L., Switchable power allocation in a downhole operation.
  44. Artman,Paul T.; Hrehor, Jr.,Robert D., System and method for heat dissipation in an information handling system.
  45. Scherbatskoy Serge A. (Tulsa OK), System for employing high temperature batteries for making measurements in a borehole.
  46. Lagerlef David L. (Eagle River AK) Brady Jerry L. (Anchorage AK) Gerlek Stephen (Anchorage AK) Hightower Charles M. (Plano TX) Wydrinksi Raymond (Lewisville TX), System for monitoring gas lift wells.
  47. Bechis, Massimo; Nassi, Marco, System for transmitting electric energy in superconductivity conditions and method for refrigerating in a continuous superconducting cable.
  48. Bergin, Jonathan M., Thermal interface material having a zone-coated release linear.
  49. Bennett Gloria A. (Los Alamos NM) Elder Michael G. (Los Alamos NM) Kemme Joseph E. (Albuquerque NM), Thermal protection apparatus.
  50. Chen Jie ; Adamski Joseph R. ; Goshayeshi Ali ; Janvrin Bruce, Thermoelectric cooling apparatus.
  51. Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (Mechanicsburg PA), Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability.
  52. Gilley Michael D. ; Webb Ralph L., Thermoelectric device with evaporating/condensing heat exchanger.
  53. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Thermoelectric-enhanced heat exchanger.
  54. Andreas Ronald D. (Albuquerque NM) Heck G. Michael (Albuquerque NM) Kohler Stewart M. (Albuquerque NM) Watts Alfred C. (Albuquerque NM), Wellbore inertial directional surveying system.

이 특허를 인용한 특허 (7)

  1. Kaul, Anmol; Reid, Jr., Lennox E., Axially loaded tapered heat sink mechanism.
  2. Storm, Jr., Bruce H.; Schultz, Roger L.; Fripp, Michael L., Heating and cooling electrical components in a downhole operation.
  3. Mahalingam, Saravana; Naik, Abhay; Kasal, Yathiraj; Hota, Rakesh; Vrukshavai, Rajendra Prasad; Kuriakose, Mathews Leslie; Radhakrishnan, Ravi Anekal, Support structure for electronics having fluid passageway for convective heat transfer.
  4. Marzouk, Joe; Fripp, Michael; Herrera, Adan Hernandez, Thermal component temperature management system and method.
  5. Marzouk, Joe; Fripp, Michael; Herrera, Adan Hernandez, Thermal component temperature management system and method.
  6. Marzouk, Joe; Fripp, Michael; Herrera, Adan Hernandez, Thermal component temperature management system and method.
  7. Murray, Thomas M.; Zielinski, Edward, Variably extending heat transfer devices.
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