초록 ▼

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a fle

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.

대표청구항 ▼

The invention claimed is: 1. A package comprising:a semi-rigid layer having a lateral width and a longitudinal width;a flexible backing layer affixed to the semi-rigid layer forming an inner cavity between the flexible backing layer and the semi-rigid layer;a substrate stored within the inner cavity

The invention claimed is: 1. A package comprising:a semi-rigid layer having a lateral width and a longitudinal width;a flexible backing layer affixed to the semi-rigid layer forming an inner cavity between the flexible backing layer and the semi-rigid layer;a substrate stored within the inner cavity wherein the substrate within the package is selected from nonwoven substrates, woven substrates, hydro-entangled substrates, air-entangled substrates, paper substrates comprising cellulose, facial tissue, toilet paper or paper towels, waxed paper substrates, coform substrates, wet wipes, film or plastic substrates, bandages, gauze, and metal substrates;a die cut formed in the semi-rigid layer, wherein bending the package along the die cut causes a break at the die cut and provides an opening into the inner cavity that retains the substrate within the cavity but allows for direct access to the inner cavity allowing a user to grip an edge of the substrate without tearing open the package;wherein at least a portion of the die cut extends along the lateral width of the semi-rigid layer and at least a portion of the die cut extends along the longitudinal width of the semi-rigid layer closer to a lateral edge of the package than a midpoint of a longitudinal edge of the package.