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Adjacent substantially flexible substrates having integrated circuits that are bonded together by non-polymeric layer

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/40
출원번호 US-0379820 (2003-03-03)
등록번호 US8035233 (2011-09-27)
발명자 / 주소
  • Leedy, Glenn J
출원인 / 주소
  • Elm Technology Corporation
대리인 / 주소
    Useful Arts
인용정보 피인용 횟수 : 6  인용 특허 : 240

초록

A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost Fabrication of 3DS memo

대표청구항

What is claimed is: 1. Circuitry comprising:first, second and third substrates, each substrate having integrated circuits formed thereon and each substrate having a first substantially planar surface, the second substrate having a second substantially planar surface;first thermal diffusion bonds com

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  2. Liu, Jun; Sandhu, Gurtej S., Memory devices and formation methods.
  3. Liu, Jun; Sandhu, Gurtej S., Memory devices and formation methods.
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