초록 ▼

A first packaged integrated circuit (IC) includes a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least on

A first packaged integrated circuit (IC) includes a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least one IC die, an encapsulant over the first surface surrounding the at least one IC die and the plurality of conductive members, wherein at least a portion of each of the plurality of conductive members is exposed by the encapsulant. A second packaged IC may be stacked onto the first packaged IC. The second packaged IC includes at least one IC die and a plurality of conductive members, each conductive member of the plurality of conductive members of the second packaged IC is in contact with a corresponding conductive member of the plurality conductive members of the first packaged IC.

대표청구항 ▼

What is claimed is: 1. A packaged integrated circuit (IC) system comprising:a first packaged IC having a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one

What is claimed is: 1. A packaged integrated circuit (IC) system comprising:a first packaged IC having a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least one IC die, an encapsulant over the first surface surrounding the at least one IC die and the plurality of conductive members, wherein at least a portion of each of the plurality of conductive members is exposed; anda second packaged IC stacked onto the first packaged IC, the second packaged IC having at least one IC die and a first plurality of conductive members electrically connected to the at least one IC die of the second packaged IC, each conductive member of the first plurality of conductive members of the second packaged IC in contact with a corresponding conductive member of the plurality of conductive members of the first packaged IC; andat least one of a first radio frequency shield and a first electromagnetic interference shield arranged above the first packaged IC and at least one of a second radio frequency shield and a second electromagnetic shield arranged above the second packaged IC.