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An exemplary embodiment of a dual band antenna array includes a folded thin circuit board structure with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer, the circuit board structure folded in a plurality of folds to form a pleated structure. A

An exemplary embodiment of a dual band antenna array includes a folded thin circuit board structure with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer, the circuit board structure folded in a plurality of folds to form a pleated structure. A first array of radiator structures on the first surface is configured for operation in a first frequency band in a first polarization sense. A second array of radiator structures is configured for operation in a second frequency band in a second polarization sense. A conductor trace pattern is formed on the folded circuit board to carry control signals, DC power and RF signals. Active RF circuit devices are attached to the folded circuit board in signal communication with the conductor trace pattern.

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What is claimed is: 1. A dual band antenna array, comprising:a folded circuit board comprising a dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer, the circuit board folded in a plurality of folds to form a pleated structure defining a first array of ra

What is claimed is: 1. A dual band antenna array, comprising:a folded circuit board comprising a dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer, the circuit board folded in a plurality of folds to form a pleated structure defining a first array of radiator structures on said first surface, the first array of radiator structures configured for operation in a first frequency band in a first polarization sense;a second array of radiator structures configured for operation in a second frequency band in a second polarization sense, the second array of radiator structures being on a side of the dielectric layer opposite the first surface, wherein the second frequency band is different from the first frequency band;a conductor trace pattern formed on the folded circuit board to carry control signals, DC power and RF signals; anda plurality of active RF circuit devices attached to the folded circuit board in signal communication with said conductor trace pattern.