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Avionics chassis 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0487797 (2009-06-19)
등록번호 US8059409 (2011-11-01)
발명자 / 주소
  • Steenwyk, Meredith Marie
  • Coxon, Danny Weldon
  • Streyle, John Jay
  • Vander Ploeg, Benjamin Jon
출원인 / 주소
  • General Electric Company
대리인 / 주소
    McGarry Bair PC
인용정보 피인용 횟수 : 7  인용 특허 : 69

초록

An avionics chassis comprises a carbon fiber reinforced housing, a card rail for holding an electronic circuit board mounted to an interior surface of the housing, at least one heat-dissipating fin composed of carbon fiber and extending from the outer surface of the housing, a plurality of isotropic

대표청구항

What is claimed is: 1. An avionics chassis assembly comprising:a housing having an outer surface, defining an exterior of the housing, an inner surface, defining an interior of the housing, at least one wall having inner and outer surfaces corresponding to the housing inner and outer surfaces, and m

이 특허에 인용된 특허 (69)

  1. Habing Robert D. ; Odegard Thomas Allan, Adapter kit to allow extended width wedgelock for use in a circuit card module.
  2. Hanewinkel, III,William H; Williams,Mark G, Aircraft heat sink and electronics enclosure.
  3. Amason Myron P. (Stanton CA) Kung Joseph T. (Long Beach CA), Aircraft lightning protection means.
  4. Kuras John Charles (Everett WA) McClam-Brown Nadine (Wyncote PA), Apparatus and methods of providing corrosion resistant conductive path across non conductive joints or gaps.
  5. Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon; Streyle, John Jay, Avionics chassis.
  6. Shigeru Ishii JP; Shigeki Mori JP; Hirokazu Nishimura JP; Shinji Nakai JP, Cable and heat sink.
  7. Yamamoto Iwao,JPX ; Yoshiya Akihiko,JPX ; Nakagoshi Akira,JPX, Carbon fiber woven fabric.
  8. Dilley Roland L. ; Kiser Carl E., Carbon/carbon heat spreader.
  9. Wells, Robert Grayson; Beak, Todd David, Circuit card module including mezzanine card heat sink and related methods.
  10. Giannatto Carl J. ; Cornish Kevin C., Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger.
  11. Lionetta,William G.; Yantosca, Jr.,Louis M.; Ventura,Daniel S.; Severance,Christopher L.; Nobbs,Douglas; Stiffler,Robert E.; Rich,David C., Composite EMI shield.
  12. Do, Anh Tuan, Composite carbon fibre based armour for flexible pipe.
  13. Giannetti William B. (Fall River MA) Hess David G. (Atkinson NH) McCord Stuart J. (Westford MA) Rudd ; III Robert E. (Vergennes VT) Shih Wei-Tei (Yorba Linda CA), Composite enclosure for electronic hardware.
  14. Giannetti William Bernard, Composite enclosure for electronic hardware.
  15. Bulante Roderick A. ; Duncan Gary L. ; Conwell Troy A. ; Quan Dennis ; Stafford John P. ; Lee Sung H., Composite heat sink/support structure.
  16. Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Composite heat transfer means.
  17. Krumweide Gary C. (Escondido CA) Krumweide Duane E. (Escondido CA) Clark Randy (San Diego CA), Composite structure for heat transfer and radiation.
  18. Asfia,Julie F.; Chen,Chung Lung; Cai,Qingjun, Cooling apparatus, system, and associated method.
  19. Hartung,David, Cross-flow redundant air cooling method for high reliability electronics.
  20. Yurko,Joseph M., Device for increased thermal conductivity between a printed wiring assembly and a chassis.
  21. Rogers, Tony; Wilson, Clark; Cook, Gary, Digital micromirror device mounting system.
  22. Xie Hong (Chandler AZ) Aghazadeh Mostafa (Chandler AZ) Turturro Gregory (Chandler AZ) Chiu Chia-Pin (Chandler AZ), Dissipation of heat through keyboard using a heat pipe.
  23. Wong Harry (Monterey Park CA) Chang Stanley S. (Palos Verdes Estates CA) Chang Donald C. (Thousand Oaks CA) Kelly Kenneth C. (Sherman Oaks CA), EHF array antenna backplate including radiating modules, cavities, and distributor supported thereon.
  24. Sarno, Claude; Moulin, Georges, Electronic module with high cooling power.
  25. Ratliff, William Edward; Sealander, Jacob Leland, Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between.
  26. Hoover Ronald E. ; Hutchins Robert S. ; Marble Stuart J. ; Saito Clark A. ; Valle Manuel B., Flexible graphite fiber thermal shunt.
  27. Richey ; III Joseph B., Flexible heat transfer device and method.
  28. Borowiec Joseph A. ; Picot Walter J., Flexible thermal conductor with electromagnetic interference shielding capability for electronic components.
  29. Albert P. Payton, Heat conducting device for a circuit board.
  30. Wenke Gerhard (Los Angeles CA), Heat conducting interface for electronic module.
  31. Krassowski, Daniel W.; Chen, Gary G., Heat dissipating component using high conducting inserts.
  32. Wang, Jack; Cheng, Cheng-Hua; Lin, Michael; Ma, Charles, Heat dissipating device for a CPU.
  33. Nelson ; Lloyd A. ; Sekhon ; Kalwant S., Heat pipe thermal mounting plate for cooling electronic circuit cards.
  34. Dawes Ronald G. (Tamworth GB2) Hilton Geoffrey T. (Solihull GB2) Marshall Anthony W. (Birmingham GB2) Bullivant Derek (Birmingham GB2), Heat sink.
  35. Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA), Heat sink.
  36. Getz, Jr., George; Burkett, Thomas W., Heat sink made from longer and shorter graphite sheets.
  37. Dessiatoun,Serguei Vassilievich; Ivakhnenko,Igor, Heat transfer.
  38. Weber, Richard M.; Rummel, Kerrin A.; Payton, Albert P., Heat-conducting device for circuit board.
  39. Arnold Judson V. (Bedford TX) Peoples James R. (Burleson TX) McKague Elbert L. (Fort Worth TX), High heat density transfer device.
  40. Arnold Judson V. ; Peoples James R. ; McKague Elbert L., High heat density transfer device.
  41. Giannatto Carl J. ; Cornish Kevin C., Housing for diverse cooling configuration printed circuit cards.
  42. Rudy ; Jr. William J. (Annville PA) Shaffer Howard R. (Millersburg PA) Stahl Daniel E. (Hummelstown PA), Integral shell for tandem circuit card connectors.
  43. Habing Robert D. ; Odegard Thomas Allan, Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module.
  44. Cline Jay D. (Fort Lauderdale FL), Lightning diverter strip.
  45. Covey James H. (Snohomish WA), Lightning protection of fasteners in composite material.
  46. Tracewell,Matthew S.; Chen,Gary G., Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology.
  47. Hartung,David, Method for electronics equipment cooling having improved EMI control and reduced weight.
  48. Rodriguez ; II Noe E. (Arnold MD) Flaherty ; Jr. William T. (Columbia MD) Duggan Sharon A. (Washington DC) Fertig Timothy M. (Pasadena MD), Method of making for RF line replacable modules.
  49. Barth, Michael K.; Ham, Charles G.; Tennis, Gene; Kusz, Matthew; Sjodin, Chad J.; Ferris, Matthew; Petersen, Cyle D., Methods and systems of heat transfer for electronic enclosures.
  50. Harris Michael P. (San Diego CA), Modular segment adapted to provide a passively cooled housing for heat generating electronic modules.
  51. Mori, Fumio, Mounting structure of semiconductor device.
  52. Zurek Michael W., Multiple integrated service unit for communication system.
  53. Thompson,G. Alan; Anderson,Theresa M; Marx,David E., Process for deposition of metal on a surface.
  54. Arnold Judson V. ; Peoples James R. ; McKague Elbert L., Process for manufacturing a high heat density transfer device.
  55. Hayes William P. (Santa Ana CA) Dreher John P. (Mura Loma CA), Retainer assembly.
  56. Lo Ching P., Reworkable circuit board assembly including a reworkable flip chip.
  57. Yen, Heng-Chih; Sun, Chen-Tung, Server apparatus.
  58. Martorana Richard T. (Andover MA) Heimann Thomas D. (Methuen MA) Bimshas John (Winchester MA), Solid state directional thermal cable.
  59. Grip, Robert E.; Rawdon, Blaine K.; Jalewalia, Gurpreet S., Structurally isolated thermal interface.
  60. Newman William A. (Salt Lake City UT), Temperature maintained battery system.
  61. W. Scott Bonneville ; Roger A. Stonier, Thermal harness using encased carbon-based fiber and end attachment brackets.
  62. Bonneville W. Scott, Thermal harness using thermal conductive fiber and polymer matrix material.
  63. Zhang,Yuegang; Garner,C. Michael; Berlin,Andrew A.; Rao,Valluri; White,Bryan M.; Koning,Paul A., Thermal interface apparatus, systems, and methods.
  64. Greinke, Ronald A.; Krassowski, Daniel W., Thermal interface material.
  65. Rudy ; Jr. William J. (Annville PA) Shaffer Howard R. (Millersburg PA) Stahl Daniel E. (Hummelstown PA), Thermal junction for card edges in a card cage and ground clip therefor.
  66. Barson,George F.; Weber,Richard M.; Haws,James L., Thermal management system and method for electronic equipment mounted on coldplates.
  67. Thorson,Kevin J.; Drexler,Gregory M.; Stevens,Rick C.; Sutterfield,Brian D., Thermally conductive shelf.
  68. Kobayashi Takashi,JPX, Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus.
  69. Hsieh,George, Using the wave soldering process to attach motherboard chipset heat sinks.

이 특허를 인용한 특허 (7)

  1. Nichols, Robert Paul, Guide system for a card module.
  2. Cooper, Frank G.; Hoffman, Eric J., Mechanical arrangement for use within galvanically-isolated, low-profile micro-inverters for solar power installations.
  3. Cooney, Robert C.; Solanki, Jitendra J., Molded card guide chassis.
  4. Kehret, William E.; Smith, Dennis Henry, Printed circuit board module enclosure and apparatus using same.
  5. de Bock, Hendrik Pieter Jacobus; Gross, Jr., William Earl; Whalen, Bryan Patrick; Meier, Robert Paul, Systems and methods for dissipating heat in an enclosure.
  6. de Bock, Hendrik Pieter Jacobus; Gross, Jr., William Earl; Whalen, Bryan Patrick; Meier, Robert Paul, Systems and methods for dissipating heat in an enclosure.
  7. Urban, Bradley David; Hulick, Troy; Doblack, Shelomon Patrick; Olson, Robert; Chua, Albert John Yu Sam; Jones, Daniel; Cybart, Adam Kenneth; Soni, Gaurav; Carter-Giannini, William James; Seflic, Matthew Michael, Unibody thermal enclosure.
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