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High speed flat lapping platen 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-027/00
출원번호 US-0217565 (2008-07-07)
등록번호 US8062098 (2011-11-07)
발명자 / 주소
  • Duescher, Wayne O.
대리인 / 주소
    Mark A. Litman & Associates, PA
인용정보 피인용 횟수 : 24  인용 특허 : 138

초록

A rotatable abrasive lapper machine platen assembly is attached to a lapper machine frame. The assembly has at least:a) a circular-shaped rotatable horizontal platen havingi) a front surface andii) a back surface;b) the circular platen having a platen radius, a platen outer circumference and a plate

대표청구항

What is claimed: 1. A rotatable abrasive lapper machine platen assembly attached to a lapper machine frame, the assembly comprising:a) a circular-shaped rotatable horizontal platen havingi) a front surface andii) a back surface;b) the circular platen having a platen radius, a platen outer circumfere

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